Methods and apparatus for passive attachment of components for integrated circuits

Abstract

Methods and apparatus for sensor including a die, a leadframe having opposed first and second surfaces, the leadframe supporting the die on the first surface, lead fingers to provide electrical connections to the leadframe and to the die; and a component electrically coupled to the leadframe and to a first one of the lead fingers such that the component is an integrated part of the IC package. The leadframe may have a cutout region in which the component is positioned.

What is claimed is: 
     
         1 . A sensor, comprising:
 a die;   a leadframe having opposed first and second surfaces, the leadframe supporting the die on the first surface;   lead fingers to provide electrical connections to the leadframe and to the die; and   a component electrically coupled to the leadframe and to a first one of the lead fingers such that the component is an integrated part of a sensor IC package,   wherein the leadframe has a cutout region in which the component is positioned.   
     
     
         2 . The sensor according to  claim 1 , further including a tape layer, wherein the component is placed on the tape layer. 
     
     
         3 . The sensor according to  claim 2 , wherein at least a portion of the leadframe is secured to the tape layer. 
     
     
         4 . The sensor according to  claim 3 , wherein a bottom surface of the component is below the second surface of the leadframe. 
     
     
         5 . The sensor according to  claim 3 , wherein a bottom surface of the component is aligned with the second surface of the leadframe. 
     
     
         6 . The sensor according to  claim 1 , wherein the sensor comprises a magnetic sensor. 
     
     
         7 . The sensor according to  claim 6 , wherein the component includes a capacitor. 
     
     
         8 . The sensor according to  claim 6 , wherein the magnetic sensor includes a Hall element. 
     
     
         9 . The sensor according to  claim 6 , wherein the magnetic sensor includes one or more of a Hall element, an AMR element, and/or a GMR element. 
     
     
         10 . The sensor according to  claim 6 , wherein the leadframe includes at least one slot to reduce eddy currents. 
     
     
         11 . The sensor according to  claim 10 , wherein the magnetic sensor is aligned with the at least one slot. 
     
     
         12 . The sensor according to  claim 11 , wherein the at least one slot includes first, second and third slots, wherein the first slot is aligned with the magnetic sensor and the second and third slots are symmetrical with respect to the magnetic sensor. 
     
     
         13 . The sensor according to  claim 6 , wherein the sensor is configured to minimize a distance between the magnetic sensor and an object of interest. 
     
     
         14 . A method, comprising:
 employing a die;   employing a leadframe having opposed first and second surfaces, the leadframe supporting the die on the first surface;   employing lead fingers to provide electrical connections to the leadframe and to the die; and   employing a component electrically coupled to the leadframe and to a first one of the lead fingers such that the component is an integrated part of a sensor IC package,   wherein the leadframe has a cutout region in which the component is positioned.   
     
     
         15 . The method according to  claim 14 , further including employing a tape layer, wherein the component is placed on the tape layer. 
     
     
         16 . The method according to  claim 15 , wherein at least a portion of the leadframe is secured to the tape layer. 
     
     
         17 . The method according to  claim 16 , wherein a bottom surface of the component is below the second surface of the leadframe. 
     
     
         18 . The method according to  claim 16 , wherein a bottom surface of the component is aligned with the second surface of the leadframe. 
     
     
         19 . The method according to  claim 14 , wherein the sensor comprises a magnetic sensor. 
     
     
         20 . The method according to  claim 19 , wherein the component includes a capacitor. 
     
     
         21 . The method according to  claim 19 , wherein the magnetic sensor includes a Hall element. 
     
     
         22 . The method according to  claim 19 , wherein the magnetic sensor includes one or more of a Hall element, an AMR element, and/or a GMR element. 
     
     
         23 . The method according to  claim 19 , wherein the leadframe includes at least one slot to reduce eddy currents. 
     
     
         24 . The method according to  claim 23 , wherein the magnetic sensor is aligned with the at least one slot. 
     
     
         25 . The method according to  claim 24 , wherein the at least one slot includes first, second and third slots, wherein the first slot is aligned with the magnetic sensor and the second and third slots are symmetrical with respect to the magnetic sensor. 
     
     
         26 . The method according to  claim 19 , wherein the sensor is configured to minimize a distance between the magnetic sensor and an object of interest. 
     
     
         27 . A sensor, comprising:
 a die;   a leadframe means for supporting the die;   lead finger means for providing electrical connections to the leadframe means and to the die; and   a component means for electrically coupling to the leadframe and to a first one of the lead fingers such that the component means is part of an integrated part of a sensor IC package,   wherein the leadframe means includes a cutout region in which the component means is positioned.   
     
     
         28 . The sensor according to  claim 27 , further including a tape means for securing the component means. 
     
     
         29 . The sensor according to  claim 28 , wherein at least a portion of the leadframe means is secured to the tape means. 
     
     
         30 . The sensor according to  claim 17 , further including sensing means for sensing a magnetic field, wherein the leadframe means includes at least one slot means for reducing eddy currents, wherein the sensing means is aligned with the at least one slot means.