Inventor · disambiguated record
Aaron Eppler
Also filed as: EPPLER AARON
18 granted patents·2 pending applications·464 citations·filing 2000–2022
94Inventor score
Top patents by PatentIndex Score
20 records- 0199US6391787B1Stepped upper electrode for plasma processing uniformityLAM RES CORP·Filed 2000·Granted May 21, 2002·153 cites·29 claims
- 0298US6824627B2Stepped upper electrode for plasma processing uniformityLAM RES CORP·Filed 2002·Granted Nov 30, 2004·104 cites·15 claims
- 0395US12334354B2Sidewall passivation for plasma etchingAPPLIED MATERIALS INC·Filed 2022·Granted Jun 17, 2025·2 cites·19 claims
- 0494US6921724B2Variable temperature processes for tunable electrostatic chuckLAM RES CORP·Filed 2002·Granted Jul 26, 2005·102 cites·26 claims
- 0593US10446394B2Spacer profile control using atomic layer deposition in a multiple patterning processLAM RES CORP·Filed 2018·Granted Oct 15, 2019·8 cites·22 claims
- 0685US9018103B2High aspect ratio etch with combination maskLAM RES CORP·Filed 2013·Granted Apr 28, 2015·5 cites·16 claims
- 0784US7405521B2Multiple frequency plasma processor method and apparatusLAM RES CORP·Filed 2003·Granted Jul 29, 2008·35 cites·45 claims
- 0880US7645707B2Etch profile controlLAM RES CORP·Filed 2005·Granted Jan 12, 2010·7 cites·7 claims
- 0978US7547635B2Process for etching dielectric films with improved resist and/or etch profile characteristicsLAM RES CORP·Filed 2002·Granted Jun 16, 2009·21 cites·22 claims
- 1077US7682480B2Photoresist conditioning with hydrogen rampingLAM RES CORP·Filed 2006·Granted Mar 23, 2010·5 cites·15 claims
- 1167US9659783B2High aspect ratio etch with combination maskLAM RES CORP·Filed 2015·Granted May 23, 2017·1 cites·16 claims
- 1262US7135410B2Etch with rampingLAM RES CORP·Filed 2003·Granted Nov 14, 2006·12 cites·17 claims
- 1360US7053003B2Photoresist conditioning with hydrogen rampingLAM RES CORP·Filed 2004·Granted May 30, 2006·9 cites·20 claims
- 1453US12237149B2Reducing aspect ratio dependent etch with direct current bias pulsingAPPLIED MATERIALS INC·Filed 2022·Granted Feb 25, 2025·0 cites·19 claims
- 1547US2010327413A1Hardmask open and etch profile control with hardmask openLAM RES CORP·Filed 2008·Application pending·0 cites
- 1646US10242883B2High aspect ratio etch of oxide metal oxide metal stackLAM RES CORP·Filed 2017·Granted Mar 26, 2019·0 cites·18 claims
- 1742US7544521B1Negative bias critical dimension trimLAM RES CORP·Filed 2006·Granted Jun 9, 2009·0 cites·12 claims
- 1840US9899227B2System, method and apparatus for ion milling in a plasma etch chamberLAM RES CORP·Filed 2013·Granted Feb 20, 2018·0 cites·10 claims
- 1934US2017040170A1Systems and Methods for Separately Applying Charged Plasma Constituents and Ultraviolet Light in a Mixed Mode Processing OperationLAM RES CORP·Filed 2015·Application pending·0 cites
- 2033US10763142B2System and method for determining field non-uniformities of a wafer processing chamber using a wafer processing parameterLAM RES CORP·Filed 2015·Granted Sep 1, 2020·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →