Inventor · disambiguated record
Robert W. Fiordalice
Also filed as: FIORDALICE ROBERT · FIORDALICE ROBERT W · FIORDALICE ROBERT WILLIAM
25 granted patents·2 pending applications·1,993 citations·filing 1993–2007
98Inventor score
Top patents by PatentIndex Score
27 records- 0196US6538730B2Defect detection systemKLA TENCOR TECH CORP·Filed 2001·Granted Mar 25, 2003·139 cites·65 claims
- 0296US5391517AProcess for forming copper interconnect structureMOTOROLA INC·Filed 1993·Granted Feb 21, 1995·300 cites·15 claims
- 0395US6218302B1Method for forming a semiconductor deviceMOTOROLA INC·Filed 1998·Granted Apr 17, 2001·222 cites·22 claims
- 0495US5578523AMethod for forming inlaid interconnects in a semiconductor deviceMOTOROLA INC·Filed 1995·Granted Nov 26, 1996·201 cites·21 claims
- 0592US5534462AMethod for forming a plug and semiconductor device having the sameMOTOROLA INC·Filed 1995·Granted Jul 9, 1996·135 cites·25 claims
- 0689US5814557AMethod of forming an interconnect structureMOTOROLA INC·Filed 1996·Granted Sep 29, 1998·124 cites·7 claims
- 0788US6187682B1Inert plasma gas surface cleaning process performed insitu with physical vapor deposition (PVD) of a layer of materialMOTOROLA INC·Filed 1998·Granted Feb 13, 2001·94 cites·21 claims
- 0888US5801098AMethod of decreasing resistivity in an electrically conductive layerMOTOROLA INC·Filed 1996·Granted Sep 1, 1998·103 cites·20 claims
- 0988US5677231AMethod for providing trench isolationMOTOROLA INC·Filed 1996·Granted Oct 14, 1997·66 cites·14 claims
- 1088US5652176AMethod for providing trench isolation and borderless contactMOTOROLA INC·Filed 1995·Granted Jul 29, 1997·67 cites·13 claims
- 1187US5420072AMethod for forming a conductive interconnect in an integrated circuitMOTOROLA INC·Filed 1994·Granted May 30, 1995·101 cites·20 claims
- 1285US6862096B2Defect detection systemKLA TENCOR CORP·Filed 2003·Granted Mar 1, 2005·22 cites·5 claims
- 1382US6949457B1Barrier enhancementKLA TENCOR TECH CORP·Filed 2004·Granted Sep 27, 2005·28 cites·16 claims
- 1482US5358615AProcess for forming a sputter deposited metal filmMOTOROLA INC·Filed 1993·Granted Oct 25, 1994·54 cites·10 claims
- 1581US5525542AMethod for making a semiconductor device having anti-reflective coatingMOTOROLA INC·Filed 1995·Granted Jun 11, 1996·65 cites·17 claims
- 1680US7453274B1Detection of defects using transient contrastKLA TENCOR TECH CORP·Filed 2007·Granted Nov 18, 2008·12 cites·13 claims
- 1779US7226856B1Nano-electrode-array for integrated circuit interconnectsKLA TENCOR TECH CORP·Filed 2004·Granted Jun 5, 2007·23 cites·8 claims
- 1876US5358901AProcess for forming an intermetallic layerMOTOROLA INC·Filed 1993·Granted Oct 25, 1994·53 cites·36 claims
- 1974US5633199AProcess for fabricating a metallized interconnect structure in a semiconductor deviceMOTOROLA INC·Filed 1995·Granted May 27, 1997·49 cites·7 claims
- 2068US5429989AProcess for fabricating a metallization structure in a semiconductor deviceMOTOROLA INC·Filed 1994·Granted Jul 4, 1995·40 cites·15 claims
- 2160US5783485AProcess for fabricating a metallized interconnectMOTOROLA INC·Filed 1996·Granted Jul 21, 1998·27 cites·16 claims
- 2259US6077768AProcess for fabricating a multilevel interconnectMOTOROLA INC·Filed 1996·Granted Jun 20, 2000·24 cites·14 claims
- 2359US5580823AProcess for fabricating a collimated metal layer and contact structure in a semiconductor deviceMOTOROLA INC·Filed 1994·Granted Dec 3, 1996·33 cites·6 claims
- 2452US2005018181A1Defect detection systemFiled 2004·Application pending·0 cites
- 2548US7446416B2Barrier material formation in integrated circuit structuresKLA TENCOR CORP·Filed 2005·Granted Nov 4, 2008·0 cites·2 claims
- 2648US2007284746A1Nano-electrode-array for integrated circuit interconnectsKLA TENCOR TECH CORP·Filed 2007·Application pending·0 cites
- 2743US6218733B1Semiconductor device having a titanium-aluminum compoundMOTOROLA INC·Filed 1994·Granted Apr 17, 2001·11 cites·6 claims
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