Inventor · disambiguated record
Yi-Fang Cheng
Also filed as: CHENG YI-FANG
7 granted patents·5 pending applications·122 citations·filing 2000–2022
86Inventor score
Top patents by PatentIndex Score
12 records- 0188US6593185B1Method of forming embedded capacitor structure applied to logic integrated circuitUNITED MICROELECTRONICS CORP·Filed 2002·Granted Jul 15, 2003·45 cites·6 claims
- 0283US6638830B1Method for fabricating a high-density capacitorUNITED MICROELECTRONICS CORP·Filed 2002·Granted Oct 28, 2003·32 cites·19 claims
- 0373US6440861B1Method of forming dual damascene structureUNITED MICROELECTRONICS CORP·Filed 2000·Granted Aug 27, 2002·21 cites·15 claims
- 0458US7514365B2Method of fabricating opening and plugUNITED MICROELECTRONICS CORP·Filed 2005·Granted Apr 7, 2009·2 cites·19 claims
- 0558US6350681B1Method of forming dual damascene structureUNITED MICROELECTRONICS CORP·Filed 2001·Granted Feb 26, 2002·9 cites·18 claims
- 0654US7199059B2Method for removing polymer as etching residueUNITED MICROELECTRONICS CORP·Filed 2004·Granted Apr 3, 2007·8 cites·19 claims
- 0752US6521545B1Method of a surface treatment on a fluorinated silicate glass filmUNITED MICROELECTRONICS CORP·Filed 2001·Granted Feb 18, 2003·5 cites·11 claims
- 0852US2024139199A1Use of adenine in preparation of drug for treating diabetic ulcersENERGENESIS BIOMEDICAL CO LTD·Filed 2022·Application pending·0 cites
- 0944US2008311743A1Method of fabricating opening and plugUNITED MICROELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 1040US2006138925A1Plasma processing device having a ring-shaped air chamber for heat dissipationCHENG YI-FANG·Filed 2004·Application pending·0 cites
- 1137US2003213990A1Embedded capacitor structure applied to logic integrated circuitUNITED MICROELECTRONICS CORP·Filed 2003·Application pending·0 cites
- 1237US2005176237A1In-situ liner formation during reactive ion etchFiled 2004·Application pending·0 cites
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