Inventor · disambiguated record
Isoroku Ono
Also filed as: ONO ISOROKU
9 granted patents·1 pending application·114 citations·filing 2001–2010
88Inventor score
Top patents by PatentIndex Score
10 records- 0193US7713842B2Method for producing bonded waferSUMCO CORP·Filed 2008·Granted May 11, 2010·31 cites·4 claims
- 0292US7781309B2Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the methodSUMCO CORP·Filed 2006·Granted Aug 24, 2010·30 cites·20 claims
- 0380US7470169B2Method of polishing semiconductor wafers by using double-sided polisherSUMITOMO MITSUBISHI SILICON·Filed 2001·Granted Dec 30, 2008·26 cites·5 claims
- 0478US7855129B2Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the methodSUMCO CORP·Filed 2010·Granted Dec 21, 2010·5 cites·2 claims
- 0572US8283252B2Method of manufacturing semiconductor waferTANIGUCHI TORU·Filed 2009·Granted Oct 9, 2012·4 cites·4 claims
- 0669US7589023B2Method of manufacturing semiconductor waferSUMITOMO MITSUBISHI SILICON·Filed 2001·Granted Sep 15, 2009·13 cites·9 claims
- 0763US7718507B2Bonded wafer and method of producing the sameSUMCO CORP·Filed 2007·Granted May 18, 2010·4 cites·9 claims
- 0856US7829436B2Process for regeneration of a layer transferred wafer and regenerated layer transferred waferSUMCO CORP·Filed 2006·Granted Nov 9, 2010·1 cites·15 claims
- 0941US7951716B2Wafer and method of producing the sameSUMCO CORP·Filed 2007·Granted May 31, 2011·0 cites·9 claims
- 1041US2007148917A1Process for Regeneration of a Layer Transferred Wafer and Regenerated Layer Transferred WaferSUMCO CORP·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →