Inventor · disambiguated record
Chun-Hui Yu
Also filed as: YU CHUN H · YU CHUN-HUI
58 granted patents·19 pending applications·528 citations·filing 2004–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD53ADVANCED CHIP ENG TECH INC11HSIAO YI-LI2TAIWAN SEMICONDUCTOR MFG2YEE KUO-CHUNG2
Top patents by PatentIndex Score
77 records- 0199US10340249B1Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 2, 2019·57 cites·20 claims
- 0298US11380645B2Semiconductor structure comprising at least one system-on-integrated-circuit componentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·7 cites·20 claims
- 0398US11355418B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 7, 2022·5 cites·20 claims
- 0498US10157864B1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·19 cites·17 claims
- 0598US9966360B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 8, 2018·37 cites·20 claims
- 0698US9679882B2Method of multi-chip wafer level packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 13, 2017·20 cites·20 claims
- 0797US9136293B2Methods and apparatus for sensor moduleYEE KUO-CHUNG·Filed 2012·Granted Sep 15, 2015·45 cites·20 claims
- 0897US8754514B2Multi-chip wafer level packageYU CHUN HUI·Filed 2011·Granted Jun 17, 2014·107 cites·20 claims
- 0996US11854936B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 26, 2023·2 cites·20 claims
- 1096US10283473B1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·16 cites·20 claims
- 1196US8338945B2Molded chip interposer structure and methodsYU CHEN-HUA·Filed 2010·Granted Dec 25, 2012·25 cites·17 claims
- 1295US11545438B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·12 cites·20 claims
- 1395US10475747B2Integrated fan-out package and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 12, 2019·13 cites·20 claims
- 1494US11031344B2Package having redistribution layer structure with protective layer and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 8, 2021·7 cites·20 claims
- 1593US10879220B2Package-on-package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 29, 2020·10 cites·20 claims
- 1692US8581402B2Molded chip interposer structure and methodsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 12, 2013·12 cites·20 claims
- 1791US11830844B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·1 cites·20 claims
- 1891US10714525B2Methods and apparatus for sensor moduleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 14, 2020·5 cites·20 claims
- 1991US7453148B2Structure of dielectric layers in built-up layers of wafer level packageADVANCED CHIP ENG TECH INC·Filed 2006·Granted Nov 18, 2008·32 cites·18 claims
- 2090US11574853B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 7, 2023·2 cites·20 claims
- 2189US10515921B2Semiconductor package and method of fabricating semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·5 cites·20 claims
- 2289US10177078B2Method for forming chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 8, 2019·5 cites·20 claims
- 2389US7279782B2FBGA and COB package structure for image sensorADVANCED CHIP ENG TECH INC·Filed 2005·Granted Oct 9, 2007·21 cites·25 claims
- 2489US2025349671A1Manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2588US11393805B23D semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 19, 2022·2 cites·20 claims
- 2688US10861773B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 8, 2020·4 cites·20 claims
- 2788US10510695B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·3 cites·20 claims
- 2887US12283556B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Apr 22, 2025·0 cites·20 claims
- 2987US7911044B2RF module package for releasing stressADVANCED CHIP ENG TECH INC·Filed 2006·Granted Mar 22, 2011·18 cites·8 claims
- 3084US12444665B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 3183US12261142B2Semiconductor structure including thermal enhanced bonding structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 3283US2024355756A1Package having redistribution layer structure with protective layer and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3382US10770428B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 8, 2020·2 cites·20 claims
- 3482US8741691B2Method of fabricating three dimensional integrated circuitYEE KUO-CHUNG·Filed 2012·Granted Jun 3, 2014·5 cites·14 claims
- 3581US7884461B2System-in-package and manufacturing method of the sameADVANCED CHIP ENG TECH INC·Filed 2008·Granted Feb 8, 2011·9 cites·10 claims
- 3681US2025285938A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3780US2025167145A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3879US2025192088A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3978US10269851B2Methods and apparatus for sensor moduleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·2 cites·20 claims
- 4077US12057406B2Package having redistribution layer structure with protective layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 4177US11139223B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 5, 2021·2 cites·20 claims
- 4276US11916028B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·0 cites·20 claims
- 4376US2024096760A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4475US2025336833A1Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4574US12341079B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 4674US12224276B23D semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 11, 2025·0 cites·20 claims
- 4774US12014993B2Package having redistribution layer structure with protective layer and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
- 4873US9583365B2Method of forming interconnects for three dimensional integrated circuitYU CHUN HUI·Filed 2012·Granted Feb 28, 2017·4 cites·18 claims
- 4971US11756852B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·20 claims
- 5071US11640954B2Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 2, 2023·0 cites·20 claims
Showing the top 50 of 77 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →