Inventor · disambiguated record
Jin Hyuk Lee
Also filed as: LEE JIN · LEE JIN-HYUK
24 granted patents·12 pending applications·180 citations·filing 1995–2024
95Inventor score
Files withSAMSUNG ELECTRONICS CO LTD16LEE JIN HYUK6LG ELECTRONICS INC3KONOLABS INC2AGENCY DEFENSE DEV1
Top patents by PatentIndex Score
36 records- 0184US8341338B2Data storage device and related method of operationLEE JIN-HYUK·Filed 2010·Granted Dec 25, 2012·12 cites·23 claims
- 0282US7670976B2High strain-point glass composition for substrateKCC CORP·Filed 2006·Granted Mar 2, 2010·10 cites·8 claims
- 0381US8612836B2Non-volatile memory device with uncorrectable information region and operation method using the sameYOON HAN BIN·Filed 2011·Granted Dec 17, 2013·7 cites·27 claims
- 0479US10803158B2Variable biometric information-based authentication system and authentication method using the sameLEE JIN HYUK·Filed 2017·Granted Oct 13, 2020·3 cites·9 claims
- 0579US10693969B2Electronic device using logical channels for communicationSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 23, 2020·4 cites·16 claims
- 0676US10150689B2Apparatus for fabricating materialsLG ELECTRONICS INC·Filed 2017·Granted Dec 11, 2018·1 cites·15 claims
- 0776US7196000B2Method for manufacturing a wafer level chip scale packageSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Mar 27, 2007·20 cites·12 claims
- 0873US9504138B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 22, 2016·2 cites·19 claims
- 0973US6721831B1Method for controlling bus in digital interfaceLG ELECTRONICS INC·Filed 2000·Granted Apr 13, 2004·21 cites·12 claims
- 1071US6812578B2Semiconductor device bonding pad resistant to stress and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 2, 2004·18 cites·15 claims
- 1168US8551899B2Dark neutral green gray soda-lime glass compositionKIM YONG YI·Filed 2010·Granted Oct 8, 2013·4 cites·4 claims
- 1268US6671784B2System and method for arbitrating access to a memoryLG ELECTRONICS INC·Filed 2001·Granted Dec 30, 2003·14 cites·28 claims
- 1367US6791196B2Semiconductor devices with bonding pads having intermetal dielectric layer of hybrid configuration and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Sep 14, 2004·15 cites·45 claims
- 1466US2025321362A1Cover window, display device comprising the cover window, and method of manufacturing a cover windowSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 1561US5808354ALead frame for a semiconductor device comprising inner leads having a locking means for preventing the movement of molding compound against the inner lead surfaceSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Sep 15, 1998·31 cites·5 claims
- 1656US9620875B2Memory cardSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Apr 11, 2017·1 cites·14 claims
- 1752US12030965B2Modified conjugated diene based polymer, manufacturing method thereof, binder composition for solid propellant comprising the same, modified conjugated diene based binder for solid propellant, and manufacturing method thereofAGENCY DEFENSE DEV·Filed 2022·Granted Jul 9, 2024·0 cites·11 claims
- 1852US6709964B2Semiconductor device and manufacturing method using a stress-relieving film attached to solder jointsSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Mar 23, 2004·4 cites·12 claims
- 1952US2018174191A1Method, system and non-transitory computer-readable recording medium for providing schedule-related advertisementsKONOLABS INC·Filed 2017·Application pending·0 cites
- 2051US7247936B2Tape circuit substrate having wavy beam leads and semiconductor chip package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 24, 2007·4 cites·39 claims
- 2151US6906373B2Power dividerHYNIX SEMICONDUCTOR INC·Filed 2002·Granted Jun 14, 2005·5 cites·12 claims
- 2249US2007132108A1Method for manufacturing a wafer level chip scale packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2349US2019333117A1Method for donating content and purchasing donated content using social network serviceLEE JIN HYUK·Filed 2017·Application pending·0 cites
- 2448US9451100B2Method for transmitting notification information and electronic device thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 20, 2016·0 cites·22 claims
- 2548US6717272B2Reinforced bond-pad substructure and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 6, 2004·4 cites·25 claims
- 2648US2014351832A1Electronic device using framework interface for communicationSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2746US10366646B2Devices including first and second buffers, and methods of operating devices including first and second buffersCHO KYUNG SANG·Filed 2015·Granted Jul 30, 2019·0 cites·15 claims
- 2846US2014351446A1Electronic device using logical channels for communicationSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 2946US2014223084A1Memory system and related method of operationSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 3044US10528634B2Method and apparatus for variable social network serviceLEE JIN HYUK·Filed 2015·Granted Jan 7, 2020·0 cites·10 claims
- 3144US2013173954A1Method of managing bad storage region of memory device and storage device using the methodSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 3243US2009022850A1Acid tolerant leuconostoc mesenteroides with excellent mannitol productivity and method for producing a kimchi using the sameDAESANG FNF CORP·Filed 2005·Application pending·0 cites
- 3343US2021347465A1Wireless power transformation for rotating propellersHAMILTON SUNDSTRAND CORP·Filed 2021·Application pending·0 cites
- 3438US10769257B2Variable biometric information-based complex authentication system and complex authentication method using the sameLEE JIN HYUK·Filed 2017·Granted Sep 8, 2020·0 cites·9 claims
- 3538US2013071660A1Composition For Preparing Ceramic Fiber And A Biosoluble Ceramic Fiber Prepared Therefrom For Heat Insulating Material At High TemperatureLEE JIN HYUK·Filed 2010·Application pending·0 cites
- 3636US2018174108A1Method, system and non-transitory computer-readable recording medium for providing predictions on calendarKONOLABS INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →