Inventor · disambiguated record
Wei-Yung Hsu
Also filed as: HSU WEI-YUNG
50 granted patents·48 pending applications·1,474 citations·filing 1994–2012
99Inventor score
Top patents by PatentIndex Score
98 records- 0196US6811680B2Planarization of substrates using electrochemical mechanical polishingAPPLIED MATERIALS INC·Filed 2002·Granted Nov 2, 2004·102 cites·36 claims
- 0293US7993485B2Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2005·Granted Aug 9, 2011·24 cites·23 claims
- 0392US8043870B2CMP pad thickness and profile monitoring systemAPPLIED MATERIALS INC·Filed 2009·Granted Oct 25, 2011·18 cites·20 claims
- 0492US7175505B1Method for adjusting substrate processing times in a substrate polishing systemAPPLIED MATERIALS INC·Filed 2006·Granted Feb 13, 2007·21 cites·23 claims
- 0592US6884724B2Method for dishing reduction and feature passivation in polishing processesAPPLIED MATERIALS INC·Filed 2001·Granted Apr 26, 2005·50 cites·31 claims
- 0692US5796151ASemiconductor stack having a dielectric sidewall for prevention of oxidation of tungsten in tungsten capped poly-silicon gate electrodesTEXAS INSTRUMENTS INC·Filed 1996·Granted Aug 18, 1998·112 cites·7 claims
- 0791US7323416B2Method and composition for polishing a substrateAPPLIED MATERIALS INC·Filed 2005·Granted Jan 29, 2008·20 cites·20 claims
- 0887US6143645AReduced temperature contact/via fillingTEXAS INSTRUMENTS INC·Filed 1998·Granted Nov 7, 2000·77 cites·12 claims
- 0986US6077774AMethod of forming ultra-thin and conformal diffusion barriers encapsulating copperTEXAS INSTRUMENTS INC·Filed 1997·Granted Jun 20, 2000·82 cites·20 claims
- 1085US6008117AMethod of forming diffusion barriers encapsulating copperTEXAS INSTRUMENTS INC·Filed 1997·Granted Dec 28, 1999·78 cites·10 claims
- 1184US6100188AStable and low resistance metal/barrier/silicon stack structure and related process for manufacturingTEXAS INSTRUMENTS INC·Filed 1998·Granted Aug 8, 2000·55 cites·27 claims
- 1283US6245605B1Method to protect metal from oxidation during poly-metal gate formation in semiconductor device manufacturingTEXAS INSTRUMENTS INC·Filed 1999·Granted Jun 12, 2001·62 cites·15 claims
- 1383US6207561B1Selective oxidation methods for metal oxide deposition on metals in capacitor fabricationTEXAS INSTRUMENTS INC·Filed 1999·Granted Mar 27, 2001·62 cites·18 claims
- 1480US6184129B1Low resistivity poly-silicon gate produced by selective metal growthTEXAS INSTRUMENTS INC·Filed 1999·Granted Feb 6, 2001·43 cites·20 claims
- 1580US5528153AMethod for non-destructive, non-contact measurement of dielectric constant of thin filmsTEXAS INSTRUMENTS INC·Filed 1994·Granted Jun 18, 1996·68 cites·4 claims
- 1679US5573979ASloped storage node for a 3-D dram cell structureTEXAS INSTRUMENTS INC·Filed 1995·Granted Nov 12, 1996·56 cites·19 claims
- 1778US7520795B2Grooved retaining ringAPPLIED MATERIALS INC·Filed 2006·Granted Apr 21, 2009·8 cites·15 claims
- 1877US5892282ABarrier-less plug structureTEXAS INSTRUMENTS INC·Filed 1996·Granted Apr 6, 1999·46 cites·8 claims
- 1976US6334249B2Cavity-filling method for reducing surface topography and roughnessTEXAS INSTRUMENTS INC·Filed 1998·Granted Jan 1, 2002·48 cites·6 claims
- 2074US6689686B2System and method for electroplating fine geometriesTEXAS INSTRUMENTS INC·Filed 2002·Granted Feb 10, 2004·8 cites·9 claims
- 2174US6677239B2Methods and compositions for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2001·Granted Jan 13, 2004·16 cites·33 claims
- 2273US7037174B2Methods for reducing delamination during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2003·Granted May 2, 2006·15 cites·31 claims
- 2373US6811470B2Methods and compositions for chemical mechanical polishing shallow trench isolation substratesAPPLIED MATERIALS INC·Filed 2002·Granted Nov 2, 2004·20 cites·58 claims
- 2472US6194313B1Method for reducing recess for the formation of local interconnect and or plug trench fill for etchback processTEXAS INSTRUMENTS INC·Filed 1998·Granted Feb 27, 2001·41 cites·14 claims
- 2571US8012000B2Extended pad life for ECMP and barrier removalAPPLIED MATERIALS INC·Filed 2007·Granted Sep 6, 2011·2 cites·20 claims
- 2671US6573167B2Using a carbon film as an etch hardmask for hard-to-etch materialsTEXAS INSTRUMENTS INC·Filed 2001·Granted Jun 3, 2003·13 cites·19 claims
- 2770US6150252AMulti-stage semiconductor cavity filling processTEXAS INSTRUMENTS INC·Filed 1996·Granted Nov 21, 2000·38 cites·10 claims
- 2870US6054382AMethod of improving texture of metal films in semiconductor integrated circuitsTEXAS INSTRUMENTS INC·Filed 1997·Granted Apr 25, 2000·36 cites·15 claims
- 2969US7244168B2Methods for reducing delamination during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Jul 17, 2007·3 cites·20 claims
- 3068US8910644B2Method and apparatus for inducing turbulent flow of a processing chamber cleaning gasCHUNG HUA·Filed 2011·Granted Dec 16, 2014·2 cites·14 claims
- 3168US6680249B2Si-rich surface layer capped diffusion barriersTEXAS INSTRUMENTS INC·Filed 2002·Granted Jan 20, 2004·14 cites·10 claims
- 3265US6323553B1Reduced temperature contact/via fillingTEXAS INSTRUMENTS INC·Filed 1999·Granted Nov 27, 2001·25 cites·4 claims
- 3364USD664170SCleaning plate for inducing turbulent flow of a processing chamber cleaning glassCHUNG HUA·Filed 2011·Granted Jul 24, 2012·14 cites·1 claims
- 3464US7390429B2Method and composition for electrochemical mechanical polishing processingAPPLIED MATERIALS INC·Filed 2005·Granted Jun 24, 2008·3 cites·13 claims
- 3564US5985763AMethod for producing barrier-less plug structuresTEXAS INSTRUMENTS INC·Filed 1997·Granted Nov 16, 1999·26 cites·18 claims
- 3663US7749048B2Polishing pad conditioning processAPPLIED MATERIALS INC·Filed 2007·Granted Jul 6, 2010·2 cites·11 claims
- 3761US5998296AMethod of forming contacts and vias in semiconductorTEXAS INSTRUMENTS INC·Filed 1997·Granted Dec 7, 1999·28 cites·20 claims
- 3860US6077782AMethod to improve the texture of aluminum metallizationTEXAS INSTRUMENTS INC·Filed 1998·Granted Jun 20, 2000·25 cites·14 claims
- 3959US6120842ATiN+Al films and processesTEXAS INSTRUMENTS INC·Filed 1997·Granted Sep 19, 2000·22 cites·10 claims
- 4057US2009038642A1Methods and apparatus for cleaning an edge of a substrateAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 4156US6896776B2Method and apparatus for electro-chemical processingAPPLIED MATERIALS INC·Filed 2000·Granted May 24, 2005·4 cites·27 claims
- 4256US6245672B1Method of forming diffusion barriers for copper metallization in integrated cirucitsTEXAS INSTRUMENTS INC·Filed 1998·Granted Jun 12, 2001·20 cites·28 claims
- 4355US6911689B2Versatile system for chromium based diffusion barriers in electrode structuresTEXAS INSTRUMENTS INC·Filed 2002·Granted Jun 28, 2005·4 cites·3 claims
- 4455US2009314752A1In-situ monitoring for laser ablationAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 4553US2009036033A1Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 4653US2009017731A1Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 4753US2009029629A1Methods and apparatus for polishing an edge of a substrateAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 4853US2009255911A1Laser scribing platform and hybrid writing strategyAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 4953US2009036042A1Methods and apparatus for polishing an edge of a substrateAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 5052US2007215488A1Methods and apparatus for electroprocessing with recessed bias contactAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
Showing the top 50 of 98 patent records by PatentIndex Score.
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