Inventor · disambiguated record
Virgil Ararao
Also filed as: ARARAO VIRGIL · ARARAO VIRGIL C · ARARAO VIRGIL COTOCO
28 granted patents·8 pending applications·506 citations·filing 2002–2021
97Inventor score
Files withST ASSEMBLY TEST SERVICES LTD10TEXAS INSTRUMENTS INC10ALLEGRO MICROSYSTEMS LLC4SHARMA NIRMAL3ARARAO VIRGIL2
Top patents by PatentIndex Score
36 records- 0198US7361531B2Methods and apparatus for Flip-Chip-On-Lead semiconductor packageALLEGRO MICROSYSTEMS INC·Filed 2005·Granted Apr 22, 2008·86 cites·19 claims
- 0294US8461677B2Magnetic field sensors and methods for fabricating the magnetic field sensorsARARAO VIRGIL·Filed 2011·Granted Jun 11, 2013·33 cites·10 claims
- 0393US8486755B2Magnetic field sensors and methods for fabricating the magnetic field sensorsARARAO VIRGIL·Filed 2008·Granted Jul 16, 2013·33 cites·10 claims
- 0493US6775140B2Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devicesST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Aug 10, 2004·79 cites·24 claims
- 0591US10427932B2Hermetically sealed MEMS device and its fabricationTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 1, 2019·6 cites·6 claims
- 0691US9228860B2Sensor and method of providing a sensorSHARMA NIRMAL·Filed 2011·Granted Jan 5, 2016·35 cites·9 claims
- 0786US8691607B2Hermetically sealed MEMS device and method of fabricationTEXAS INSTRUMENTS INC·Filed 2012·Granted Apr 8, 2014·8 cites·32 claims
- 0885US9567213B1Hermetically-sealed MEMS device and its fabricationTEXAS INSTRUMENTS INC·Filed 2015·Granted Feb 14, 2017·4 cites·9 claims
- 0984US6875634B2Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the sameST ASSEMBLY TEST SERVICES PTE·Filed 2004·Granted Apr 5, 2005·36 cites·21 claims
- 1083US6960493B2Semiconductor device packageST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Nov 1, 2005·30 cites·16 claims
- 1182US7242101B2Integrated circuit die with pedestalST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Jul 10, 2007·27 cites·44 claims
- 1280US6825067B2Mold cap anchoring method for molded flex BGA packagesST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted Nov 30, 2004·26 cites·20 claims
- 1380US6737298B2Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the sameST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted May 18, 2004·31 cites·18 claims
- 1475US7153725B2Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods thereforST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Dec 26, 2006·21 cites·20 claims
- 1574US9140898B2Hermetically sealed MEMS device and its fabricationTEXAS INSTRUMENTS INC·Filed 2013·Granted Sep 22, 2015·4 cites·21 claims
- 1670US10392246B2Through-substrate conductor supportTEXAS INSTRUMENTS INC·Filed 2017·Granted Aug 27, 2019·1 cites·6 claims
- 1768US8207598B2Semiconductor package heat spreaderARARAO VIRGIL COTOCO·Filed 2009·Granted Jun 26, 2012·4 cites·10 claims
- 1868US7575956B2Fabrication method for semiconductor package heat spreadersST ASSEMBLY TEST SERVICES LTD·Filed 2003·Granted Aug 18, 2009·12 cites·20 claims
- 1966US2021323816A1Through-substrate conductor supportTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
- 2065US7786593B2Integrated circuit die with pedestalST ASSEMBLY TEST SERVICES LTD·Filed 2007·Granted Aug 31, 2010·2 cites·20 claims
- 2165US2020355525A1Methods and apparatus for passive attachment of components for integrated circuitsALLEGRO MICROSYSTEMS LLC·Filed 2020·Application pending·0 cites
- 2264US7381593B2Method and apparatus for stacked die packagingST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Jun 3, 2008·17 cites·10 claims
- 2363US9102511B2Hermetic plastic molded MEMS device package and method of fabricationTEXAS INSTRUMENTS INC·Filed 2013·Granted Aug 11, 2015·1 cites·13 claims
- 2462US11084717B2Through-substrate conductor supportTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 10, 2021·0 cites·10 claims
- 2554US9890036B2Hermetically sealed MEMS device and its fabricationTEXAS INSTRUMENTS INC·Filed 2017·Granted Feb 13, 2018·0 cites·9 claims
- 2653US10693020B2Semiconductor device package and method for use thereofTT ELECTRONICS PLC·Filed 2018·Granted Jun 23, 2020·0 cites·23 claims
- 2753US7863730B2Array-molded package heat spreader and fabrication method thereforST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Jan 4, 2011·5 cites·20 claims
- 2853US7327025B2Heat spreader for thermally enhanced semiconductor packageST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Feb 5, 2008·5 cites·19 claims
- 2953US2013264667A1Magnetic Field Sensors and Methods for Fabricating the Magnetic Field SensorsALLEGRO MICROSYSTEMS LLC·Filed 2013·Application pending·0 cites
- 3053US2013267043A1Magnetic Field Sensors and Methods for Fabricating the Magnetic Field SensorsALLEGRO MICROSYSTEMS LLC·Filed 2013·Application pending·0 cites
- 3151US8785250B2Methods and apparatus for flip-chip-on-lead semiconductor packageSHARMA NIRMAL·Filed 2008·Granted Jul 22, 2014·0 cites·16 claims
- 3250US9227836B2Hermetic plastic molded MEMS device package and method of fabricationTEXAS INSTRUMENTS INC·Filed 2015·Granted Jan 5, 2016·0 cites·4 claims
- 3349US2015285874A1Methods and Apparatus for Passive Attachment of Components for Integrated CircuitsALLEGRO MICROSYSTEMS LLC·Filed 2015·Application pending·0 cites
- 3448US2020166382A1Optical encoder system with shaped light sourceTT ELECTRONICS PLC·Filed 2019·Application pending·0 cites
- 3546US2008013298A1Methods and apparatus for passive attachment of components for integrated circuitsSHARMA NIRMAL·Filed 2006·Application pending·0 cites
- 3636US2005194698A1Integrated circuit package with keep-out zone overlapping undercut zoneST ASSEMBLY TEST SERVICE LTD·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →