Inventor · disambiguated record
Jaydeb Goswami
Also filed as: GOSWAMI JAYDEB
23 granted patents·8 pending applications·31 citations·filing 2004–2023
92Inventor score
Top patents by PatentIndex Score
31 records- 0191US9972628B1Conductive structures, wordlines and transistorsMICRON TECHNOLOGY INC·Filed 2016·Granted May 15, 2018·7 cites·19 claims
- 0284US8698173B2Solid state lighting devices with semi-polar facets and associated methods of manufacturingMICRON TECHNOLOGY INC·Filed 2013·Granted Apr 15, 2014·5 cites·15 claims
- 0375US8207582B2Semiconductor devices including dual gate structuresGOSWAMI JAYDEB·Filed 2009·Granted Jun 26, 2012·4 cites·15 claims
- 0471US10147727B2Conductive structures, wordlines and transistorsMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 4, 2018·1 cites·16 claims
- 0570US11825662B2Ferroelectric capacitor, a ferroelectric memory cell, an array of ferroelectric memory cells, and a method of forming a ferroelectric capacitorMICRON TECHNOLOGY INC·Filed 2021·Granted Nov 21, 2023·0 cites·36 claims
- 0670US8431923B2Semiconductor structure and semiconductor device including a diode structure and methods of forming sameGOSWAMI JAYDEB·Filed 2011·Granted Apr 30, 2013·3 cites·32 claims
- 0767US8530305B2Nanodot charge storage structures and methodsGOSWAMI JAYDEB·Filed 2010·Granted Sep 10, 2013·2 cites·24 claims
- 0862US7361596B2Semiconductor processing methodsMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 22, 2008·2 cites·7 claims
- 0959US11101274B2Ferroelectric capacitor, a ferroelectric memory cell, an array of ferroelectric memory cells, and a method of forming a ferroelectric capacitorMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 24, 2021·0 cites·16 claims
- 1059US2024074160A1Integration of memory array with peripheryMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1158US9142670B2Methods of forming dual gate structuresMICRON TECHNOLOGY INC·Filed 2014·Granted Sep 22, 2015·0 cites·20 claims
- 1254US9099472B2Semiconductor constructions, methods of forming conductive structures and methods of forming DRAM cellsMICRON TECHNOLOGY INC·Filed 2013·Granted Aug 4, 2015·0 cites·9 claims
- 1353US8846512B2Incorporating impurities using a maskMICRON TECHNOLOGY INC·Filed 2013·Granted Sep 30, 2014·0 cites·23 claims
- 1453US7863176B2Low-resistance interconnects and methods of making sameMICRON TECHNOLOGY INC·Filed 2008·Granted Jan 4, 2011·0 cites·14 claims
- 1552US8748273B2Semiconductor devices including dual gate structures and methods of fabricationGOSWAMI JAYDEB·Filed 2012·Granted Jun 10, 2014·0 cites·19 claims
- 1651US9397105B2Nanodot charge storage structuresMICRON TECHNOLOGY INC·Filed 2013·Granted Jul 19, 2016·0 cites·20 claims
- 1750US8592985B2Methods of forming conductive structures and methods of forming DRAM cellsGOSWAMI JAYDEB·Filed 2012·Granted Nov 26, 2013·0 cites·21 claims
- 1849US9202786B2Low-resistance interconnects and methods of making sameGOSWAMI JAYDEB·Filed 2010·Granted Dec 1, 2015·0 cites·7 claims
- 1949US8481414B2Incorporating impurities using a discontinuous maskGOSWAMI JAYDEB·Filed 2011·Granted Jul 9, 2013·0 cites·28 claims
- 2049US8372671B2Solid state devices with semi-polar facets and associated methods of manufacturingMICRON TECHNOLOGY INC·Filed 2010·Granted Feb 12, 2013·0 cites·13 claims
- 2149US7622388B2Methods of forming titanium-containing materialsMICRON TECHNOLOGY INC·Filed 2008·Granted Nov 24, 2009·0 cites·15 claims
- 2249US7344982B2System and method of selectively depositing Ruthenium films by digital chemical vapor depositionUNIV ARIZONA STATE·Filed 2004·Granted Mar 18, 2008·3 cites·19 claims
- 2349US2016118340A1Low-Resistance Interconnects and Methods of Making SameMICRON TECHNOLOGY INC·Filed 2015·Application pending·0 cites
- 2449US2014117302A1Phase Change Memory Cells, Methods Of Forming Phase Change Memory Cells, And Methods Of Forming Heater Material For Phase Change Memory CellsMICRON TECHNOLOGY INC·Filed 2012·Application pending·0 cites
- 2548US11011378B2Atom implantation for reduction of compressive stressMICRON TECHNOLOGY INC·Filed 2019·Granted May 18, 2021·0 cites·8 claims
- 2648US7510942B2Molecular modifications of metal/dielectric interfacesUNIV ARIZONA STATE·Filed 2004·Granted Mar 31, 2009·4 cites·9 claims
- 2746US2015303147A1Semiconductor Constructions, Methods of Forming Conductive Structures and Methods of Forming DRAM CellsMICRON TECHNOLOGY INC·Filed 2015·Application pending·0 cites
- 2843US2008273410A1Tungsten digitlinesGOSWAMI JAYDEB·Filed 2007·Application pending·0 cites
- 2943US2009032949A1Method of depositing Tungsten using plasma-treated tungsten nitrideMICRON TECHNOLOGY INC·Filed 2007·Application pending·0 cites
- 3041US2008246124A1Plasma treatment of insulating materialMATHEW JAMES·Filed 2007·Application pending·0 cites
- 3134US2011216585A1Metal containing materialsMICRON TECHNOLOGY INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →