Inventor · disambiguated record
Shigehisa Motowaki
Also filed as: MOTOWAKI SHIGEHISA
18 granted patents·5 pending applications·163 citations·filing 1995–2015
94Inventor score
Top patents by PatentIndex Score
23 records- 0187US8314484B2Semiconductor device and method of manufacturing the sameKAJIWARA RYOICHI·Filed 2010·Granted Nov 20, 2012·9 cites·10 claims
- 0286US7586755B2Electronic circuit componentHITACHI LTD·Filed 2007·Granted Sep 8, 2009·11 cites·7 claims
- 0385US7183650B2Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrateRENESAS TECH CORP·Filed 2002·Granted Feb 27, 2007·30 cites·11 claims
- 0483US8629352B2Enameled insulated wire and manufacturing method thereofANDO YOSHIYUKI·Filed 2010·Granted Jan 14, 2014·4 cites·10 claims
- 0581US7520742B2Nanoprint equipment and method of making fine structureHITACHI LTD·Filed 2004·Granted Apr 21, 2009·30 cites·8 claims
- 0681US6840833B1Gas discharge type display panel and production method thereforHITACHI LTD·Filed 2000·Granted Jan 11, 2005·18 cites·14 claims
- 0775US7047052B2Cellular phone terminalHITACHI LTD·Filed 2002·Granted May 16, 2006·14 cites·8 claims
- 0873US8303854B2Sintering silver paste material and method for bonding semiconductor chipKAJIWARA RYOICHI·Filed 2011·Granted Nov 6, 2012·4 cites·4 claims
- 0964US7341441B2Nanoprint equipment and method of making fine structureHITACHI IND CO LTD·Filed 2004·Granted Mar 11, 2008·5 cites·6 claims
- 1062US8492202B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2012·Granted Jul 23, 2013·1 cites·10 claims
- 1161US7535106B2Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrateRENESAS TECH CORP·Filed 2007·Granted May 19, 2009·1 cites·2 claims
- 1259US9209044B2Metal-resin composite, method for producing the same, busbar, module case, and resinous connector partKAJIWARA RYOICHI·Filed 2011·Granted Dec 8, 2015·1 cites·6 claims
- 1359US7964975B2Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for themHITACHI LTD·Filed 2009·Granted Jun 21, 2011·1 cites·6 claims
- 1455US5764129ACeramic resistor, production method thereof, neutral grounding resistor and circuit breakerHITACHI LTD·Filed 1996·Granted Jun 9, 1998·12 cites·12 claims
- 1552US5610570AVoltage non-linear resistor and fabricating method thereofHITACHI LTD·Filed 1995·Granted Mar 11, 1997·11 cites·10 claims
- 1651US5614138AMethod of fabricating non-linear resistorHITACHI LTD·Filed 1995·Granted Mar 25, 1997·11 cites·13 claims
- 1746US8313983B2Fabrication method for resin-encapsulated semiconductor deviceKAJIWARA RYOICHI·Filed 2011·Granted Nov 20, 2012·0 cites·12 claims
- 1843US9136244B2Semiconductor package having a metal member and a resin mold, which are bonded to a silane coupling agent and an intermediate layer of an oxide filmHITACHI LTD·Filed 2012·Granted Sep 15, 2015·0 cites·11 claims
- 1943US2004031049A1Server and computer program for the serverFiled 2003·Application pending·0 cites
- 2043US2016010213A1Metal-resin composite, method for producing the same, busbar, module case, and resinous connector partHITACHI LTD·Filed 2015·Application pending·0 cites
- 2141US2004246692A1Electronic circuit componentFiled 2002·Application pending·0 cites
- 2234US2015221626A1Power Semiconductor ModuleHITACHI POWER SEMICONDUCTOR DEVICE LTD·Filed 2015·Application pending·0 cites
- 2330US2002053876A1Gas-discharge display panel, a display using the same, and a method of manufacturing the sameFiled 1998·Application pending·0 cites
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