Inventor · disambiguated record
David W. Groechel
Also filed as: GROECHEL DAVID · GROECHEL DAVID W
44 granted patents·10 pending applications·3,622 citations·filing 1990–2024
99Inventor score
Top patents by PatentIndex Score
54 records- 0198US6054013AParallel plate electrode plasma reactor having an inductive antenna and adjustable radial distribution of plasma ion densityAPPLIED MATERIALS INC·Filed 1996·Granted Apr 25, 2000·596 cites·19 claims
- 0297US6518195B1Plasma reactor using inductive RF coupling, and processesAPPLIED MATERIALS INC·Filed 2000·Granted Feb 11, 2003·162 cites·8 claims
- 0397US5556501ASilicon scavenger in an inductively coupled RF plasma reactorAPPLIED MATERIALS INC·Filed 1993·Granted Sep 17, 1996·396 cites·15 claims
- 0496US6488807B1Magnetic confinement in a plasma reactor having an RF bias electrodeAPPLIED MATERIALS INC·Filed 2000·Granted Dec 3, 2002·145 cites·6 claims
- 0596US6077384APlasma reactor having an inductive antenna coupling power through a parallel plate electrodeAPPLIED MATERIALS INC·Filed 1996·Granted Jun 20, 2000·237 cites·67 claims
- 0695US6623596B1Plasma reactor having an inductive antenna coupling power through a parallel plate electrodeAPPLIED MATERIALS INC·Filed 2000·Granted Sep 23, 2003·84 cites·136 claims
- 0795US5888414APlasma reactor and processes using RF inductive coupling and scavenger temperature controlAPPLIED MATERIALS INC·Filed 1997·Granted Mar 30, 1999·203 cites·31 claims
- 0895US5477975APlasma etch apparatus with heated scavenging surfacesAPPLIED MATERIALS INC·Filed 1993·Granted Dec 26, 1995·86 cites·49 claims
- 0995US5423945ASelectivity for etching an oxide over a nitrideAPPLIED MATERIALS INC·Filed 1992·Granted Jun 13, 1995·220 cites·22 claims
- 1093US6545420B1Plasma reactor using inductive RF coupling, and processesAPPLIED MATERIALS INC·Filed 1995·Granted Apr 8, 2003·135 cites·13 claims
- 1193US6068784AProcess used in an RF coupled plasma reactorAPPLIED MATERIALS INC·Filed 1993·Granted May 30, 2000·173 cites·28 claims
- 1292US6444137B1Method for processing substrates using gaseous silicon scavengerAPPLIED MATERIALS INC·Filed 1996·Granted Sep 3, 2002·127 cites·19 claims
- 1392US6251792B1Plasma etch processesAPPLIED MATERIALS INC·Filed 1997·Granted Jun 26, 2001·122 cites·18 claims
- 1490US6524432B1Parallel-plate electrode plasma reactor having an inductive antenna and adjustable radial distribution of plasma ion densityAPPLIED MATERIALS INC·Filed 2000·Granted Feb 25, 2003·49 cites·72 claims
- 1590US6024826APlasma reactor with heated source of a polymer-hardening precursor materialAPPLIED MATERIALS INC·Filed 1996·Granted Feb 15, 2000·100 cites·68 claims
- 1689US6053801ASubstrate polishing with reduced contaminationAPPLIED MATERIALS INC·Filed 1999·Granted Apr 25, 2000·58 cites·17 claims
- 1788US5292399APlasma etching apparatus with conductive means for inhibiting arcingAPPLIED MATERIALS INC·Filed 1992·Granted Mar 8, 1994·123 cites·33 claims
- 1886US6399514B1High temperature silicon surface providing high selectivity in an oxide etch processAPPLIED MATERIALS INC·Filed 2000·Granted Jun 4, 2002·30 cites·23 claims
- 1985US6468136B1Tungsten CMP with improved alignment mark integrity, reduced edge residue, and reduced retainer ring notchingAPPLIED MATERIALS INC·Filed 2000·Granted Oct 22, 2002·30 cites·21 claims
- 2085US6238588B1High pressure high non-reactive diluent gas content high plasma ion density plasma oxide etch processAPPLIED MATERIALS INC·Filed 1996·Granted May 29, 2001·84 cites·24 claims
- 2185US6218312B1Plasma reactor with heated source of a polymer-hardening precursor materialAPPLIED MATERIALS INC·Filed 1998·Granted Apr 17, 2001·61 cites·36 claims
- 2283US6440866B1Plasma reactor with heated source of a polymer-hardening precursor materialAPPLIED MATERIALS INC·Filed 2000·Granted Aug 27, 2002·22 cites·101 claims
- 2381US5770099APlasma etch apparatus with heated scavenging surfacesAPPLIED MATERIALS INC·Filed 1995·Granted Jun 23, 1998·54 cites·49 claims
- 2480US12131934B2Semiconductor substrate support leveling apparatusAPPLIED MATERIALS INC·Filed 2020·Granted Oct 29, 2024·1 cites·7 claims
- 2578US5021121AProcess for RIE etching silicon dioxideAPPLIED MATERIALS INC·Filed 1990·Granted Jun 4, 1991·75 cites·20 claims
- 2677US2023047031A1Method for fabricating chamber partsAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2775US5308417AUniformity for magnetically enhanced plasma chambersAPPLIED MATERIALS INC·Filed 1991·Granted May 3, 1994·63 cites·14 claims
- 2874US10857625B2Texturizing a surface without bead blastingAPPLIED MATERIALS INC·Filed 2019·Granted Dec 8, 2020·0 cites·20 claims
- 2973US5925212AApparatus and method for attaining repeatable temperature versus time profiles for plasma heated interactive parts used in mass production plasma processingAPPLIED MATERIALS INC·Filed 1995·Granted Jul 20, 1999·43 cites·31 claims
- 3072US12318868B2Texturizing a surface without bead blastingAPPLIED MATERIALS INC·Filed 2020·Granted Jun 3, 2025·0 cites·18 claims
- 3172US11519071B2Method for fabricating chamber partsAPPLIED MATERIALS INC·Filed 2020·Granted Dec 6, 2022·0 cites·20 claims
- 3272US6194325B1Oxide etch process with high selectivity to nitride suitable for use on surfaces of uneven topographyAPPLIED MATERIALS INC·Filed 1995·Granted Feb 27, 2001·41 cites·32 claims
- 3372US2025054797A1Semiconductor substrate support leveling apparatusAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3471US6036877APlasma reactor with heated source of a polymer-hardening precursor materialAPPLIED MATERIALS INC·Filed 1996·Granted Mar 14, 2000·30 cites·71 claims
- 3571US2025215560A1Systems and methods for removal of residue coating deposited on metallic parts during processingASM IP HOLDING BV·Filed 2024·Application pending·0 cites
- 3670US5990017APlasma reactor with heated source of a polymer-hardening precursor materialAPPLIED MATERIALS INC·Filed 1998·Granted Nov 23, 1999·32 cites·27 claims
- 3769US10434604B2Texturizing a surface without bead blastingAPPLIED MATERIALS INC·Filed 2018·Granted Oct 8, 2019·0 cites·13 claims
- 3864US6083412APlasma etch apparatus with heated scavenging surfacesAPPLIED MATERIALS INC·Filed 1998·Granted Jul 4, 2000·13 cites·33 claims
- 3963US11378511B2Methods and apparatus for detecting corrosion of conductive objectsAPPLIED MATERIALS INC·Filed 2019·Granted Jul 5, 2022·0 cites·19 claims
- 4063US2025115995A1Mixing blocks for fluid systems, fixtures and fixture arrangements including mixing blocks, and methods of making mixing blocks for fluid systemsASM IP HOLDING BV·Filed 2024·Application pending·0 cites
- 4156US11261533B2Aluminum plating at low temperature with high efficiencyAPPLIED MATERIALS INC·Filed 2018·Granted Mar 1, 2022·0 cites·18 claims
- 4256US6171974B1High selectivity oxide etch process for integrated circuit structuresAPPLIED MATERIALS INC·Filed 1992·Granted Jan 9, 2001·23 cites·15 claims
- 4352US2019291214A1Laser polishing ceramic surfaces of processing components to be used in the manufacturing of semiconductor devicesAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 4451US11710647B2Hyperbaric clean method and apparatus for cleaning semiconductor chamber componentsAPPLIED MATERIALS INC·Filed 2021·Granted Jul 25, 2023·0 cites·15 claims
- 4548US11848218B2Semiconductor chamber component cleaning systemsAPPLIED MATERIALS INC·Filed 2020·Granted Dec 19, 2023·0 cites·11 claims
- 4648US2023023764A1Surface profiling and texturing of chamber componentsAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 4747US2018104767A1Texturizing a surface without bead blastAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 4846US7048607B1System and method for chemical mechanical planarizationAPPLIED MATERIALS INC·Filed 2000·Granted May 23, 2006·4 cites·23 claims
- 4945US11776822B2Wet cleaning of electrostatic chuckAPPLIED MATERIALS INC·Filed 2019·Granted Oct 3, 2023·0 cites·14 claims
- 5045US2021183657A1Surface profiling and texturing of chamber componentsAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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