Inventor · disambiguated record
Michael Liehr
Also filed as: LIEHR MICHAEL
19 granted patents·5 pending applications·317 citations·filing 1988–2014
95Inventor score
Top patents by PatentIndex Score
24 records- 0184US6340630B1Method for making interconnect for low temperature chip attachmentIBM·Filed 2000·Granted Jan 22, 2002·28 cites·18 claims
- 0281US8697542B2Method for thin die-to-wafer bondingPASCUAL DANIEL·Filed 2012·Granted Apr 15, 2014·11 cites·18 claims
- 0380US6127735AInterconnect for low temperature chip attachmentIBM·Filed 1996·Granted Oct 3, 2000·41 cites·15 claims
- 0476US6566612B2Method for direct chip attach by solder bumps and an underfill layerIBM·Filed 2002·Granted May 20, 2003·20 cites·8 claims
- 0573US5897336ADirect chip attach for low alpha emission interconnect systemIBM·Filed 1997·Granted Apr 27, 1999·42 cites·43 claims
- 0669US6416292B1Method for transporting at least one vaporous substance through the wall of a vacuum chamber and into the vacuum chamber and a device for executing and utilizing the methodLEYBOLD SYSTEMS GMBH·Filed 2000·Granted Jul 9, 2002·9 cites·13 claims
- 0763US6487986B1Device for the plasma deposition of a polycrystalline diamondUNAXIS DEUTSCHLAND HOLDING·Filed 1999·Granted Dec 3, 2002·26 cites·2 claims
- 0862US4794863AMotive structure for transporting workpiecesIBM·Filed 1988·Granted Jan 3, 1989·19 cites·5 claims
- 0959US6341418B1Method for direct chip attach by solder bumps and an underfill layerIBM·Filed 1999·Granted Jan 29, 2002·21 cites·23 claims
- 1055US6191532B1Arrangement for producing plasmaLEYBOLD SYSTEMS GMBH·Filed 1999·Granted Feb 20, 2001·11 cites·4 claims
- 1154US8969200B2Apparatus and method for integration of through substrate viasHEBDING JEREMIAH·Filed 2012·Granted Mar 3, 2015·2 cites·17 claims
- 1254US5900065AApparatus for the plasma-chemical deposition of polycrystalline diamondLEYBOLD SYSTEMS GMBH·Filed 1997·Granted May 4, 1999·11 cites·7 claims
- 1352US6194835B1Device for producing plasmaLEYBOLD SYSTEMS GMBH·Filed 1998·Granted Feb 27, 2001·24 cites·25 claims
- 1451US2007095281A1System and method for power function ramping of microwave liner discharge sourcesSTOWELL MICHAEL W·Filed 2005·Application pending·0 cites
- 1551US2007190808A1Low-k dielectric layers for large substratesSTOWELL MICHAEL W·Filed 2006·Application pending·0 cites
- 1651US2008113108A1System and method for control of electromagnetic radiation in pecvd discharge processesSTOWELL MICHAEL W·Filed 2006·Application pending·0 cites
- 1750US6242053B1Process for coating plastic containers or glass containers by means of a PCVD coating processLEYBOLD SYSTEMS GMBH·Filed 1998·Granted Jun 5, 2001·16 cites·2 claims
- 1849US6077407ASputtering cathode based on the magnetron principleLEYBOLD SYSTEMS GMBH·Filed 1999·Granted Jun 20, 2000·11 cites·13 claims
- 1945US2006032737A1Magnetron sputtering device, a cylindrical cathode and a method of coating thin multicomponent films on a substrateAPPLIED FILMS GMBH & CO KG·Filed 2005·Application pending·0 cites
- 2044US6126792AMethod for the application of a scratch protection layer and an antireflection coating system and apparatus for its executionLEYBOLD SYSTEMS GMBH·Filed 1999·Granted Oct 3, 2000·10 cites·5 claims
- 2142US10186401B2Plasma-chemical coating apparatusW & L COATING SYSTEMS GMBH·Filed 2014·Granted Jan 22, 2019·0 cites·14 claims
- 2238US6175183B1Device for producing plasmaLEYBOLD SYSTEMS GMBH·Filed 1999·Granted Jan 16, 2001·8 cites·5 claims
- 2337US6161501ADevice for plasma generationLEYBOLD SYSTEMS GMBH·Filed 1998·Granted Dec 19, 2000·7 cites·4 claims
- 2437US2003000826A1Method for the production of gas- and liquid-impermeable layers on a substrateFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →