Light-emitting structure alignment preservation in display fabrication

Abstract

Techniques are disclosed for forming a frame on the backplane comprising structures at least partially circumscribing or enclosing metal contacts on the backplane. In some embodiments, the frame may comprise a photoresist. The dimensions and structural integrity of the frame can help prevent misalignment and/or damage of physical obtrusions of light-emitting structures during a bonding process of the light-emitting structures to the backplane.

What is claimed is: 
     
         1 . A backplane comprising:
 a planar surface;   a first set of electrical contacts coupled to the planar surface; and   one or more frame structures on the surface of the backplane at least partially enclosing the first set of electrical contacts and configured to, during a bonding process in which each electrical contact of a second set of electrical contacts comprising one or more contacts of a light-emitting structure is bonded with a respective electrical contact of the first set of contacts, come in physical contact with a surface of a semiconductor element of the light-emitting structure.   
     
     
         2 . The backplane of  claim 1 , wherein the one or more frame structures comprises a photoresist material. 
     
     
         3 . The backplane of  claim 1 , further comprising a layer of underfill on the surface of the backplane. 
     
     
         4 . The backplane of  claim 3 , wherein a tackiness of the layer of underfill allows the light-emitting structure to be decoupled from a pick-and-place head after the light-emitting structure is at least partially pressed into the layer of underfill using the pick-and-place head and the pick-and-place head moved in a direction away from the backplane. 
     
     
         5 . The backplane of  claim 1 , wherein
 the one or more frame structures extend a first height from the surface of the backplane; and   the first height is configured to exceed a second height of a mesa of the light-emitting structure, the mesa extending the second height from the surface of the semiconductor element of the light-emitting structure.   
     
     
         6 . The backplane of  claim 1 , wherein the one or more frame structures are located at a distance from the first set of electrical contacts to allow for a threshold amount of movement between the light-emitting structure and the backplane in a direction parallel to the surface of the backplane during a bonding of the light-emitting structure to the backplane. 
     
     
         7 . The backplane of  claim 1 , wherein the one or more frame structures comprise a plurality of discrete frame structures. 
     
     
         8 . The backplane of  claim 1 , wherein the first set of electrical contacts comprises one or more electrical contacts.