US2016010213A1PendingUtilityA1

Metal-resin composite, method for producing the same, busbar, module case, and resinous connector part

Assignee: HITACHI LTDPriority: Dec 1, 2010Filed: Sep 18, 2015Published: Jan 14, 2016
Est. expiryDec 1, 2030(~4.4 yrs left)· nominal 20-yr term from priority
H10W 74/127H10W 74/00H10W 72/5524H10W 72/5363H10W 72/884H10W 76/136H10W 76/47H10W 74/476H10W 74/01H10W 40/255C23C 16/56Y10T428/12472Y10T428/12458C22F 1/165C22F 1/10
43
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

Provided are a metal-resin composite having excellent adhesive strength, a method for producing the same, a busbar, a module case, and a resinous connector part. The metal-resin composite comprises a metallic member 1 including a metal with a high melting point of 500° C. or more, a resin member 2 being integrated with the metallic member 1 ; and an alloy layer 3 including a metal with a low melting point lower than 500° C. The alloy layer 3 is arranged between the metallic member 1 and the resin member 2 , and has average surface roughness thereof in the range from 5 nm or more to less than 1 μm at the interface between the alloy layer 3 and the resin member 2 . Herein, a period of the unevenness formed on the interface of the alloy layer 3 is in the range from 5 nm or more to less than 1 μm.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
         1 . A method for producing a metal-resin composite integrating a metallic member including a metal having a high melting point of 500° C. or more with a resin member, the method comprising the steps of:
 forming a thin film on a surface of the metallic member, the thin film including a metal with a low melting point less than 500° C. and having a thickness thereof in the range from 30 nm or more to 5 μm or less; 
 forming an alloy layer in which the metallic member having the thin film thus formed is heat-treated under heating conditions without melting the thin film in a non-oxidation atmosphere or a reduction atmosphere, thereby to mutually diffuse the metal with a high melting point and the metal with a low melting point; and 
 forming a resin member on a surface of the alloy layer. 
 
     
     
         2 . The method for producing a metal-resin composite as described in  claim 1 , further comprising the steps of:
 cleaning the surface of the metallic member before the step of forming the thin film; and   removing a metal with a low melting point after the step of forming the alloy layer and before the step of forming the resin, by removing the remaining metal with a low melting point and an oxide of the metal with a low melting point.   
     
     
         3 . The method for producing a metal-resin composite as described in  claim 2 , wherein the step of forming the thin film is conducted by at least anyone of electroplating, physical vapor deposition, or chemical vapor deposition. 
     
     
         4 . The method for producing a metal-resin composite as described in  claim 3 , wherein the step of forming the resin is conducted by transfer molding or potting molding of a thermosetting resin, or injection molding of a thermoplastic resin.

Join the waitlist — get patent alerts

Track US2016010213A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.