Inventor · disambiguated record
Oscar Torrents Abad
Also filed as: TORRENTS ABAD OSCAR
29 granted patents·5 pending applications·81 citations·filing 2018–2023
95Inventor score
Top patents by PatentIndex Score
34 records- 0198US10818643B1Rigid pickup head with conformable layerFACEBOOK TECH LLC·Filed 2020·Granted Oct 27, 2020·8 cites·16 claims
- 0295US11349053B1Flexible interconnect using conductive adhesiveFACEBOOK TECH LLC·Filed 2020·Granted May 31, 2022·5 cites·20 claims
- 0394US11296268B1Magnetic clamping interconnectsFACEBOOK TECH LLC·Filed 2020·Granted Apr 5, 2022·4 cites·9 claims
- 0494US10964581B1Self-aligned adhesive layer formation in light-emitting structure fabricationFACEBOOK TECH LLC·Filed 2019·Granted Mar 30, 2021·9 cites·20 claims
- 0593US11424214B1Hybrid interconnect for laser bonding using nanoporous metal tipsMETA PLATFORMS TECH LLC·Filed 2020·Granted Aug 23, 2022·3 cites·10 claims
- 0693US10998286B1Laser-induced selective heating for microLED placement and bondingFACEBOOK TECH LLC·Filed 2018·Granted May 4, 2021·10 cites·11 claims
- 0792US10586725B1Method for polymer-assisted chip transferFACEBOOK TECH LLC·Filed 2018·Granted Mar 10, 2020·8 cites·20 claims
- 0891US10326040B1Washable mold for conformable layer formation on semiconductor devicesFACEBOOK TECH LLC·Filed 2018·Granted Jun 18, 2019·7 cites·19 claims
- 0989US11145797B1Forming conformable layer with flap on semiconductor devicesFACEBOOK TECH LLC·Filed 2019·Granted Oct 12, 2021·6 cites·20 claims
- 1088US11417792B1Interconnect with nanotube fittingFACEBOOK TECH LLC·Filed 2020·Granted Aug 16, 2022·2 cites·12 claims
- 1188US11255529B1Bonding corners of light emitting diode chip to substrate using laserFACEBOOK TECH LLC·Filed 2019·Granted Feb 22, 2022·5 cites·13 claims
- 1286US11101159B1Pickup head with photocurable polymers for assembling light emitting diodesFACEBOOK TECH LLC·Filed 2020·Granted Aug 24, 2021·2 cites·10 claims
- 1385US11239400B1Curved pillar interconnectsFACEBOOK TECH LLC·Filed 2020·Granted Feb 1, 2022·2 cites·19 claims
- 1483US10832933B1Dry-etching of carrier substrate for microLED microassemblyFACEBOOK TECH LLC·Filed 2018·Granted Nov 10, 2020·3 cites·17 claims
- 1581US2023253524A1Selectively bonding light-emitting devices via a pulsed laserMETA PLATFORMS TECH LLC·Filed 2023·Application pending·0 cites
- 1679US11107948B1Fluidic pick-up head for assembling light emitting diodesFACEBOOK TECH LLC·Filed 2019·Granted Aug 31, 2021·2 cites·15 claims
- 1776US11328942B1Liquid crystalline elastomer for pick and place of semiconductor devicesFACEBOOK TECH LLC·Filed 2019·Granted May 10, 2022·2 cites·20 claims
- 1874US11276672B1Bonding dummy electrodes of light emitting diode chip to substrateFACEBOOK TECH LLC·Filed 2019·Granted Mar 15, 2022·1 cites·10 claims
- 1972US11344971B1Microlens arrays for parallel micropatterningFACEBOOK TECH LLC·Filed 2019·Granted May 31, 2022·1 cites·20 claims
- 2068US12068443B1Forming conformable layer with flap on semiconductor devicesMETA PLATFORMS TECH LLC·Filed 2021·Granted Aug 20, 2024·0 cites·19 claims
- 2168US10989735B2Atomic force microscopy tips for interconnectionFACEBOOK TECH LLC·Filed 2020·Granted Apr 27, 2021·0 cites·15 claims
- 2268US10964867B2Using underfill or flux to promote placing and parallel bonding of light emitting diodesFACEBOOK TECH LLC·Filed 2019·Granted Mar 30, 2021·1 cites·13 claims
- 2366US2023352437A1Hybrid interconnect for laser bonding using nanoporous metal tipsMETA PLATFORMS TECH LLC·Filed 2022·Application pending·0 cites
- 2465US2022266385A1Microlens arrays for parallel micropatterningFACEBOOK TECH LLC·Filed 2022·Application pending·0 cites
- 2562US2021257527A1Light-emitting structure alignment preservation in display fabricationFACEBOOK TECH LLC·Filed 2021·Application pending·0 cites
- 2661US10685946B2Elastomeric layer fabrication for light emitting diodesFACEBOOK TECH LLC·Filed 2019·Granted Jun 16, 2020·0 cites·20 claims
- 2757US10998480B2Light-emitting structure alignment preservation in display fabricationFACEBOOK TECH LLC·Filed 2019·Granted May 4, 2021·0 cites·12 claims
- 2856US2021210667A1Using underfill or flux to promote placing and parallel bonding of light emitting diodesFACEBOOK TECH LLC·Filed 2021·Application pending·0 cites
- 2954US11756810B1Detection of force applied by pick-up tool for transferring semiconductor devicesMETA PLATFORMS TECH LLC·Filed 2019·Granted Sep 12, 2023·0 cites·19 claims
- 3049US11670531B2Bridge pick-up head for transferring semiconductor devicesMETA PLATFORMS TECH LLC·Filed 2019·Granted Jun 6, 2023·0 cites·16 claims
- 3148US11005014B2Optics formation using pick-up toolsFACEBOOK TECH LLC·Filed 2018·Granted May 11, 2021·0 cites·17 claims
- 3247US10811575B2Laser lift-off masksFACEBOOK TECH LLC·Filed 2018·Granted Oct 20, 2020·0 cites·20 claims
- 3346US11011687B1Micro light emitting diode with remnants of fabrication substrate for structural supportFACEBOOK TECH LLC·Filed 2018·Granted May 18, 2021·0 cites·18 claims
- 3443US10559486B1Method for polymer-assisted chip transferFACEBOOK TECH LLC·Filed 2018·Granted Feb 11, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →