Inventor · disambiguated record
Seungkon Mok
Also filed as: MOK SEUNGKON
6 granted patents·1 pending application·18 citations·filing 2010–2021
76Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0191US9978661B2Packaged semiconductor chips having heat dissipation layers and ground contacts thereinIM YUNHYEOK·Filed 2016·Granted May 22, 2018·12 cites·6 claims
- 0285US11101243B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 24, 2021·4 cites·20 claims
- 0365US11742329B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 0462US9640575B2Semiconductor package including image sensor and holder with transparent cover and adhesive stopperSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 2, 2017·1 cites·3 claims
- 0557US8569114B2Method of forming a semiconductor device packageYIM CHOONGBIN·Filed 2010·Granted Oct 29, 2013·1 cites·18 claims
- 0651US9324748B2Semiconductor package including an image sensor and a holder with stoppersSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 26, 2016·0 cites·11 claims
- 0748US2018269126A1Semiconductor packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →