Methods and Apparatus for Passive Attachment of Components for Integrated Circuits

Abstract

Methods and apparatus for a sensor having a die supporting a magnetic field sensor element, a leadframe having opposed first and second surfaces and leadfingers, a passive component coupled to the first and second ones of the leadfingers such that the component is an integrated part of an IC package, and a magnet adjacent to the second surface of leadframe to back bias the magnetic field sensor element.

What is claimed is:  
     
         1 . A sensor, comprising:
 a die supporting a magnetic field sensor element;   a leadframe having opposed first and second surfaces and leadfingers, the leadframe supporting the die on the first surface, wherein at least first and second ones of the leadfingers are electrically isolated from each other and are configured to provide electrical connections to the leadframe and to the die;   a passive component coupled to the first and second ones of the leadfingers such that the component is an integrated part of an IC package; and   a magnet adjacent to the second surface of leadframe to back bias the magnetic field sensor element.   
     
     
         2 . The sensor according to  claim 1 , wherein the leadframe includes a continuous first portion on which the die is supported, wherein the first one of the leadfingers extends from the first portion. 
     
     
         3 . The sensor according to  claim 2 , further including a connection means for connecting the die to the second one of the leadfingers. 
     
     
         4 . The sensor according to  claim 3 , wherein the connection means comprises a wirebond. 
     
     
         5 . The sensor according go  claim 1 , wherein the first leadfinger includes a downset area at which the passive component is coupled. 
     
     
         6 . The sensor according to  claim 5 , wherein a thickness of the first leadfinger in the downset area is less than a thickness of the first leadfinger in a non-downset area adjacent to the downset area. 
     
     
         7 . The sensor according to  claim 1 , wherein the lead fingers are angled about ninety degrees with respect to the leadframe. 
     
     
         8 . The sensor according to  claim 1 , wherein the leadframe has a cutout region in which the passive component is positioned. 
     
     
         9 . The sensor according to  claim 1 , wherein the passive component includes a capacitor. 
     
     
         10 . The sensor according to  claim 1 , wherein the leadframe includes at least one slot to reduce eddy currents. 
     
     
         11 . The sensor according to  claim 1 , wherein the magnetic field sensor element includes one or more of a Hall element. 
     
     
         12 . The sensor according to  claim 1 , wherein the magnetic field sensor element includes an AMR element. 
     
     
         13 . The sensor according to  claim 1 , wherein the magnetic field sensor element includes a TMR element. 
     
     
         14 . The sensor according to  claim 1 , wherein the magnetic field sensor element includes a CMR element. 
     
     
         15 . The sensor according to  claim 1 , wherein the magnetic field sensor element includes a GMR element. 
     
     
         16 . The sensor according to  claim 1 , wherein the sensor has a flip-chip configuration. 
     
     
         17 . The sensor according to  claim 1 , wherein the sensor is configured to minimize a distance between the magnetic field sensor element and an object of interest. 
     
     
         18 . A method, comprising:
 employing a die supporting a magnetic field sensor element;   employing a leadframe having opposed first and second surfaces and leadfingers, the leadframe supporting the die on the first surface, wherein at least first and second ones of the leadfingers are electrically isolated from each other and are configured to provide electrical connections to the leadframe and to the die;   employing a passive component coupled to the first and second ones of the leadfingers such that the component is an integrated part of an IC package; and   employing a magnet adjacent to the second surface of leadframe to back bias the magnetic field sensor element.   
     
     
         19 . The method according to  claim 18 , wherein the leadframe includes a continuous first portion on which the die is supported, wherein the first one of the leadfingers extends from the first portion. 
     
     
         20 . The method according go  claim 18 , wherein the first leadfinger includes a downset area at which the passive component is coupled, wherein a thickness of the first leadfinger in the downset area is less than a thickness of the first leadfinger in a non-downset area adjacent to the downset area. 
     
     
         21 . The method according to  claim 18 , wherein the leadframe has a cutout region in which the passive component is positioned. 
     
     
         22 . The method according to  claim 18 , wherein the magnetic field sensor element includes one or more of a Hall element, AMR element, TMR element, CMR element, or GMR element. 
     
     
         23 . The method according to  claim 18 , wherein the sensor has a flip-chip configuration. 
     
     
         24 . The method according to  claim 18 , wherein the sensor is configured to minimize a distance between the magnetic field sensor element and an object of interest.