Inventor · disambiguated record
Takaharu Yamano
Also filed as: YAMANO TAKAHARU
57 granted patents·10 pending applications·505 citations·filing 2002–2020
98Inventor score
Top patents by PatentIndex Score
67 records- 0197US7989707B2Chip embedded substrate and method of producing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Aug 2, 2011·71 cites·12 claims
- 0295US7772118B2Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2008·Granted Aug 10, 2010·32 cites·20 claims
- 0395US7365436B2Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Apr 29, 2008·37 cites·6 claims
- 0495US7288841B2Laminated semiconductor packageSHINKO ELECTRIC IND CO·Filed 2006·Granted Oct 30, 2007·37 cites·9 claims
- 0594US8793868B2Chip embedded substrate and method of producing the sameYAMANO TAKAHARU·Filed 2011·Granted Aug 5, 2014·14 cites·6 claims
- 0692US7843059B2Electronic parts packaging structureSHINKO ELECTRIC IND CO·Filed 2006·Granted Nov 30, 2010·28 cites·5 claims
- 0792US7732712B2Wiring board and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Jun 8, 2010·22 cites·12 claims
- 0891US7884484B2Wiring board and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Feb 8, 2011·24 cites·9 claims
- 0991US7468292B2Method of making wafer level package structure by grinding the backside thereof and then forming metal layer on the ground sideSHINKO ELECTRIC IND CO·Filed 2006·Granted Dec 23, 2008·19 cites·4 claims
- 1089US7937828B2Method of manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2006·Granted May 10, 2011·18 cites·6 claims
- 1188US7994431B2Substrate with built-in electronic component and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Granted Aug 9, 2011·15 cites·8 claims
- 1288US7370411B2Wiring board manufacturing methodSHINKO ELECTRIC IND CO·Filed 2006·Granted May 13, 2008·17 cites·12 claims
- 1387US11322478B2Semiconductor device and semiconductor device arraySHINKO ELECTRIC IND CO·Filed 2020·Granted May 3, 2022·2 cites·7 claims
- 1487US7312536B2Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Dec 25, 2007·15 cites·5 claims
- 1585US8253229B2Semiconductor package and stacked layer type semiconductor packageYAMANO TAKAHARU·Filed 2007·Granted Aug 28, 2012·14 cites·10 claims
- 1684US7521283B2Manufacturing method of chip integrated substrateSHINKO ELECTRIC IND CO·Filed 2005·Granted Apr 21, 2009·12 cites·10 claims
- 1783US7105423B2Method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2005·Granted Sep 12, 2006·12 cites·7 claims
- 1881US7875499B2Method of manufacturing a stacked semiconductor apparatusSHINKO ELECTRIC IND CO·Filed 2009·Granted Jan 25, 2011·8 cites·2 claims
- 1980US7459343B2Method of manufacturing semiconductor device and support structure for semiconductor substrateSHINKO ELECTRIC IND CO·Filed 2006·Granted Dec 2, 2008·8 cites·4 claims
- 2079US8415796B2Semiconductor device having a multilayer structureYAMANO TAKAHARU·Filed 2011·Granted Apr 9, 2013·5 cites·7 claims
- 2176US7772689B2Semiconductor package with a conductive post and wiring patternSHINKO ELECTRIC IND CO·Filed 2006·Granted Aug 10, 2010·7 cites·10 claims
- 2276US7498259B2Through electrode and method for forming the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Mar 3, 2009·5 cites·6 claims
- 2374US8183469B2Wiring board and method of manufacturing the sameSUNOHARA MASAHIRO·Filed 2009·Granted May 22, 2012·5 cites·7 claims
- 2474US7955454B2Method for forming wiring on insulating resin layerSHINKO ELECTRIC IND CO·Filed 2006·Granted Jun 7, 2011·8 cites·2 claims
- 2574US7847384B2Semiconductor package and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2006·Granted Dec 7, 2010·6 cites·7 claims
- 2674US7417311B2Semiconductor device and method of fabricating the sameSHINKO ELECTRIC IND CO·Filed 2004·Granted Aug 26, 2008·17 cites·2 claims
- 2773US8232639B2Semiconductor-device mounted board and method of manufacturing the sameKOBAYASHI TOSHIO·Filed 2010·Granted Jul 31, 2012·4 cites·9 claims
- 2872US7795127B2Electronic device manufacturing method and electronic deviceSHINKO ELECTRIC IND CO·Filed 2008·Granted Sep 14, 2010·5 cites·5 claims
- 2972US7250329B2Method of fabricating a built-in chip type substrateSHINKO ELECTRIC IND CO·Filed 2005·Granted Jul 31, 2007·5 cites·5 claims
- 3070US8564116B2Semiconductor device with reinforcement plate and method of forming sameYAMANO TAKAHARU·Filed 2010·Granted Oct 22, 2013·3 cites·3 claims
- 3168US8211754B2Semiconductor device and manufacturing method thereofYAMANO TAKAHARU·Filed 2009·Granted Jul 3, 2012·3 cites·14 claims
- 3264US8129259B2Manufacturing method of preparing a substrate with forming and removing the check patterns in scribing regions before dicing to form semiconductor deviceHARAYAMA YOICHI·Filed 2010·Granted Mar 6, 2012·3 cites·5 claims
- 3364US7884453B2Semiconductor device and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2007·Granted Feb 8, 2011·2 cites·6 claims
- 3463US7763977B2Semiconductor device and manufacturing method thereforSHINKO ELECTRIC IND CO·Filed 2007·Granted Jul 27, 2010·2 cites·3 claims
- 3562US8349733B2Manufacturing method of substrate with through electrodeSHINKO ELECTRIC IND CO·Filed 2008·Granted Jan 8, 2013·2 cites·17 claims
- 3662US8193617B2Semiconductor device and manufacturing method thereforYAMANO TAKAHARU·Filed 2009·Granted Jun 5, 2012·2 cites·13 claims
- 3762US7964493B2Method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2008·Granted Jun 21, 2011·2 cites·18 claims
- 3861US9564364B2Semiconductor device, semiconductor package, method for manufacturing semiconductor device, and method for manufacturing semiconductor packageYAMANO TAKAHARU·Filed 2012·Granted Feb 7, 2017·1 cites·20 claims
- 3961US8299586B2Semiconductor device and method of manufacturing the sameYAMANO TAKAHARU·Filed 2010·Granted Oct 30, 2012·1 cites·14 claims
- 4060US9048225B2Semiconductor device and method for manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2014·Granted Jun 2, 2015·1 cites·14 claims
- 4158US10134680B2Electronic part embedded substrate and method of producing an electronic part embedded substrateSHINKO ELECTRIC IND CO·Filed 2017·Granted Nov 20, 2018·0 cites·16 claims
- 4258US9451702B2Chip embedded substrate and method of producing the sameSHINKO ELECTRIC IND CO·Filed 2014·Granted Sep 20, 2016·0 cites·19 claims
- 4357US9768122B2Electronic part embedded substrate and method of producing an electronic part embedded substrateSHINKO ELECTRIC IND CO·Filed 2016·Granted Sep 19, 2017·0 cites·19 claims
- 4457US7811857B2Method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2005·Granted Oct 12, 2010·1 cites·9 claims
- 4557US7378732B2Semiconductor packageSHINKO ELECTRIC IND CO·Filed 2004·Granted May 27, 2008·10 cites·15 claims
- 4652US2009085222A1Electronic apparatus and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 4751US7985619B2Manufacturing method for semiconductor device embedded substrateSHINKO ELECTRIC IND CO·Filed 2009·Granted Jul 26, 2011·0 cites·5 claims
- 4851US7915078B2Manufacturing method for semiconductor device embedded substrateSHINKO ELECTRIC IND CO·Filed 2009·Granted Mar 29, 2011·0 cites·4 claims
- 4950US2006096781A1Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the sameYAMANO TAKAHARU·Filed 2005·Application pending·0 cites
- 5049US7981724B2Manufacturing method for semiconductor device embedded substrateSHINKO ELECTRIC IND CO·Filed 2009·Granted Jul 19, 2011·0 cites·4 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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