Inventor · disambiguated record
Barrett M. Faneuf
Also filed as: FANEUF BARRETT · FANEUF BARRETT M
23 granted patents·6 pending applications·866 citations·filing 2001–2023
97Inventor score
Top patents by PatentIndex Score
29 records- 0197US7233491B2Frame-level thermal interface component for transfer of heat from an electronic component of a computer systemINTEL CORP·Filed 2006·Granted Jun 19, 2007·48 cites·13 claims
- 0295US6643132B2Chassis-level thermal interface component for transfer of heat from an electronic component of a computer systemINTEL CORP·Filed 2002·Granted Nov 4, 2003·111 cites·9 claims
- 0395US6560114B2Rack-mounted server and associated methodsINTEL CORP·Filed 2001·Granted May 6, 2003·99 cites·22 claims
- 0494US6836407B2Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structureINTEL CORP·Filed 2002·Granted Dec 28, 2004·82 cites·14 claims
- 0593US6813149B2High capacity air-cooling systems for electronic apparatus and associated methodsINTEL CORP·Filed 2001·Granted Nov 2, 2004·68 cites·28 claims
- 0691US7133283B2Frame-level thermal interface component for transfer of heat from an electronic component of a computer systemINTEL CORP·Filed 2002·Granted Nov 7, 2006·45 cites·19 claims
- 0791US6981543B2Modular capillary pumped loop cooling systemINTEL CORP·Filed 2001·Granted Jan 3, 2006·62 cites·29 claims
- 0891US6776221B2Computer system having a chassis-level capillary pump loop transferring heat to a frame-level thermal interface componentINTEL CORP·Filed 2002·Granted Aug 17, 2004·57 cites·22 claims
- 0990US6839237B2Electronics rack assemblies and associated componentsINTEL CORP·Filed 2003·Granted Jan 4, 2005·50 cites·16 claims
- 1090US6693797B2Computer system having a chassis-level thermal interface component and a frame-level thermal interface component that are thermally engageable with and disengageable from one anotherINTEL CORP·Filed 2002·Granted Feb 17, 2004·54 cites·26 claims
- 1188US6700785B2Computer system which locks a server unit subassembly in a selected position in a support frameINTEL CORP·Filed 2002·Granted Mar 2, 2004·49 cites·18 claims
- 1287US11266043B2Liquid coolant based thermal energy management for containers receiving pluggable circuit modulesINTEL CORP·Filed 2018·Granted Mar 1, 2022·6 cites·11 claims
- 1387US7079388B2Baffles for high capacity air-cooling systems for electronics apparatusINTEL CORP·Filed 2004·Granted Jul 18, 2006·36 cites·15 claims
- 1486US7770630B2Modular capillary pumped loop cooling systemINTEL CORP·Filed 2003·Granted Aug 10, 2010·37 cites·9 claims
- 1585US11184997B2System to reduce coolant use in an array of circuit boardsINTEL CORP·Filed 2018·Granted Nov 23, 2021·5 cites·14 claims
- 1684US9606589B2Expansion card having synergistic cooling, structural and volume reduction solutionsGALLINA MARK J·Filed 2011·Granted Mar 28, 2017·13 cites·25 claims
- 1781US10945353B2Mechanism with folded wrapping to seal components immersed in coolantINTEL CORP·Filed 2017·Granted Mar 9, 2021·4 cites·23 claims
- 1877US6741465B2Cooling method and apparatus for handheld devicesINTEL CORP·Filed 2002·Granted May 25, 2004·24 cites·30 claims
- 1976US12131977B2Electronic systems with inverted circuit board with heat sink to chassis attachmentINTEL CORP·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 2074US7149086B2Systems to cool multiple electrical componentsINTEL CORP·Filed 2004·Granted Dec 12, 2006·16 cites·23 claims
- 2163US11842943B2Electronic systems with inverted circuit board with heat sink to chassis attachmentINTEL CORP·Filed 2020·Granted Dec 12, 2023·0 cites·22 claims
- 2258US12442712B2Liquid cooling system leak detection improvementsINTEL CORP·Filed 2020·Granted Oct 14, 2025·0 cites·15 claims
- 2356US2015184053A1Gasketted thermal interfaceKRISHNAN SHANKAR·Filed 2013·Application pending·0 cites
- 2455US12160971B2Jam for integration reliability of ruler form factor componentINTEL CORP·Filed 2020·Granted Dec 3, 2024·0 cites·20 claims
- 2544US2006163622A1Apparatus and method for manufacturing thermal interface device having aligned carbon nanotubesMONTGOMERY STEPHEN W·Filed 2006·Application pending·0 cites
- 2637US2004266063A1Apparatus and method for manufacturing thermal interface device having aligned carbon nanotubesFiled 2003·Application pending·0 cites
- 2736US2018059744A1Liquid cooling interface for field replaceable electronic componentINTEL CORP·Filed 2016·Application pending·0 cites
- 2833US2018058777A1Heat exchanger puckINTEL CORP·Filed 2016·Application pending·0 cites
- 2932US2008160330A1Copper-elastomer hybrid thermal interface material to cool under-substrate siliconSONG DAVID·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →