Apparatus and method of testing semiconductor module

Abstract

There are provided an apparatus and a method of testing a semiconductor module capable of easily testing a power semiconductor module including a plurality of switching devices. The apparatus for testing a semiconductor module includes: a main substrate disposed within a case; a jig substrate detachably coupled to the main substrate; and a socket substrate detachably coupled to the jig substrate and having the semiconductor module mounted thereon.

What is claimed is: 
     
         1 . An apparatus for testing a semiconductor module comprising:
 a main substrate disposed within a case;   a jig substrate detachably coupled to the main substrate; and   a socket substrate detachably coupled to the jig substrate and having the semiconductor module mounted thereon.   
     
     
         2 . The apparatus for testing a semiconductor module of  claim 1 , wherein the main substrate and the jig substrate are electrically and physically coupled to each other by connector coupling. 
     
     
         3 . The apparatus for testing a semiconductor module of  claim 1 , wherein the jig substrate and the socket substrate are electrically and physically coupled to each other by connector coupling. 
     
     
         4 . The apparatus for testing a semiconductor module of  claim 1 , wherein the semiconductor module is soldered to and mounted on the socket substrate by a conductive solder. 
     
     
         5 . The apparatus for testing a semiconductor module of  claim 1 , wherein the jig substrate is coupled to the main substrate so as to be perpendicular to the main substrate. 
     
     
         6 . The apparatus for testing a semiconductor module of  claim 1 , further comprising a cooling part disposed within the case and cooling the semiconductor module. 
     
     
         7 . The apparatus for testing a semiconductor module of  claim 1 , further comprising a temperature measuring part coupled to the semiconductor module and sensing a temperature change in the semiconductor module. 
     
     
         8 . The apparatus for testing a semiconductor module of  claim 7 , further comprising a controlling part electrically connected to the main substrate and the temperature measuring part, selectively applying power to the semiconductor module through the main substrate, and measuring the temperature change of the semiconductor module through the temperature measuring part. 
     
     
         9 . The apparatus for testing a semiconductor module of  claim 7 , wherein the temperature measuring part includes:
 a fixing jig coupled to an outer surface of the semiconductor module while contacting the outer surface of the semiconductor module; and   at least one temperature sensor coupled to the fixing jig and sensing a temperature of the semiconductor module.   
     
     
         10 . The apparatus for testing a semiconductor module of  claim 9 , wherein the fixing jig has an insertion groove formed in one surface thereof contacting the semiconductor module, and the temperature sensor is inserted into the insertion groove to contact the outer surface of the semiconductor module. 
     
     
         11 . The apparatus for testing a semiconductor module of  claim 9 , wherein the semiconductor module includes a plurality of switching devices, and a plurality of temperature sensors are disposed in positions corresponding to those of the switching devices, respectively. 
     
     
         12 . The apparatus for testing a semiconductor module of  claim 9 , wherein the semiconductor module includes six switching devices, and three temperature sensors are disposed in positions corresponding to spaces between the switching devices. 
     
     
         13 . A method of testing a semiconductor module comprising:
 mounting a semiconductor module on a socket substrate;   coupling the socket substrate to a jig substrate;   coupling the jig substrate to a main substrate disposed within a case; and   testing the semiconductor module by applying a voltage to the semiconductor module.   
     
     
         14 . The method of testing a semiconductor module of  claim 13 , wherein the coupling of the jig substrate to the main substrate includes coupling the jig substrate to the main substrate so as to be perpendicular to the main substrate. 
     
     
         15 . The method of testing a semiconductor module of  claim 13 , further comprising, before the mounting of the semiconductor module on the socket substrate, coupling a temperature measuring part to the semiconductor module. 
     
     
         16 . The method of testing a semiconductor module of  claim 15 , wherein the testing of the semiconductor module includes measuring a change of state in the semiconductor module according to a change in the applied voltage. 
     
     
         17 . The method of testing a semiconductor module of  claim 15 , wherein the testing of the semiconductor module includes:
 estimating surface temperatures corresponding to junction temperatures of switching devices provided in the semiconductor module; and   applying the voltage to the semiconductor module based on the estimated surface temperatures.   
     
     
         18 . The method of testing a semiconductor module of  claim 17 , wherein the estimating of the surface temperatures includes:
 measuring temperatures using a plurality of temperature sensors disposed in the semiconductor module so as to be spaced apart from each other; and   estimating the surface temperatures of the semiconductor modules using an average value of the measured temperature values.