Inventor · disambiguated record
Guruprasad G. Badakere
Also filed as: BADAKERE GURUPRASAD · BADAKERE GURUPRASAD G
7 granted patents·49 citations·filing 2002–2016
84Inventor score
Files withBADAKERE GURUPRASAD G2ST ASSEMBLY TEST SERVICES LTD2STATS CHIPPAC LTD2STATS CHIPPAC PTE LTD1
Top patents by PatentIndex Score
7 records- 0190US7838395B2Semiconductor wafer level interconnect package utilizing conductive ring and pad for separate voltage supplies and method of making the sameSTATS CHIPPAC LTD·Filed 2007·Granted Nov 23, 2010·15 cites·24 claims
- 0289US8097943B2Semiconductor device and method of forming wafer level ground plane and power ringBADAKERE GURUPRASAD G·Filed 2010·Granted Jan 17, 2012·11 cites·24 claims
- 0380US7842607B2Semiconductor device and method of providing a thermal dissipation path through RDL and conductive viaSTATS CHIPPAC LTD·Filed 2008·Granted Nov 30, 2010·8 cites·19 claims
- 0463US6979907B2Integrated circuit packageST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Dec 27, 2005·9 cites·10 claims
- 0556US10651139B2Semiconductor device and method of forming wafer level ground plane and power ringSTATS CHIPPAC PTE LTD·Filed 2016·Granted May 12, 2020·0 cites·21 claims
- 0656US6855573B2Integrated circuit package and manufacturing method therefor with unique interconnectorST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Feb 15, 2005·6 cites·10 claims
- 0751US9390991B2Semiconductor device and method of forming wafer level ground plane and power ringBADAKERE GURUPRASAD G·Filed 2012·Granted Jul 12, 2016·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →