Electronic circuit component

Abstract

Through an improvement of module size increase due to mounting a single passive element on a substrate and an increase in the mounting cost, to provide a highly reliable, high performance and small sized electronic circuit component which permits to integrate a variety of electronic parts such as capacitors, inductors and resistors in a high density with low cost. The electronic circuit component comprises an insulator substrate, a plurality of electrodes having different areas provided on the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a metal terminal part of a part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.

1 . An electronic circuit component comprising an insulator substrate, a plurality of electrodes having different areas provided on the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a metal terminal part of a part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.  
     
     
         2 . An electronic circuit component comprising an insulator substrate, a plurality of electrodes provided on the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a connecting portion provide at portions other than end portions of the electrodes, a metal wiring connecting the elements and the connecting portion, a metal terminal part of a part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.  
     
     
         3 . An electronic circuit component comprising an insulator substrate, a plurality of electrodes provided on the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a metal terminal part of a part of the metal wiring and being arranged in a grid shape and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.  
     
     
         4 . An electronic circuit component comprising an insulator substrate, a plurality of electrodes provided on the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a metal terminal part of a part of the metal wiring and a plurality of organic insulator materials covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.  
     
     
         5 . An electronic circuit component according to  claim 1 , wherein the distances between the capacitance element constituted by the plurality of the electrodes and the dielectric material sandwiched therebetween, the inductor element and the resistor element and the insulator substrate are differentiated.  
     
     
         6 . An electronic circuit component according to  claim 1 , wherein the insulator substrate is a glass substrate.  
     
     
         7 . An electronic circuit component according to  claim 1 , wherein the organic insulator material is a photosensitive organic insulator material.  
     
     
         8 . An electronic circuit component according to  claim 1 , wherein the organic insulator material is a low dielectric loss tangent resin composition which includes a bridging component having a plurality of styrene groups as expressed by the following general chemical formula and contains polymers having average molecular weight of more than 5000,  
       
         
           
           
               
               
           
         
       
       (Wherein, R represents a hydrocarbon skeleton, which may include a substituent, R1 represents one of hydrogen, methyl and ethyl, m represents 1 from 4 and n represents an integer more than 1).  
     
     
         9 . An electronic circuit component according to  claim 1 , wherein the organic insulator material is polyimide.  
     
     
         10 . An electronic circuit component according to  claim 1 , wherein the organic insulator material is BCB (Benzo Cyclo Butene).  
     
     
         11 . An electronic circuit component according to  claim 1 , wherein the dielectric material is an organic insulator material or an oxide of any one of Ta, Mg and Sr.  
     
     
         12 . An electronic circuit component comprising an insulator substrate at predetermined position of which through holes are provided, a plurality of electrodes having different areas provided on both faces of the main face and the sub-main face or one of the faces of the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a conductor portions formed inside the through holes for electrically connecting the metal wiring, a metal terminal part of a part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.  
     
     
         13 . An electronic circuit component comprising an insulator substrate at predetermined position of which through holes are provided, a plurality of electrodes having different areas provided on both faces of the main face and the sub-main face or one of the faces of the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, connecting portions provided at portions other than end portions of the electrodes, a metal wiring connecting the elements and the connecting portions, a conductor portions formed inside the through holes for electrically connecting the metal wiring, a metal terminal part of a part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.  
     
     
         14 . An electronic circuit component comprising an insulator substrate at predetermined position of which through holes are provided, a plurality of electrodes having different areas provided on both faces of the main face and the sub-main face or one of the faces of the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a conductor portions formed inside the through holes for electrically connecting the metal wiring, a metal terminal part of a part of the metal wiring and being arranged in a grid shape and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.  
     
     
         15 . An electronic circuit component comprising an insulator substrate at predetermined position of which through holes are provided, a plurality of electrodes provided on both faces of the main face and the sub-main face or one of the faces of the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a conductor portions formed inside the through holes for electrically connecting the metal wiring, a metal terminal part of a part of the metal wiring and a plurality of organic insulator materials covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.  
     
     
         16 . An electronic circuit component comprising an insulator substrate at predetermined position of which through holes are provided, a plurality of electrodes provided on both faces of the main face and the sub-main face or one of the faces of the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a conductor portions formed inside the through holes for electrically connecting the metal wiring, a metal terminal part of a part of the metal wiring, a first organic insulator material covering the elements provided on the main face of the insulator substrate and the circumference of the metal wiring portion excluding the metal terminal portion and a second organic insulator material covering the elements provided on the sub-main of the insulator substrate and the circumference of the metal wiring portion excluding the metal terminal portion.  
     
     
         17 . An electronic circuit component comprising an insulator substrate at predetermined position of which through holes are provided, a plurality of electrodes provided on both faces of the main face and the sub-main face or one of the faces of the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a conductor portions formed inside the through holes for electrically connecting the metal wiring, a metal terminal part of a part of the metal wiring and being provided on the other face where the inductor element is provided and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.  
     
     
         18 . An electronic circuit component comprising an insulator substrate at predetermined position of which through holes are provided, a plurality of electrodes provided on both faces of the main face and the sub-main face or one of the faces of the insulator substrate, one or more elements selected from a capacitor element of dielectric material sandwiched between the electrodes, an inductor element and resistor element, a metal wiring connecting the elements, a conductor portions constituted of a conductive material, core forming material and glass and formed inside the through holes for electrically connecting the metal wiring, a metal terminal part of a part of the metal wiring and an organic insulator material covering the elements and the circumference of the metal wiring portion excluding the metal terminal portion.  
     
     
         19 . An electronic circuit component according to  claim 12 , wherein the distances between the capacitance element constituted by the plurality of the electrodes and the dielectric material sandwiched therebetween, the inductor element and the resistor element and the insulator substrate are differentiated.  
     
     
         20 . An electronic circuit component according to  claim 12 , wherein the insulator substrate is a glass substrate.  
     
     
         21 . An electronic circuit component according to  claim 12 , wherein the organic insulator material is a photosensitive organic insulator material.  
     
     
         22 . An electronic circuit component according to  claim 12 , wherein the organic insulator material is a low dielectric loss tangent resin composition which includes a bridging component having a plurality of styrene groups as expressed by the following general chemical formula and contains polymers having average molecular weight of more than 5000,  
       
         
           
           
               
               
           
         
       
       (Wherein, R represents a hydrocarbon skeleton, which may include a substituent, R1 represents one of hydrogen, methyl and ethyl, m represents 1 from 4 and n represents an integer more than 1).  
     
     
         23 . An electronic circuit component according to  claim 12 , wherein the organic insulator material is polyimide.  
     
     
         24 . An electronic circuit component according to  claim 12 , wherein the organic insulator material is BCB (Benzo Cyclo Butene).  
     
     
         25 . An electronic circuit component according to  claim 12 , wherein the dielectric material is an organic insulator material or an oxide of any one of Ta, Mg and Sr.