Inventor · disambiguated record
Shunsuke Sakai
Also filed as: SAKAI SHUNSUKE
20 granted patents·12 pending applications·68 citations·filing 2004–2024
92Inventor score
Top patents by PatentIndex Score
32 records- 0192US8829357B2Wiring board and method for manufacturing the sameMIKADO YUKINOBU·Filed 2011·Granted Sep 9, 2014·17 cites·18 claims
- 0290US12369699B2Cosmetic applicatorMITSUBISHI PENCIL CO·Filed 2023·Granted Jul 29, 2025·1 cites·4 claims
- 0389US8299366B2Wiring board and method for manufacturing the sameSATO KENJI·Filed 2009·Granted Oct 30, 2012·18 cites·10 claims
- 0483US9282635B2Multilayer wiring board with built-in electronic component and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Mar 8, 2016·5 cites·13 claims
- 0578US8466372B2Wiring board with built-in electronic component and method for manufacturing the sameSAKAI SHUNSUKE·Filed 2009·Granted Jun 18, 2013·7 cites·16 claims
- 0677US8908387B2Wiring board and method for manufacturing the sameMIKADO YUKINOBU·Filed 2012·Granted Dec 9, 2014·3 cites·19 claims
- 0775US8642897B2Wiring board and method for manufacturing the sameSAKAI SHUNSUKE·Filed 2011·Granted Feb 4, 2014·5 cites·20 claims
- 0874US8385486B2Diversity receiving apparatus and diversity receiving methodPANASONIC CORP·Filed 2007·Granted Feb 26, 2013·6 cites·13 claims
- 0969US9119322B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Aug 25, 2015·1 cites·20 claims
- 1063US9564392B2Printed wiring board and semiconductor packageIBIDEN CO LTD·Filed 2016·Granted Feb 7, 2017·1 cites·20 claims
- 1163US8642070B2Feed additive composition for ruminants, and feed containing the same, and method of fabricating such feed additive composition for ruminantsOKUTANI AKIRA·Filed 2005·Granted Feb 4, 2014·1 cites·12 claims
- 1261US2025089167A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1359US9320148B2Printed wiring boardMIKADO YUKINOBU·Filed 2012·Granted Apr 19, 2016·1 cites·11 claims
- 1458US2024206057A1Wiring substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2023·Application pending·0 cites
- 1556US2023380055A1Wiring substrateIBIDEN CO LTD·Filed 2023·Application pending·0 cites
- 1656US2023380076A1Wiring substrateIBIDEN CO LTD·Filed 2023·Application pending·0 cites
- 1755US8335281B2Diversity receiving apparatus and diversity receiving methodSOGA SHIGERU·Filed 2007·Granted Dec 18, 2012·2 cites·19 claims
- 1855US2025155285A1Photoelectric Conversion DeviceSHIMADZU CORP·Filed 2024·Application pending·0 cites
- 1954US12232257B2Wiring substrateIBIDEN CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
- 2054US2014247571A1Wiring board with built-in electronic component and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 2150US10477682B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2019·Granted Nov 12, 2019·0 cites·15 claims
- 2248US8968813B2Instant noodles and method for producing the sameTAKAHASHI RINTARO·Filed 2011·Granted Mar 3, 2015·0 cites·9 claims
- 2348US7720113B2Receiving apparatus, receiving system using same, and receiving method thereofPANASONIC CORP·Filed 2004·Granted May 18, 2010·0 cites·12 claims
- 2447US2012142147A1Wiring board with built-in electronic component and method for manufacturing the sameSAKAI SHUNSUKE·Filed 2012·Application pending·0 cites
- 2543US8957320B2Printed wiring boardFURUTANI TOSHIKI·Filed 2012·Granted Feb 17, 2015·0 cites·19 claims
- 2643US2011240354A1Wiring board and method for manufacturing wiring boardIBIDEN CO LTD·Filed 2011·Application pending·0 cites
- 2739US2012188734A1Wiring board and method for manufacturing the sameMIKADO YUKINOBU·Filed 2011·Application pending·0 cites
- 2838US10070523B2Printed wiring board with conductor post having multiple surface roughness and method for manufacturing the sameIBIDEN CO LTD·Filed 2016·Granted Sep 4, 2018·0 cites·20 claims
- 2935US9859221B2Multilayer wiring board with built-in electronic componentIBIDEN CO LTD·Filed 2015·Granted Jan 2, 2018·0 cites·20 claims
- 3035US2016255717A1Multilayer wiring boardIBIDEN CO LTD·Filed 2016·Application pending·0 cites
- 3134US2016044783A1Printed wiring board, method for manufacturing the same and semiconductor packageIBIDEN CO LTD·Filed 2015·Application pending·0 cites
- 3234US2016043024A1Printed wiring board and semiconductor packageIBIDEN CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →