Inventor · disambiguated record
Shinji Okawa
Also filed as: OKAWA SHINJI
5 granted patents·4 pending applications·44 citations·filing 1999–2024
76Inventor score
Top patents by PatentIndex Score
9 records- 0192US7781309B2Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the methodSUMCO CORP·Filed 2006·Granted Aug 24, 2010·30 cites·20 claims
- 0278US7855129B2Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the methodSUMCO CORP·Filed 2010·Granted Dec 21, 2010·5 cites·2 claims
- 0366US2024374363A1Electric toothbrushMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0462US2024157539A1Handle, hair dryer, facial care device, and hair ironMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0560US2024157588A1Handle, shaver, hair dryer, hair styling iron, hairbrush, and eyelash curlerMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0656US11946847B2Extracellular potential measurement deviceNOK CORP·Filed 2020·Granted Apr 2, 2024·0 cites·14 claims
- 0756US7829436B2Process for regeneration of a layer transferred wafer and regenerated layer transferred waferSUMCO CORP·Filed 2006·Granted Nov 9, 2010·1 cites·15 claims
- 0841US2007148917A1Process for Regeneration of a Layer Transferred Wafer and Regenerated Layer Transferred WaferSUMCO CORP·Filed 2006·Application pending·0 cites
- 0938US6255664B1Sensor for measuring degree of flatnessSUPER SILICON CRYSTAL RES INST·Filed 1999·Granted Jul 3, 2001·8 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →