Inventor · disambiguated record
Michael Z. Su
Also filed as: SU MICHAEL · SU MICHAEL Z · SU MICHAEL ZHUOYING
37 granted patents·18 pending applications·325 citations·filing 2003–2025
97Inventor score
Files withSU MICHAEL Z15CHIPLETZ INC11ADVANCED MICRO DEVICES INC8REFAI-AHMED GAMAL4GLOBALFOUNDRIES INC3
Top patents by PatentIndex Score
55 records- 0197US8299633B2Semiconductor chip device with solder diffusion protectionSU MICHAEL Z·Filed 2009·Granted Oct 30, 2012·48 cites·9 claims
- 0295US8193039B2Semiconductor chip with reinforcing through-silicon-viasSU MICHAEL Z·Filed 2010·Granted Jun 5, 2012·22 cites·19 claims
- 0394US8691626B2Semiconductor chip device with underfillSU MICHAEL Z·Filed 2010·Granted Apr 8, 2014·24 cites·21 claims
- 0494US8647974B2Method of fabricating a semiconductor chip with supportive terminal padTOPACIO RODEN R·Filed 2011·Granted Feb 11, 2014·22 cites·24 claims
- 0594US8472190B2Stacked semiconductor chip device with thermal managementREFAI-AHMED GAMAL·Filed 2010·Granted Jun 25, 2013·24 cites·24 claims
- 0693US8338961B2Semiconductor chip with reinforcing through-silicon-viasSU MICHAEL Z·Filed 2012·Granted Dec 25, 2012·15 cites·21 claims
- 0791US8866276B2Semiconductor chip device with polymeric filler trenchSU MICHAEL Z·Filed 2013·Granted Oct 21, 2014·11 cites·20 claims
- 0891US8749254B2Power cycling test arrangementSU MICHAEL Z·Filed 2010·Granted Jun 10, 2014·9 cites·25 claims
- 0990US9437561B2Semiconductor chip with redundant thru-silicon-viasBLACK BRYAN·Filed 2010·Granted Sep 6, 2016·12 cites·17 claims
- 1090US9385055B2Stacked semiconductor chips with thermal managementREFAI-AHMED GAMAL·Filed 2010·Granted Jul 5, 2016·13 cites·17 claims
- 1189US8723314B2Semiconductor workpiece with backside metallization and methods of dicing the sameSU MICHAEL·Filed 2012·Granted May 13, 2014·11 cites·23 claims
- 1285US8574965B2Semiconductor chip device with liquid thermal interface materialREFAI-AHMED GAMAL·Filed 2010·Granted Nov 5, 2013·8 cites·23 claims
- 1384US9806014B2Interposer with beyond reticle field conductor padsALFANO MICHAEL S·Filed 2016·Granted Oct 31, 2017·8 cites·15 claims
- 1484US8759962B2Semiconductor chip device with solder diffusion protectionSU MICHAEL Z·Filed 2012·Granted Jun 24, 2014·6 cites·14 claims
- 1584US8624404B1Integrated circuit package having offset viasSU MICHAEL Z·Filed 2012·Granted Jan 7, 2014·7 cites·25 claims
- 1683US7206703B1System and method for testing packaged devices using time domain reflectometryADVANCED MICRO DEVICES INC·Filed 2005·Granted Apr 17, 2007·16 cites·15 claims
- 1782US8704353B2Thermal management of stacked semiconductor chips with electrically non-functional interconnectsSU MICHAEL·Filed 2012·Granted Apr 22, 2014·7 cites·24 claims
- 1882US7737563B2Semiconductor chip with reinforcement structureGLOBALFOUNDRIES INC·Filed 2008·Granted Jun 15, 2010·11 cites·27 claims
- 1981US9793239B2Semiconductor workpiece with selective backside metallizationSU MICHAEL Z·Filed 2015·Granted Oct 17, 2017·3 cites·22 claims
- 2081US8394672B2Method of manufacturing and assembling semiconductor chips with offset padsSU MICHAEL Z·Filed 2010·Granted Mar 12, 2013·5 cites·14 claims
- 2178US8796842B2Stacked semiconductor chip device with thermal management circuit boardREFAI-AHMED GAMAL·Filed 2010·Granted Aug 5, 2014·5 cites·25 claims
- 2278US7679200B2Semiconductor chip with crack stopGLOBALFOUNDRIES INC·Filed 2007·Granted Mar 16, 2010·8 cites·20 claims
- 2375US12334455B2Semiconductor package with integrated capacitorsCHIPLETZ INC·Filed 2024·Granted Jun 17, 2025·0 cites·13 claims
- 2475US12094853B2Semiconductor chip with redundant thru-silicon-viasADVANCED MICRO DEVICES INC·Filed 2022·Granted Sep 17, 2024·0 cites·20 claims
- 2575US8617926B2Semiconductor chip device with polymeric filler trenchSU MICHAEL Z·Filed 2010·Granted Dec 31, 2013·3 cites·23 claims
- 2675US2025293133A1Through Package Vertical Interconnect and Method of Making SameCHIPLETZ INC·Filed 2025·Application pending·0 cites
- 2774US7897433B2Semiconductor chip with reinforcement layer and method of making the sameADVANCED MICRO DEVICES INC·Filed 2009·Granted Mar 1, 2011·6 cites·21 claims
- 2873US2025273604A1Semiconductor Package with Integrated CapacitorsCHIPLETZ INC·Filed 2025·Application pending·0 cites
- 2972US8293636B2Conductive connection structure with stress reduction arrangement for a semiconductor device, and related fabrication methodSCHULZE THOMAS·Filed 2010·Granted Oct 23, 2012·5 cites·4 claims
- 3069US7259458B2Integrated circuit with increased heat transferADVANCED MICRO DEVICES INC·Filed 2005·Granted Aug 21, 2007·4 cites·18 claims
- 3168US11469212B2Semiconductor chip with redundant thru-silicon-viasADVANCED MICRO DEVICES INC·Filed 2016·Granted Oct 11, 2022·1 cites·20 claims
- 3267US2023343687A1Through Package Vertical Interconnect and Method of Making SameCHIPLETZ INC·Filed 2023·Application pending·0 cites
- 3366US12288756B2Semiconductor package with integrated capacitorsCHIPLETZ INC·Filed 2022·Granted Apr 29, 2025·0 cites·10 claims
- 3466US7977160B2Semiconductor devices having stress relief layers and methods for fabricating the sameGLOBALFOUNDRIES INC·Filed 2009·Granted Jul 12, 2011·4 cites·19 claims
- 3565US9449907B2Stacked semiconductor chips packagingADVANCED MICRO DEVICES INC·Filed 2015·Granted Sep 20, 2016·1 cites·11 claims
- 3660US8174131B2Semiconductor device having a filled trench structure and methods for fabricating the sameZHANG ZHEN·Filed 2009·Granted May 8, 2012·2 cites·20 claims
- 3758US2025210548A1Embedded voltage regulation moduleCHIPLETZ INC·Filed 2024·Application pending·0 cites
- 3855US9627281B2Semiconductor chip with thermal interface tapePREJEAN SETH·Filed 2010·Granted Apr 18, 2017·1 cites·16 claims
- 3953US7197727B1Interconnect speed sensing circuitryADVANCED MICRO DEVICES INC·Filed 2003·Granted Mar 27, 2007·3 cites·19 claims
- 4053US2024120293A1Method and Apparatus for Prevention, Cessation, Detection, and Monitoring of Cracks in SubstratesCHIPLETZ INC·Filed 2023·Application pending·0 cites
- 4152US2024258041A1Low-Equivalent-Series-Resistance Capacitors with Solid-State Current Collectors Using Conductive InksCHIPLETZ INC·Filed 2024·Application pending·0 cites
- 4251US2024337799A1Co-Packaging Assembly and Method for Attaching Photonic Dies/Modules to Multi-Chip Active/Passive SubstrateCHIPLETZ INC·Filed 2023·Application pending·0 cites
- 4351US2023395305A1Inductors Embedded in Package Substrate and Board and Method and System for Manufacturing the SameCHIPLETZ INC·Filed 2023·Application pending·0 cites
- 4450US2013161814A1Semiconductor chip with offset padsSU MICHAEL Z·Filed 2013·Application pending·0 cites
- 4549US8293581B2Semiconductor chip with protective scribe structureSU MICHAEL Z·Filed 2009·Granted Oct 23, 2012·0 cites·27 claims
- 4647US2023411174A1Package Assembly and Method of Attaching Multi-Height Dies/Modules to Multi-Chip Active/Passive SubstrateCHIPLETZ INC·Filed 2022·Application pending·0 cites
- 4745US2012193788A1Stacked semiconductor chips packagingFU LEI·Filed 2011·Application pending·0 cites
- 4844US2008191318A1Semiconductor device and method of sawing semiconductor deviceADVANCED MICRO DEVICES INC·Filed 2007·Application pending·0 cites
- 4943US2008124840A1Electrical Insulating Layer for Metallic Thermal Interface MaterialSU MICHAEL Z·Filed 2006·Application pending·0 cites
- 5040US2013147028A1Heat spreader for multiple chip systemsSU MICHAEL Z·Filed 2011·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →