Package structure and manufacturing method thereof

Abstract

A package structure includes a wafer-form semiconductor package and a thermal dissipating system. The wafer-form semiconductor package includes semiconductor dies electrically connected with each other. The thermal dissipating system is located on and thermally coupled to the wafer-form semiconductor package, where the thermal dissipating system has a hollow structure with a fluidic space, and the fluidic space includes a ceiling and a floor. The thermal dissipating system includes at least one inlet opening, at least one outlet opening and a plurality of first microstructures. The at least one inlet opening and the at least one outlet opening are spatially communicated with the fluidic space. The first microstructures are located on the floor, and at least one of the first microstructures is corresponding to the at least one outlet opening.

What is claimed is: 
     
         1 . A package structure, comprising:
 a semiconductor package, comprising a semiconductor die; and   a heat dissipation module, disposed over and thermally coupled to the semiconductor package, wherein the thermal dissipating module with a fluidic space disposed therein, wherein the thermal dissipating module comprises:
 openings, disposed in and penetrating through a topmost portion of the thermal dissipating module being away from the semiconductor package, 
 wherein in a plane view of the thermal dissipating module, a first group of the openings is disposed at a center of the topmost portion, and a second group of the openings is disposed at an edge of the topmost portion, 
 wherein in the plane view, the fluidic space is entirely divided into a plurality of equal sections, at least one opening of the second group of the openings is respectively disposed in the plurality of equal sections, and the first group of the openings comprises one opening being disposed at a concentric position of and shared by the plurality of equal sections. 
   
     
     
         2 . The package structure of  claim 1 , wherein in the plane view, each of the plurality of equal sections comprises two or more than two sub-regions being spatially communicated to each other. 
     
     
         3 . The package structure of  claim 1 , wherein in a cross-section view of the heat dissipation module, a first group of recesses are disposed in an inner surface of the topmost portion, and are respectively overlapped with and spatially communicated to the first group of the openings,
 wherein a thickness of each recess of the first group of recesses is less than a thickness of a respective one opening of the first group of the openings.   
     
     
         4 . The package structure of  claim 1 , wherein in a cross-section view of the heat dissipation module, a first group of recesses are disposed in an inner surface of the topmost portion, and are respectively overlapped with and spatially communicated to the first group of the openings,
 wherein a lateral size of each recess of the first group of recesses is greater than a lateral size of a respective one opening of the first group of the openings.   
     
     
         5 . The package structure of  claim 1 , wherein in a cross-section view of the heat dissipation module, a second group of recesses are disposed in an inner surface of the topmost portion, and are respectively overlapped with and spatially communicated to the second group of the openings,
 wherein a thickness of each recess of the second group of recesses is less than a thickness of a respective one opening of the second group of the openings.   
     
     
         6 . The package structure of  claim 1 , wherein in a cross-section view of the heat dissipation module, a second group of recesses are disposed in an inner surface of the topmost portion, and are respectively overlapped with and spatially communicated to the second group of the openings,
 wherein a lateral size of each recess of the second group of recesses is greater than a lateral size of a respective one opening of the second group of the openings.   
     
     
         7 . The package structure of  claim 1 , wherein in a cross-section view of the heat dissipation module, a third group of recesses are disposed in an inner surface of the topmost portion, and are offset from the first group of the opening and the second group of the openings,
 wherein a thickness of each recess of the third group of recesses is less than thicknesses of the first group of the openings and the second group of the openings.   
     
     
         8 . The package structure of  claim 1 , wherein in the plane view, a shape of the heat dissipation module comprises a circle shape, and the plurality of equal sections are in form of sectors. 
     
     
         9 . The package structure of  claim 1 , wherein the semiconductor package further comprises a plurality of conductive terminals electrically coupled to the semiconductor die and an insulating encapsulation encapsulating the semiconductor die, and the plurality of conductive terminals are disposed at a side of the semiconductor package opposite to the heat dissipation module,
 wherein on a vertical projection in a stacking direction of the semiconductor die and the heat dissipation module, a perimeter of the heat dissipation module is enclosed by a perimeter of the insulating encapsulation comprised in the semiconductor package.   
     
     
         10 . The package structure of  claim 9 , further comprising:
 a circuit component, electrically coupled to the semiconductor package through the plurality of conductive terminals, wherein the semiconductor package is disposed between the circuit component and the heat dissipation module.   
     
     
         11 . The package structure of  claim 10 , wherein the heat dissipation module is further bonded to the circuit component, and the semiconductor package is disposed in a space confined by the circuit component and the heat dissipating module. 
     
     
         12 . A package structure, comprising:
 a semiconductor package, comprising at least one semiconductor die; and   a heat dissipating module, disposed over and thermally coupled to the semiconductor package, wherein the heat dissipating module with a fluidic space disposed therein, wherein the heat dissipating module comprises:
 openings, disposed in and penetrating through a topmost portion of the heat dissipating module being distant from the semiconductor package, 
 wherein in a plane view of the heat dissipating module, the fluidic space comprises a first fluidic region and a second fluidic region separating from and surrounding the first fluidic region, the first fluidic region is spatially independent from the second fluidic region, and at least one opening of a first group of the openings is disposed at the first fluidic region, and at least one opening of a second group of the openings is disposed at the second fluidic region, 
 wherein a number of the openings in the first fluidic region is greater than or equal to two. 
   
     
     
         13 . The package structure of  claim 12 , wherein in the plane view, the first fluidic region is in a form of first spiral having a first end and a third end, the second fluidic region is a form of a second spiral having a second end and a fourth end, wherein the first end and the second end are disposed at positions near to a center of the topmost portion, and the third end and the fourth end are disposed at positions near an edge of the topmost portion,
 wherein the at least one opening of the first group of the openings comprises a first opening of the first group of the openings disposed at the first end, and the at least one opening of the second group of the openings comprises a second opening of the second group of the openings disposed at the second end,   wherein a third opening of the first group of the openings is disposed at the fourth end, and a fourth opening of the second group of the openings is disposed at the third end,   wherein on a vertical projection in a stacking direction of the at least one semiconductor die and the heat dissipating module, an occupying area of the heat dissipating module is smaller than an occupying area of the semiconductor package.   
     
     
         14 . The package structure of  claim 12 , wherein in the plane view, the at least one opening of the first group of the openings comprises a first opening of the first group of the openings disposed at a center of the first fluidic region, and the at least one opening of the second group of the openings comprises second openings of the second group of the openings disposed at the second fluidic region and distributed along an edge thereof,
 wherein third openings of the first group of the openings are disposed at the second fluidic region and distributed along an edge of the first fluidic region, and fourth openings of the second group of the openings are disposed at the first fluidic region and distributed along the edge of the first fluidic region.   
     
     
         15 . The package structure of  claim 12 , wherein the first fluidic region comprises a plurality of first equal sections, and the second fluidic region comprises a plurality of second equal section,
 wherein in the plane view, a shape of the heat dissipating module comprises a circle shape, and the plurality of first equal sections and the plurality of second equal sections are in form of sectors.   
     
     
         16 . The package structure of  claim 15 , wherein in the plane view, each of the plurality of first equal sections comprises two or more than two sub-regions being spatially communicated to each other, and each of the plurality of second equal sections comprises two or more than two sub-regions being spatially communicated to each other. 
     
     
         17 . The package structure of  claim 15 , wherein in the plane view, the at least one opening of the first group of the openings comprises a first opening of the first group of the openings disposed at a center of the first fluidic region, and the at least one opening of the second group of the openings comprises second openings of the second group of the openings disposed at the second fluidic region and distributed along an edge thereof,
 wherein third openings of the first group of the openings are disposed at the second fluidic region and distributed along the edge thereof, and are alternatively arranged with the second openings,   wherein fourth openings of the second group of the openings are disposed at the first fluidic region and distributed along an edge thereof.   
     
     
         18 . A package structure, comprising:
 a semiconductor package, comprising a semiconductor die; and   a thermal dissipating system, disposed on and thermally coupled to the semiconductor package, the thermal dissipating system being in direct physical contact with the semiconductor die, wherein the thermal dissipating system with a fluidic space disposed herein, wherein the thermal dissipating system comprises at least one inlet opening and at least one outlet opening spatially communicated with the fluidic space.   
     
     
         19 . The package structure of  claim 18 , wherein the thermal dissipating system further comprises:
 a conductive layer, disposed on and thermally coupled to the semiconductor package; and   a heat dissipating module, comprising a lid having a central portion and a flange portion bonded to a periphery of the central portion, wherein the flange portion is bonded to the conductive layer to confine the fluidic space between the conductive layer, the flange portion and the central portion.   
     
     
         20 . The package structure of  claim 18 , wherein the thermal dissipating system further comprises:
 a conductive layer, disposed on and thermally coupled to the semiconductor package;   a plurality of conductive connectors; and   a heat dissipating module, bonded to and thermally coupled to the conductive layer through the plurality of the conductive connectors, and comprising a block having a top-side portion, a bottom-side portion and a side portion connecting the top-side portion and the bottom-side portion,   wherein the fluidic space is confined by the bottom-side portion, the side portion and the top-side portion.