Inventor · disambiguated record
Yoshitaka Fukuoka
Also filed as: FUKUOKA YOSHITAKA
26 granted patents·2 pending applications·900 citations·filing 1983–2016
97Inventor score
Files withTOSHIBA KK12DAINIPPON PRINTING CO LTD6INVENSAS CORP3TESSERA INTERCONNECT MATERIALS3D T CIRCUIT TECHNOLOGY CO LTD1
Top patents by PatentIndex Score
28 records- 0194US6872893B2Wiring board provided with passive element and cone shaped bumpsDAINIPPON PRINTING CO LTD·Filed 2002·Granted Mar 29, 2005·59 cites·16 claims
- 0294US6353189B1Wiring board, wiring board fabrication method, and semiconductor packageTOSHIBA KK·Filed 1998·Granted Mar 5, 2002·245 cites·18 claims
- 0391US6237218B1Method and apparatus for manufacturing multilayered wiring board and multi-layered wiring boardTOSHIBA KK·Filed 1998·Granted May 29, 2001·76 cites·22 claims
- 0491US5949654AMulti-chip module, an electronic device, and production method thereofTOSHIBA KK·Filed 1998·Granted Sep 7, 1999·128 cites·20 claims
- 0589US5818699AMulti-chip module and production method thereofTOSHIBA KK·Filed 1996·Granted Oct 6, 1998·106 cites·28 claims
- 0685US8198541B2Electronic component built-in wiring board and method for radiating heat generated at the sameSASAOKA KENJI·Filed 2007·Granted Jun 12, 2012·14 cites·9 claims
- 0785US7679925B2Method for fabricating wiring board provided with passive element, and wiring board provided with passive elementDAINIPPON PRINTING CO LTD·Filed 2006·Granted Mar 16, 2010·10 cites·2 claims
- 0884US7100276B2Method for fabricating wiring board provided with passive elementD T CIRCUIT TECHNOLOGY CO LTD·Filed 2004·Granted Sep 5, 2006·28 cites·27 claims
- 0981US7342802B2Multilayer wiring board for an electronic deviceTESSERA INTERCONNECT MATERIALS·Filed 2004·Granted Mar 11, 2008·20 cites·26 claims
- 1080US7242591B2Wiring board incorporating components and process for producing the sameDAINIPPON PRINTING CO LTD·Filed 2003·Granted Jul 10, 2007·21 cites·7 claims
- 1176US7345888B2Component built-in wiring board and manufacturing method of component built-in wiring boardDAINIPPON PRINTING CO LTD·Filed 2007·Granted Mar 18, 2008·5 cites·2 claims
- 1273US7772684B2Electronic device and production method thereofDAINIPPON PRINTING CO LTD·Filed 2004·Granted Aug 10, 2010·17 cites·6 claims
- 1372US6388321B1Anisotropic conductive film and resin filling gap between a flip-chip and circuit boardTOSHIBA KK·Filed 2000·Granted May 14, 2002·18 cites·16 claims
- 1469US5737833AMethod of producing a high-density printed wiring board for mountingTOSHIBA KK·Filed 1995·Granted Apr 14, 1998·34 cites·3 claims
- 1568US6705003B2Printed wiring board with plurality of interconnect patterns and conductor bumpsTOSHIBA KK·Filed 2001·Granted Mar 16, 2004·13 cites·8 claims
- 1667US5915753AMethod of producing a high-density printed wiring board for mountingTOSHIBA KK·Filed 1998·Granted Jun 29, 1999·30 cites·5 claims
- 1758US10104785B2Multilayer wiring board for an electronic deviceINVENSAS CORP·Filed 2016·Granted Oct 16, 2018·0 cites·20 claims
- 1858US9521755B2Multilayer wiring board for an electronic deviceINVENSAS CORP·Filed 2014·Granted Dec 13, 2016·0 cites·19 claims
- 1956US5532906AWiring substrateTOSHIBA KK·Filed 1995·Granted Jul 2, 1996·24 cites·6 claims
- 2056US5153709AElectronic apparatusTOSHIBA KK·Filed 1992·Granted Oct 6, 1992·25 cites·11 claims
- 2156US2013247372A1Multilayer wiring board for an electronic deviceINVENSAS CORP·Filed 2013·Application pending·0 cites
- 2254US7644497B2Component built-in wiring board and manufacturing method of component built-in wiring boardDAINIPPON PRINTING CO LTD·Filed 2008·Granted Jan 12, 2010·0 cites·15 claims
- 2353US2008296254A1Multilayer wiring board for an electronic deviceTESSERA INTERCONNECT MATERIALS·Filed 2008·Application pending·0 cites
- 2452US7505281B2Multilayer wiring board for an electronic deviceTESSERA INTERCONNECT MATERIALS·Filed 2007·Granted Mar 17, 2009·0 cites·21 claims
- 2543US8114714B2Electronic device and production method thereofKURAMOCHI SATORU·Filed 2007·Granted Feb 14, 2012·0 cites·34 claims
- 2642US4517738AMethod for packaging electronic partsTOKYO SHIBAURA ELECTRIC CO·Filed 1983·Granted May 21, 1985·13 cites·11 claims
- 2740US4639830APackaged electronic deviceTOSHIBA KK·Filed 1985·Granted Jan 27, 1987·9 cites·5 claims
- 2833US5169493AMethod of manufacturing a thick film resistor elementTOSHIBA KK·Filed 1990·Granted Dec 8, 1992·5 cites·9 claims
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