Inventor · disambiguated record
Jin Yong An
Also filed as: AN JIN Y · AN JIN YONG
10 granted patents·16 pending applications·62 citations·filing 1993–2013
87Inventor score
Top patents by PatentIndex Score
26 records- 0190US7707715B2Method of fabricating multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Granted May 4, 2010·18 cites·21 claims
- 0288US8207450B2Printed circuit board comprising metal bumps integrated with connection padsAN JIN YONG·Filed 2009·Granted Jun 26, 2012·13 cites·5 claims
- 0382US7499258B2Embedded multilayer chip capacitor and printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Mar 3, 2009·13 cites·17 claims
- 0480US8209860B2Method of manufacturing printed circuit board having metal bumpAN JIN YONG·Filed 2009·Granted Jul 3, 2012·9 cites·8 claims
- 0570US7971352B2Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Jul 5, 2011·5 cites·11 claims
- 0660US8051559B2Method of manufacturing a multi-layer boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Nov 8, 2011·1 cites·6 claims
- 0757US8499444B2Method of manufacturing a package substrateAN JIN-YONG·Filed 2008·Granted Aug 6, 2013·1 cites·8 claims
- 0856US2010024212A1Method of fabricating multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0955US2010147559A1Carrier used in the manufacture of substrate and method of manufacturing substrate using the carrierSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1055US2011005824A1Printed circuit board and method of manufacturing the sameAN JIN YONG·Filed 2009·Application pending·0 cites
- 1154US8677618B2Method of manufacturing substrate using a carrierKIM KI HWAN·Filed 2011·Granted Mar 25, 2014·0 cites·3 claims
- 1253US2012210576A1Printed circuit board and method of manufacturing the sameAN JIN YONG·Filed 2012·Application pending·0 cites
- 1351US9021693B2Method of manufacturing printed circuit board with metal bumpAN JIN YONG·Filed 2012·Granted May 5, 2015·0 cites·5 claims
- 1451US2011079349A1Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1551US2010139969A1Printed circuit board comprising metal bump and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1651US2010126765A1Multi-layer printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1751US2010148348A1Package substrateSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1850US2011056614A1Manufacturing method of circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1949US2011018123A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2049US2013313004A1Package substrateSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2148US2009073670A1Multilayered printed circuit board and fabricating method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2246US2012211464A1Method of manufacturing printed circuit board having metal bumpAN JIN YONG·Filed 2012·Application pending·0 cites
- 2346US2009084494A1Substrate manufacturing methodSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2445US2009038837A1Multilayered printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2543US2007281390A1Manufacturing method of a package substrateSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 2629US5345293AFeeder of continuous documents for a copy machineSINDO RICOH CO LTD·Filed 1993·Granted Sep 6, 1994·2 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →