Inventor · disambiguated record
Helmut Oefner
Also filed as: OEFNER HELMUT
24 granted patents·2 pending applications·22 citations·filing 2014–2023
92Inventor score
Files withINFINEON TECHNOLOGIES AG26
Top patents by PatentIndex Score
26 records- 0188US9245811B2Method for postdoping a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jan 26, 2016·7 cites·17 claims
- 0287US11742215B2Methods for forming a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2021·Granted Aug 29, 2023·1 cites·16 claims
- 0379US10273597B2Method of manufacturing CZ silicon wafers, and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Apr 30, 2019·2 cites·7 claims
- 0479US9972704B2Method for forming a semiconductor device and a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted May 15, 2018·2 cites·16 claims
- 0579US9559020B2Method for postdoping a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jan 31, 2017·2 cites·20 claims
- 0677US12211703B2Methods for forming a semiconductor device having a second semiconductor layer on a first semiconductor layerINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jan 28, 2025·0 cites·19 claims
- 0775US9779931B2Method of manufacturing semiconductor wafers and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 3, 2017·2 cites·23 claims
- 0874US10529838B2Semiconductor device having a variable carbon concentrationINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jan 7, 2020·1 cites·20 claims
- 0973US10566424B2Semiconductor device, silicon wafer and method of manufacturing a silicon waferINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 18, 2020·0 cites·24 claims
- 1072US10957767B2Semiconductor device, silicon wafer and method of manufacturing a silicon waferINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 23, 2021·0 cites·8 claims
- 1170US10014400B2Semiconductor device having a defined oxygen concentrationINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 3, 2018·1 cites·20 claims
- 1267US10837120B2Method of manufacturing CZ silicon wafers, and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 17, 2020·0 cites·9 claims
- 1366US9721907B2Wafer edge shape for thin wafer processingINFINEON TECHNOLOGIES AG·Filed 2015·Granted Aug 1, 2017·1 cites·23 claims
- 1466US9312120B2Method for processing an oxygen containing semiconductor bodyINFINEON TECHNOLOGIES AG·Filed 2014·Granted Apr 12, 2016·1 cites·25 claims
- 1565US2017062568A1Semiconductor device, silicon wafer and method of manufacturing a silicon waferINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
- 1664US9536838B1Single crystal ingot, semiconductor wafer and method of manufacturing semiconductor wafersINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jan 3, 2017·1 cites·21 claims
- 1763US9754787B2Method for treating a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 5, 2017·1 cites·19 claims
- 1859US10724149B2Method of manufacturing CZ silicon wafers, and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 28, 2020·0 cites·16 claims
- 1958US10317338B2Method and assembly for determining the carbon content in siliconINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 11, 2019·0 cites·26 claims
- 2056US2022042204A1Method of Manufacturing CZ Silicon WafersINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
- 2152US10566198B2Doping methodINFINEON TECHNOLOGIES AG·Filed 2018·Granted Feb 18, 2020·0 cites·23 claims
- 2248US10319599B2Methods of planarizing SiC surfacesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 11, 2019·0 cites·21 claims
- 2346US9934988B2Method for processing a silicon waferINFINEON TECHNOLOGIES AG·Filed 2016·Granted Apr 3, 2018·0 cites·33 claims
- 2446US9728395B2Method for manufacturing a semiconductor wafer, and semiconductor device having a low concentration of interstitial oxygenINFINEON TECHNOLOGIES AG·Filed 2015·Granted Aug 8, 2017·0 cites·13 claims
- 2545US9972488B2Method of reducing defects in an epitaxial layerINFINEON TECHNOLOGIES AG·Filed 2016·Granted May 15, 2018·0 cites·18 claims
- 2642US10026816B2Semiconductor wafer and manufacturing methodINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jul 17, 2018·0 cites·14 claims
Join the waitlist — get patent alerts
Get an alert when Helmut Oefner files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →