Inventor · disambiguated record
Rajashree Baskaran
Also filed as: BASKARAN RAJASHREE · BASKARAN RAJASHREE RAJI
40 granted patents·6 pending applications·186 citations·filing 2004–2022
97Inventor score
Top patents by PatentIndex Score
46 records- 0195US10462578B2Piezoelectric contact microphone with mechanical interfaceINTEL CORP·Filed 2017·Granted Oct 29, 2019·40 cites·20 claims
- 0293US7517228B2Surface mounted micro-scale springs for separable interconnection of package substrate and high-speed flex-circuitINTEL CORP·Filed 2005·Granted Apr 14, 2009·28 cites·15 claims
- 0389US11320883B2Multi-die stacks with power managementINTEL CORP·Filed 2018·Granted May 3, 2022·6 cites·27 claims
- 0488US10455324B2Apparatus and methods for bone conduction context detectionINTEL CORP·Filed 2018·Granted Oct 22, 2019·9 cites·16 claims
- 0587US9503829B2Ear pressure sensors integrated with speakers for smart sound level exposureINTEL CORP·Filed 2014·Granted Nov 22, 2016·10 cites·16 claims
- 0686US9196752B2Backside bulk silicon MEMSBASKARAN RAJASHREE·Filed 2011·Granted Nov 24, 2015·8 cites·25 claims
- 0785US11422551B2Technologies for providing a cognitive capacity test for autonomous drivingINTEL CORP·Filed 2018·Granted Aug 23, 2022·5 cites·27 claims
- 0885US9720496B2Techniques for stabilizing a display scene outputINTEL CORP·Filed 2014·Granted Aug 1, 2017·7 cites·17 claims
- 0985US9294035B2Multigate resonant channel transistorINTEL CORP·Filed 2013·Granted Mar 22, 2016·6 cites·25 claims
- 1083US9400557B2Multimodal haptic effect systemINTEL CORP·Filed 2014·Granted Jul 26, 2016·6 cites·25 claims
- 1182US7476568B2Wafer-level assembly of heat spreaders for dual IHS packagesINTEL CORP·Filed 2006·Granted Jan 13, 2009·6 cites·8 claims
- 1281US7449361B2Semiconductor substrate with islands of diamond and resulting devicesINTEL CORP·Filed 2005·Granted Nov 11, 2008·8 cites·8 claims
- 1380US11356772B2Apparatus and methods for bone conduction context detectionINTEL CORP·Filed 2020·Granted Jun 7, 2022·1 cites·26 claims
- 1479US10827261B2Apparatus and methods for bone conduction context detectionINTEL CORP·Filed 2019·Granted Nov 3, 2020·2 cites·21 claims
- 1578US8541876B2Microelectronic package having direct contact heat spreader and method of manufacturing sameLU DAOQIANG·Filed 2005·Granted Sep 24, 2013·7 cites·19 claims
- 1678US7902617B2Forming a thin film electric cooler and structures formed therebyINTEL CORP·Filed 2008·Granted Mar 8, 2011·6 cites·10 claims
- 1775US9508675B2Microelectronic package having direct contact heat spreader and method of manufacturing sameLU DAOQIANG·Filed 2013·Granted Nov 29, 2016·3 cites·27 claims
- 1875US7557438B2Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing sameINTEL CORP·Filed 2006·Granted Jul 7, 2009·6 cites·26 claims
- 1974US7723759B2Stacked wafer or die packaging with enhanced thermal and device performanceINTEL CORP·Filed 2005·Granted May 25, 2010·6 cites·11 claims
- 2073US12265389B2Technologies for providing a cognitive capacity test for autonomous drivingMOBILEYE VISION TECHNOLOGIES LTD·Filed 2022·Granted Apr 1, 2025·0 cites·14 claims
- 2172US7833816B2Forming a thin film thermoelectric cooler and structures formed therebyINTEL CORP·Filed 2005·Granted Nov 16, 2010·4 cites·8 claims
- 2271US11849280B2Apparatus and methods for bone conduction context detectionINTEL CORP·Filed 2022·Granted Dec 19, 2023·0 cites·17 claims
- 2370US12066833B2Computer-assisted or autonomous driving assisted by roadway navigation broadcastINTEL CORP·Filed 2021·Granted Aug 20, 2024·0 cites·15 claims
- 2469US9731369B2Interconnect alloy material and methodsINTEL CORP·Filed 2013·Granted Aug 15, 2017·1 cites·14 claims
- 2568US11822410B2Multi-die stacks with power managementINTEL CORP·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 2667US10099307B2Interconnect alloy material and methodsINTEL CORP·Filed 2017·Granted Oct 16, 2018·0 cites·8 claims
- 2767US9513311B2Inertial sensor pendulum test apparatusINTEL CORP·Filed 2014·Granted Dec 6, 2016·4 cites·18 claims
- 2863US7666714B2Assembly of thin die coreless packageINTEL CORP·Filed 2006·Granted Feb 23, 2010·2 cites·4 claims
- 2962US9646972B2Methods of forming buried vertical capacitors and structures formed therebyBASKARAN RAJASHREE·Filed 2013·Granted May 9, 2017·1 cites·22 claims
- 3060US9835648B2Liquid metal interconnectsBASKARAN RAJASHREE·Filed 2011·Granted Dec 5, 2017·1 cites·13 claims
- 3160US7875934B2Semiconductor substrate with islands of diamond and resulting devicesINTEL CORP·Filed 2008·Granted Jan 25, 2011·1 cites·12 claims
- 3256US11009890B2Computer-assisted or autonomous driving assisted by roadway navigation broadcastINTEL CORP·Filed 2018·Granted May 18, 2021·0 cites·22 claims
- 3356US7821073B2Patterned backside stress engineering for transistor performance optimizationINTEL CORP·Filed 2008·Granted Oct 26, 2010·0 cites·5 claims
- 3455US2009034206A1Wafer-level assembly of heat spreaders for dual ihs packagesINTEL CORP·Filed 2008·Application pending·0 cites
- 3553US9818751B2Methods of forming buried vertical capacitors and structures formed therebyINTEL CORP·Filed 2017·Granted Nov 14, 2017·0 cites·20 claims
- 3652US10236282B2Partial layer transfer system and methodINTEL CORP·Filed 2013·Granted Mar 19, 2019·0 cites·25 claims
- 3752US9061890B2Methods of forming buried electromechanical structures coupled with device substrates and structures formed therebyINTEL CORP·Filed 2013·Granted Jun 23, 2015·0 cites·14 claims
- 3851US9850121B2Backside bulk silicon MEMSINTEL CORP·Filed 2015·Granted Dec 26, 2017·0 cites·21 claims
- 3951US7371630B2Patterned backside stress engineering for transistor performance optimizationINTEL CORP·Filed 2004·Granted May 13, 2008·2 cites·8 claims
- 4049US11551551B2Technologies for providing guidance for autonomous vehicles in areas of low network connectivityINTEL CORP·Filed 2018·Granted Jan 10, 2023·0 cites·24 claims
- 4149US11366431B2Multi-function antenna and input interfaceINTEL CORP·Filed 2016·Granted Jun 21, 2022·0 cites·25 claims
- 4244US2015266725A1Methods of forming buried electromechanical structures coupled with device substrates and structures formed therebyBASKARAN RAJASHREE·Filed 2015·Application pending·0 cites
- 4340US2018005496A1Distributed haptics for wearable electronic devicesINTEL CORP·Filed 2016·Application pending·0 cites
- 4440US2019047578A1Methods and apparatus for detecting emergency events based on vehicle occupant behavior dataINTEL CORP·Filed 2018·Application pending·0 cites
- 4539US2007056621A1Self-assembled thin film thermoelectric deviceBASKARAN RAJASHREE·Filed 2005·Application pending·0 cites
- 4639US2006220198A1Semiconductor integrated circuit (IC) packaging with carbon nanotubes (CNT) to reduce IC/package stressBASKARAN RAJASHREE·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →