Electronic apparatus and manufacturing method thereof

Abstract

There are provided a plurality of semiconductor apparatuses judged as good items in electrical and functional inspections while having internal connection terminals disposed on electrode pads of semiconductor chips, resin layers which are disposed on surfaces of the semiconductor chips in which the electrode pads are formed and expose the internal connection terminals, and wiring patterns which are disposed on the resin layers and are connected to the internal connection terminals, a wiring substrate on which the plurality of semiconductor apparatuses are stepwise stacked, the wiring substrate electrically connected to the plurality of semiconductor apparatuses, and a sealing resin with which the plurality of semiconductor apparatuses are sealed.

1 . An electronic apparatus comprising:
 a plurality of semiconductor apparatuses, each of semiconductor apparatuses having a semiconductor chip having an electrode pad, an internal connection terminal disposed on the electrode pad, a resin layer which is disposed on a surface of the semiconductor chip in which the electrode pad is formed and expose the internal connection terminal, and a wiring pattern which is disposed on the resin layer and is connected to the internal connection terminal;   a wiring substrate on which the plurality of semiconductor apparatuses are stacked, the wiring substrate electrically connected to the plurality of semiconductor apparatuses through the wiring patterns; and   a sealing resin with which the plurality of semiconductor apparatuses stacked on the wiring substrate are sealed,   wherein the plurality of semiconductor apparatuses are semiconductor apparatuses judged as good items in electrical and functional inspections made before being stacked on the wiring substrate.   
     
     
         2 . An electronic apparatus as claimed in  claim 1 , wherein the wiring pattern has a connection part to which a metal wire is connected, and the plurality of semiconductor apparatuses and the wiring substrate are connected to each other through wire bonding. 
     
     
         3 . An electronic apparatus as claimed in  claim 2 , wherein the plurality of semiconductor apparatuses are stacked so as to expose the connection parts of the other semiconductor apparatuses. 
     
     
         4 . An electronic apparatus as claimed in  claim 2 , wherein a diffusion preventive film is disposed on the connection part, and the metal wire is connected to the diffusion preventive film. 
     
     
         5 . An electronic apparatus as claimed in  claim 1 , wherein the wiring pattern has an inspection pad for making the electrical and functional inspections of the semiconductor apparatus. 
     
     
         6 . An electronic apparatus as claimed in  claim 1 , wherein each of the plurality of semiconductor apparatuses has a dummy pattern made by the same material as that of the wiring pattern, the dummy pattern being disposed on the resin layer of a portion in which the wiring pattern is not disposed, the dummy pattern having a thickness set at substantially the same thickness as that of the wiring pattern. 
     
     
         7 . An electronic apparatus as claimed in  claim 1 , wherein the plurality of semiconductor apparatuses are stepwise stacked on the wiring substrate. 
     
     
         8 . A manufacturing method of an electronic apparatus comprising a plurality of semiconductor apparatuses, a wiring substrate on which the plurality of semiconductor apparatuses are stacked, and a sealing resin with which the plurality of semiconductor apparatuses stacked on the wiring substrate are sealed, comprising:
 a semiconductor apparatus formation step of forming the plurality of semiconductor apparatuses;   a good item semiconductor apparatus acquisition step of making electrical and functional inspections of the plurality of semiconductor apparatuses and acquiring a plurality of semiconductor apparatuses judged as good items;   a semiconductor apparatus stacking step of stacking the plurality of semiconductor apparatuses judged as the good items on the wiring substrate;   an electrical connection step of making electrical connection between the wiring substrate and the plurality of semiconductor apparatuses judged as the good items after the semiconductor apparatus stacking step; and   a sealing resin formation step of sealing the plurality of semiconductor apparatuses judged as the good items with the sealing resin after the electrical connection step.   
     
     
         9 . A manufacturing method of an electronic apparatus as claimed in  claim 8 , wherein the semiconductor apparatus formation step includes preparing semiconductor chips having electrode pads, forming internal connection terminals on the electrode pads, forming resin layers on surfaces of the semiconductor chips in which the electrode pads are formed so as to expose the internal connection terminals, and forming wiring patterns on the resin layers and connecting the wiring patterns to the internal connection terminals. 
     
     
         10 . A manufacturing method of an electronic apparatus as claimed in  claim 8 , wherein in the semiconductor apparatus staking step, the plurality of semiconductor apparatuses are stepwise stacked on the wiring substrate.