Wiring board with built-in electronic component and method for manufacturing the same

Abstract

A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole such that the second conductive pattern is formed along an outline of the periphery of the penetrating hole.

What is claimed is: 
     
         1 . A wiring board with a built-in electronic component, comprising:
 a core substrate having a penetrating hole formed in the core substrate;   an electronic component accommodated in the penetrating hole in the core substrate;   a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern; and   an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate,   wherein the second conductive pattern is formed adjacent to a periphery of the penetrating hole such that the second conductive pattern is formed along an outline of the periphery of the penetrating hole.   
     
     
         2 . The wiring board with a built-in electronic component according to  claim 1 , further comprising:
 an interlayer insulation layer formed over a second surface opposite to the first surface of the core substrate; and   a conductive pattern formed over the interlayer insulation layer formed over the second surface of the core substrate,   wherein the interlayer insulation layer formed over the second surface of the core substrate has a via conductor such that the via conductor electrically connects the conductive pattern over the second surface of the core substrate and a terminal of the electronic component.   
     
     
         3 . The wiring board with a built-in electronic component according to  claim 1 , wherein the second conductive pattern is configured such that the second conductive pattern is framing the periphery of the penetrating hole. 
     
     
         4 . The wiring board with a built-in electronic component according to  claim 1 , wherein the second conductive pattern comprises a plurality of portions facing each other across the penetrating hole. 
     
     
         5 . The wiring board with a built-in electronic component according to  claim 1 , wherein the second conductive pattern is configured such that the second conductive pattern comprises a plurality of portions framing the periphery of the penetrating hole. 
     
     
         6 . The wiring board with a built-in electronic component according to  claim 1 , wherein the second conductive pattern is configured such that the second conductive pattern is framing the periphery of the penetrating hole in a continuous line. 
     
     
         7 . The wiring board with a built-in electronic component according to  claim 1 , wherein the second conductive pattern is configured such that the second conductive pattern is framing the periphery of the penetrating hole in a broken line. 
     
     
         8 . The wiring board with a built-in electronic component according to  claim 1 , wherein the second conductive pattern has a side surface which is formed on substantially the same level as an inner-wall surface of the core substrate forming the penetrating hole. 
     
     
         9 . The wiring board with a built-in electronic component according to  claim 1 , wherein the second conductive pattern has a portion which is protruding into the penetrating hole. 
     
     
         10 . The wiring board with a built-in electronic component according to  claim 1 , wherein the second conductive pattern is configured such that the second conductive pattern is maintaining a space from the outline of the penetrating hole on the first surface of the core substrate. 
     
     
         11 . The wiring board with a built-in electronic component according to  claim 1 , wherein the second conductive pattern has a maximum width which is made greater than a maximum width of the first conductive pattern. 
     
     
         12 . The wiring board with a built-in electronic component according to  claim 1 , wherein the second conductive pattern has a thickness which is made substantially a same as a thickness of the first conductive pattern. 
     
     
         13 . The wiring board with a built-in electronic component according to  claim 1 , wherein the core substrate has a gap between the core substrate and the electronic component accommodated in the penetrating hole, and the gap is filled with a resin material. 
     
     
         14 . The wiring board with a built-in electronic component according to  claim 1 , wherein the electronic component is positioned in the penetrating hole such that the electronic component has a surface without circuits faces the first surface of the core substrate. 
     
     
         15 . The wiring board with a built-in electronic component according to  claim 1 , further comprising:
 a conductive pattern layer formed on a second surface opposite to the first surface of the core substrate and including a first conductive pattern and a second conductive pattern, wherein the second conductive pattern on the second surface of the core substrate is formed adjacent to a periphery of the penetrating hole on the second surface of the core substrate such that the second conductive pattern on the second surface of the core substrate is formed along an outline of the periphery of the penetrating hole on the second surface of the core substrate.   
     
     
         16 . The wiring board with a built-in electronic component according to  claim 1 , wherein the second conductive pattern is configured such that the second conductive pattern has a plurality of spaces formed adjacent to the periphery of the penetrating holes. 
     
     
         17 . The wiring board with a built-in electronic component according to  claim 1 , wherein the electronic component is a multilayered capacitor having a plurality of electrodes on opposite end portions of the multilayered capacitor, respectively. 
     
     
         18 . The wiring board with a built-in electronic component according to  claim 1 , wherein the second conductive pattern is a dummy conductive pattern. 
     
     
         19 . The wiring board with a built-in electronic component according to  claim 1 , wherein the second conductive pattern forms an electric circuit. 
     
     
         20 . The wiring board with a built-in electronic component according to  claim 1 , wherein the second conductive pattern comprises a plurality of portions formed adjacent to the periphery of the penetrating hole such that the plurality of portions is formed along the outline of the periphery of the penetrating hole.