Inventor · disambiguated record
Xusheng Bao
Also filed as: BAO XUSHENG
20 granted patents·2 pending applications·375 citations·filing 2008–2025
94Inventor score
Top patents by PatentIndex Score
22 records- 0198US8796846B2Semiconductor device with a vertical interconnect structure for 3-D FO-WLCSPLIN YAOJIAN·Filed 2009·Granted Aug 5, 2014·108 cites·32 claims
- 0298US7642128B1Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSPSTATS CHIPPAC LTD·Filed 2008·Granted Jan 5, 2010·144 cites·20 claims
- 0394US9252172B2Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity regionCHOW SENG GUAN·Filed 2011·Granted Feb 2, 2016·34 cites·18 claims
- 0493US8409926B2Semiconductor device and method of forming insulating layer around semiconductor dieLIN YAOJIAN·Filed 2010·Granted Apr 2, 2013·12 cites·24 claims
- 0592US9293401B2Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP)STATS CHIPPAC LTD·Filed 2013·Granted Mar 22, 2016·11 cites·22 claims
- 0689US7989356B2Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliabilitySTATS CHIPPAC LTD·Filed 2009·Granted Aug 2, 2011·18 cites·24 claims
- 0788US8963326B2Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migrationBAO XUSHENG·Filed 2011·Granted Feb 24, 2015·13 cites·24 claims
- 0885US9401331B2Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSPSTATS CHIPPAC LTD·Filed 2014·Granted Jul 26, 2016·5 cites·23 claims
- 0984US8421212B2Integrated circuit packaging system with active surface heat removal and method of manufacture thereofCHEN KANG·Filed 2010·Granted Apr 16, 2013·8 cites·18 claims
- 1082US8455991B2Integrated circuit packaging system with warpage control and method of manufacture thereofHSIAO YUNG KUAN·Filed 2010·Granted Jun 4, 2013·10 cites·14 claims
- 1166US8766426B2Integrated circuit packaging system with warpage control and method of manufacture thereofGOH HIN HWA·Filed 2010·Granted Jul 1, 2014·3 cites·18 claims
- 1264US9171769B2Semiconductor device and method of forming openings through encapsulant to reduce warpage and stress on semiconductor packageCHOW SENG GUAN·Filed 2010·Granted Oct 27, 2015·2 cites·21 claims
- 1363US9397058B2Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migrationSTATS CHIPPAC LTD·Filed 2014·Granted Jul 19, 2016·1 cites·25 claims
- 1460US9437552B2Semiconductor device and method of forming insulating layer around semiconductor dieSTATS CHIPPAC LTD·Filed 2014·Granted Sep 6, 2016·0 cites·17 claims
- 1559US8129845B2Semiconductor device and method of forming interconnect structure in non-active area of waferJANG TAEHOAN·Filed 2008·Granted Mar 6, 2012·5 cites·25 claims
- 1657US9142522B2Semiconductor device and method of forming RDL under bump for electrical connection to enclosed bumpBAO XUSHENG·Filed 2011·Granted Sep 22, 2015·1 cites·19 claims
- 1756US8878359B2Semiconductor device and method of forming insulating layer around semiconductor dieSTATS CHIPPAC LTD·Filed 2013·Granted Nov 4, 2014·0 cites·30 claims
- 1851US10622293B2Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP)JCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2016·Granted Apr 14, 2020·0 cites·25 claims
- 1951US2025206916A1Resin composition and application thereofHUAWEI TECH CO LTD·Filed 2025·Application pending·0 cites
- 2048US2025206942A1Resin composition and disclosure thereofHUAWEI TECH CO LTD·Filed 2025·Application pending·0 cites
- 2143US9236278B2Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereofHUANG RUI·Filed 2011·Granted Jan 12, 2016·0 cites·20 claims
- 2236US9478485B2Semiconductor device and method of stacking semiconductor die on a fan-out WLCSPSTATS CHIPPAC LTD·Filed 2014·Granted Oct 25, 2016·0 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →