Inventor · disambiguated record
Takatoyo Yamakami
Also filed as: YAMAKAMI TAKATOYO
17 granted patents·13 pending applications·182 citations·filing 2000–2017
94Inventor score
Top patents by PatentIndex Score
30 records- 0186US6437450B1Method of mounting semiconductor chipFUJITSU LTD·Filed 2000·Granted Aug 20, 2002·38 cites·4 claims
- 0285US8720519B2Electronic packaging apparatus and electronic packaging methodYAMAKAMI TAKATOYO·Filed 2011·Granted May 13, 2014·9 cites·7 claims
- 0385US6885522B1Head assembly having integrated circuit chip covered by layer which prevents foreign particle generationFUJITSU LTD·Filed 2000·Granted Apr 26, 2005·17 cites·12 claims
- 0484US7347347B2Head assembly, disk unit, and bonding method and apparatusFUJITSU LTD·Filed 2004·Granted Mar 25, 2008·15 cites·11 claims
- 0583US8418910B2Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor deviceYAMAKAMI TAKATOYO·Filed 2012·Granted Apr 16, 2013·8 cites·10 claims
- 0678US7540428B2RFID tag, RFID-tag antenna, RFID-tag antenna sheet, and method of manufacturing RFID tagFUJITSU LTD·Filed 2004·Granted Jun 2, 2009·23 cites·11 claims
- 0777US9615464B2Method of mounting semiconductor element, and semiconductor deviceFUJITSU LTD·Filed 2013·Granted Apr 4, 2017·4 cites·12 claims
- 0876US7133733B2Design support systemFUJITSU LTD·Filed 2004·Granted Nov 7, 2006·15 cites·28 claims
- 0972US8861903B2Method of manufacturing optical waveguide device and optical waveguide deviceFUJITSU LTD·Filed 2012·Granted Oct 14, 2014·1 cites·15 claims
- 1072US7363704B2RFID tag and method of manufacturing RFID tagFUJITSU LTD·Filed 2004·Granted Apr 29, 2008·17 cites·8 claims
- 1170US7196512B2Magnetic head testerFUJITSU LTD·Filed 2003·Granted Mar 27, 2007·8 cites·11 claims
- 1267US6716665B2Method of mounting chip onto printed circuit board in shortened working timeFUJITSU LTD·Filed 2001·Granted Apr 6, 2004·13 cites·17 claims
- 1366US6770319B2Resin coating methodFUJITSU LTD·Filed 2001·Granted Aug 3, 2004·7 cites·12 claims
- 1460US7699235B2RFID tag, RFID-tag antenna, RFID-tag antenna sheet, and method of manufacturing RFID tagFUJITSU LTD·Filed 2008·Granted Apr 20, 2010·1 cites·18 claims
- 1558US7394163B2Method of mounting semiconductor chipFUJITSU LTD·Filed 2002·Granted Jul 1, 2008·6 cites·2 claims
- 1656US2005196703A1Resin coating method and apparatusFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1753US9195003B2Optical unit in which optical element is mounted on base having optical wave guide and method of manufacturing the sameFUJITSU LTD·Filed 2013·Granted Nov 24, 2015·0 cites·13 claims
- 1851US2005196704A1Resin coating method and apparatusFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1951US2005196529A1Resin coating method and apparatusFUJITSU LTD·Filed 2005·Application pending·0 cites
- 2050US2004213894A1Resin coating method and apparatusFUJITSU LTD·Filed 2004·Application pending·0 cites
- 2147US9266312B2Bonding apparatus and bonding methodFUJITSU LTD·Filed 2014·Granted Feb 23, 2016·0 cites·9 claims
- 2246US2013140069A1Conductive bonding material, electronic component, and electronic deviceFUJITSU LTD·Filed 2012·Application pending·0 cites
- 2342US2013313309A1Conductive bonding material, method of manufacturing the same, and method of manufacturing electronic deviceFUJITSU LTD·Filed 2013·Application pending·0 cites
- 2441US2013088839A1Board module manufacturing method, board module, and board module assemblyFUJITSU LTD·Filed 2012·Application pending·0 cites
- 2540US2013087605A1Conductive bonding material, conductor bonding method, and semiconductor device production methodKUBOTA TAKASHI·Filed 2012·Application pending·0 cites
- 2639US2012248616A1Electronic component, electronic equipment, and soldering pasteKITAJIMA MASAYUKI·Filed 2012·Application pending·0 cites
- 2738US2011074020A1Semiconductor device and method for mounting semiconductor deviceFUJITSU LTD·Filed 2010·Application pending·0 cites
- 2838US2017357063A1Optical module and optical module manufacturing methodFUJITSU LTD·Filed 2017·Application pending·0 cites
- 2936US2016372441A1Semiconductor device and manufacturing method of semiconductor deviceFUJITSU LTD·Filed 2016·Application pending·0 cites
- 3035US2017020000A1Component-mounted board, method of manufacturing component-mounted board and component-embedded boardFUJITSU LTD·Filed 2016·Application pending·0 cites
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