Inventor · disambiguated record
Jae Sik Lee
Also filed as: LEE JAE SIK
27 granted patents·11 pending applications·429 citations·filing 1996–2024
96Inventor score
Top patents by PatentIndex Score
38 records- 0199US9443824B1Cavity bridge connection for die split architectureQUALCOMM INC·Filed 2015·Granted Sep 13, 2016·102 cites·20 claims
- 0299US9368450B1Integrated device package comprising bridge in litho-etchable layerQUALCOMM INC·Filed 2015·Granted Jun 14, 2016·119 cites·30 claims
- 0396US9679855B1Polymer crack stop seal ring structure in wafer level packageQUALCOMM INC·Filed 2016·Granted Jun 13, 2017·20 cites·21 claims
- 0495US9401350B1Package-on-package (POP) structure including multiple diesQUALCOMM INC·Filed 2015·Granted Jul 26, 2016·13 cites·14 claims
- 0594US9595496B2Integrated device package comprising silicon bridge in an encapsulation layerQUALCOMM INC·Filed 2014·Granted Mar 14, 2017·17 cites·21 claims
- 0693US9583462B2Damascene re-distribution layer (RDL) in fan out split die applicationQUALCOMM INC·Filed 2015·Granted Feb 28, 2017·10 cites·10 claims
- 0792US9418877B2Integrated device comprising high density interconnects in inorganic layers and redistribution layers in organic layersQUALCOMM INC·Filed 2014·Granted Aug 16, 2016·14 cites·33 claims
- 0891US9472425B2Power distribution improvement using pseudo-ESR control of an embedded passive capacitorQUALCOMM INC·Filed 2015·Granted Oct 18, 2016·8 cites·14 claims
- 0990US9675432B2Method and apparatus for preparing removable dental prosthesisDENTCA INC·Filed 2014·Granted Jun 13, 2017·20 cites·21 claims
- 1089US9456963B2Photo-curable resin compositions and method of using the same in three-dimensional printing for manufacturing artificial teeth and denture baseDENTCA INC·Filed 2013·Granted Oct 4, 2016·15 cites·14 claims
- 1187US10568814B2Photo-curable resin compositions and method of using the same in three-dimensional printing for manufacturing artificial teeth and denture baseDENTCA INC·Filed 2017·Granted Feb 25, 2020·2 cites·19 claims
- 1287US10157823B2High density fan out package structureQUALCOMM INC·Filed 2015·Granted Dec 18, 2018·6 cites·17 claims
- 1386US9633950B1Integrated device comprising flexible connector between integrated circuit (IC) packagesQUALCOMM INC·Filed 2016·Granted Apr 25, 2017·5 cites·30 claims
- 1486US9613942B2Interposer for a package-on-package structureQUALCOMM INC·Filed 2015·Granted Apr 4, 2017·5 cites·28 claims
- 1583US9596768B2Substrate with conductive viasQUALCOMM INC·Filed 2014·Granted Mar 14, 2017·6 cites·23 claims
- 1681US10829339B2Friction shaft for slitterYUL RIM AIR SHAFT CO LTD·Filed 2019·Granted Nov 10, 2020·3 cites·17 claims
- 1781US10357435B2Photo-curable resin compositions and method of using the same in three-dimensional printing for manufacturing artificial teeth and denture baseDENTCA INC·Filed 2014·Granted Jul 23, 2019·2 cites·19 claims
- 1880US5640354ADynamic random access memory having self-test functionLG SEMICON CO LTD·Filed 1996·Granted Jun 17, 1997·47 cites·9 claims
- 1979US9595494B2Semiconductor package with high density die to die connection and method of making the sameQUALCOMM INC·Filed 2015·Granted Mar 14, 2017·3 cites·11 claims
- 2078US9355963B2Semiconductor package interconnections and method of making the sameQUALCOMM INC·Filed 2014·Granted May 31, 2016·4 cites·30 claims
- 2178US9230936B2Integrated device comprising high density interconnects and redistribution layersQUALCOMM INC·Filed 2014·Granted Jan 5, 2016·4 cites·24 claims
- 2273US9799628B2Stacked package configurations and methods of making the sameQUALCOMM INC·Filed 2016·Granted Oct 24, 2017·2 cites·14 claims
- 2368US10843886B2Friction shaft for slitterYUL RIM AIR SHAFT CO LTD·Filed 2019·Granted Nov 24, 2020·1 cites·14 claims
- 2464US2025065610A1Transparent Plastic Sheet for Blocking Ultraviolet and Infrared RaysIDEL CO LTD·Filed 2024·Application pending·0 cites
- 2562US9881859B2Substrate block for PoP packageQUALCOMM INC·Filed 2014·Granted Jan 30, 2018·1 cites·25 claims
- 2654US2016324730A1Photo-curable resin compositions and method of using the same in three-dimensional printing for manufacturing artificial teeth and denture baseDENTCA INC·Filed 2016·Application pending·0 cites
- 2752US9269610B2Pattern between pattern for low profile substrateQUALCOMM INC·Filed 2014·Granted Feb 23, 2016·0 cites·30 claims
- 2850US9466554B2Integrated device comprising via with side barrier layer traversing encapsulation layerQUALCOMM INC·Filed 2014·Granted Oct 11, 2016·0 cites·28 claims
- 2949US10049977B2Semiconductor package on package structure and method of forming the sameQUALCOMM INC·Filed 2014·Granted Aug 14, 2018·0 cites·5 claims
- 3048US2020282707A1Bulletproof PanelIDEL CO LTD·Filed 2019·Application pending·0 cites
- 3148US2016379959A1Cavity bridge connection for die split architectureQUALCOMM INC·Filed 2016·Application pending·0 cites
- 3246US2016141234A1Integrated device package comprising silicon bridge in photo imageable layerQUALCOMM INC·Filed 2014·Application pending·0 cites
- 3346US2016091532A1Flexible film electrical-test substrates with conductive coupling post(s) for integrated circuit (ic) bump(s) electrical testing, and related methods and testing apparatusesQUALCOMM INC·Filed 2014·Application pending·0 cites
- 3445US2012263607A1Air jet for removing polluting oilLEE JAE SIK·Filed 2010·Application pending·0 cites
- 3541US2012261350A1Method for Using Air to Remove Precipitated Contaminating OilLEE JAE SIK·Filed 2010·Application pending·0 cites
- 3640US2014252561A1Via-enabled package-on-packageQUALCOMM INC·Filed 2013·Application pending·0 cites
- 3736US2017243845A1Fan-out wafer-level packages with improved topologyQUALCOMM INC·Filed 2016·Application pending·0 cites
- 3834US2016225748A1Package-on-package (pop) structureQUALCOMM INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →