Inventor · disambiguated record
Seung-Pil Chung
Also filed as: CHUNG SEUNG-PIL
31 granted patents·7 pending applications·805 citations·filing 2000–2019
97Inventor score
Top patents by PatentIndex Score
38 records- 0197US6767834B2Method of manufacturing a contact of a semiconductor device using cluster apparatus having at least one plasma pretreatment moduleSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jul 27, 2004·198 cites·29 claims
- 0296US9865540B2Vertical memory devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 9, 2018·26 cites·19 claims
- 0396US7488688B2Method of removing oxide layer and semiconductor manufacturing apparatus for removing oxide layerSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Feb 10, 2009·250 cites·19 claims
- 0494US7540970B2Methods of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 2, 2009·27 cites·23 claims
- 0593US6513538B2Method of removing contaminants from integrated circuit substrates using cleaning solutionsSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Feb 4, 2003·95 cites·20 claims
- 0692US9978756B2Semiconductor chips and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 22, 2018·9 cites·20 claims
- 0788US6534921B1Method for removing residual metal-containing polymer material and ion implanted photoresist in atmospheric downstream plasma jet systemSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Mar 18, 2003·45 cites·26 claims
- 0887US7402488B2Method of manufacturing a semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jul 22, 2008·13 cites·49 claims
- 0985US8541306B2Semiconductor device and method of double photolithography process for forming patterns of the semiconductor deviceYANG SONG-YI·Filed 2011·Granted Sep 24, 2013·12 cites·20 claims
- 1084US7384843B2Method of fabricating flash memory device including control gate extensionsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jun 10, 2008·12 cites·27 claims
- 1183US9502427B2Non-volatile memory device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 22, 2016·5 cites·15 claims
- 1283US6793767B2Wafer stage including electrostatic chuck and method for dechucking wafer using the wafer stageSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 21, 2004·26 cites·13 claims
- 1382US10319864B2Vertical memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 11, 2019·3 cites·14 claims
- 1481US10749042B2Vertical memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 18, 2020·3 cites·19 claims
- 1581US7303957B2Method of fabricating a flash memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Dec 4, 2007·7 cites·19 claims
- 1680US7560386B2Method of manufacturing nonvolatile semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 14, 2009·12 cites·24 claims
- 1774US7897512B2Methods of forming integrated circuit devices including a multi-layer structure with a contact extending therethroughSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Mar 1, 2011·5 cites·21 claims
- 1872US7242054B2Nonvolatile memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jul 10, 2007·3 cites·12 claims
- 1970US6537876B2Method of manufacturing a semiconductor capacitor having a hemispherical grain layer using a dry cleaning processSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Mar 25, 2003·15 cites·21 claims
- 2067US7510934B2Methods of fabricating nonvolatile memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 31, 2009·2 cites·15 claims
- 2167US7098135B2Semiconductor device including bit line formed using damascene technique and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 29, 2006·9 cites·11 claims
- 2265US8765572B2Method of fabricating semiconductor deviceCHOI YONG-LACK·Filed 2011·Granted Jul 1, 2014·3 cites·19 claims
- 2364US6562651B2Method of manufacturing a semiconductor device having contact padsSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted May 13, 2003·15 cites·16 claims
- 2463US7585718B2Method of manufacturing a carbon nano-tube transistorSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 8, 2009·2 cites·20 claims
- 2561US8883588B2Semiconductor devices and methods of manufacturing the semiconductor devicesAHN SUNG-SOO·Filed 2012·Granted Nov 11, 2014·2 cites·16 claims
- 2660US7618899B2Method of patterning a matrix into a substrate via multiple, line-and-space, sacrificial, hard mask layersSAMSUNG ELECTROIC CO LTD·Filed 2007·Granted Nov 17, 2009·2 cites·28 claims
- 2756US8258610B2Integrated circuit devices including a multi-layer structure with a contact extending therethroughCHO HONG·Filed 2011·Granted Sep 4, 2012·1 cites·14 claims
- 2854US7258811B2Wafer stage including electrostatic chuck and method for dechucking wafer using the wafer stageSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Aug 21, 2007·3 cites·3 claims
- 2953US2008048340A1Semiconductor device having fine pattern wiring lines integrally formed with contact plug and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3051US9806204B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 31, 2017·0 cites·16 claims
- 3150US2006205190A1Semiconductor etching apparatus and method of etching semiconductor devices using sameCHI KYEONG-KOO·Filed 2006·Application pending·0 cites
- 3250US2006284277A1Semiconductor device including bit line formed using damascene technique and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 3348US8361904B2Semiconductor device having fine pattern wiring lines integrally formed with contact plug and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Jan 29, 2013·0 cites·7 claims
- 3443US2008076071A1Method of forming a fine patternSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 3542US2003116277A1Semiconductor etching apparatus and method of etching semiconductor devices using sameFiled 2003·Application pending·0 cites
- 3640US2009008701A1Nonvolatile memory device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 3740US2002025681A1Semiconductor etching apparatus and method of etching semiconductor devices using sameFiled 2001·Application pending·0 cites
- 3836US7776644B2Phase change memory cell and method and system for forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 17, 2010·0 cites·5 claims
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