Assignee
LU DAOQIANG
US·5 granted patents·10 pending applications·50 citations·filing 2004–2013
Top patents by PatentIndex Score
15 records- 0194US8063482B2Heat spreader as mechanical reinforcement for ultra-thin dieLU DAOQIANG·Filed 2006·Granted Nov 22, 2011·24 cites·16 claims
- 0289US8642386B2Heat spreader as mechanical reinforcement for ultra-thin dieLU DAOQIANG·Filed 2011·Granted Feb 4, 2014·8 cites·11 claims
- 0378US8541876B2Microelectronic package having direct contact heat spreader and method of manufacturing sameLU DAOQIANG·Filed 2005·Granted Sep 24, 2013·7 cites·19 claims
- 0477US8230589B2Method of mounting an optical deviceLU DAOQIANG·Filed 2008·Granted Jul 31, 2012·8 cites·17 claims
- 0575US9508675B2Microelectronic package having direct contact heat spreader and method of manufacturing sameLU DAOQIANG·Filed 2013·Granted Nov 29, 2016·3 cites·27 claims
- 0647US2007127865A1Optical devices and methods to construct the sameLU DAOQIANG·Filed 2007·Application pending·0 cites
- 0746US2009087949A1Method of Making a Microelectronic Package Using an IHS StiffenerLU DAOQIANG·Filed 2007·Application pending·0 cites
- 0846US2006192281A1Methods for sealing chambers of microelectronic packagesLU DAOQIANG·Filed 2006·Application pending·0 cites
- 0945US2006138622A1One step capillary underfill integration for semiconductor packagesLU DAOQIANG·Filed 2005·Application pending·0 cites
- 1045US2006286721A1Breakable interconnects and structures formed therebyLU DAOQIANG·Filed 2005·Application pending·0 cites
- 1143US2008157345A1Curved heat spreader design for electronic assembliesLU DAOQIANG·Filed 2006·Application pending·0 cites
- 1241US2006138643A1One step capillary underfill integration for semiconductor packagesLU DAOQIANG·Filed 2004·Application pending·0 cites
- 1341US2007158807A1Edge interconnects for die stackingLU DAOQIANG·Filed 2005·Application pending·0 cites
- 1440US2006220223A1Reactive nano-layer material for MEMS packagingLU DAOQIANG·Filed 2005·Application pending·0 cites
- 1539US2005253282A1Temperature resistant hermetic sealing formed at low temperatures for MEMS packagesLU DAOQIANG·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when LU DAOQIANG files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →