Inventor · disambiguated record
Michael P. Toben
Also filed as: TOBEN MICHAEL · TOBEN MICHAEL P
24 granted patents·12 pending applications·359 citations·filing 1984–2015
96Inventor score
Top patents by PatentIndex Score
36 records- 0193US7968444B2Lead-free tin alloy electroplating compositions and methodsROHM & HAAS ELECT MAT·Filed 2009·Granted Jun 28, 2011·15 cites·8 claims
- 0293US6444110B2Electrolytic copper plating methodSHIPLEY CO LLC·Filed 1999·Granted Sep 3, 2002·86 cites·46 claims
- 0391US4628165AElectrical contacts and methods of making contacts by electrodepositionLEARONAL INC·Filed 1985·Granted Dec 9, 1986·48 cites·21 claims
- 0489US5174887AHigh speed electroplating of tinplateLEARONAL INC·Filed 1990·Granted Dec 29, 1992·56 cites·24 claims
- 0586US9114594B2High temperature resistant silver coated substratesZHANG-BEGLINGER WAN·Filed 2012·Granted Aug 25, 2015·4 cites·5 claims
- 0680US8920623B2Method for replenishing tin and its alloying metals in electrolyte solutionsLUO YU·Filed 2009·Granted Dec 30, 2014·2 cites·5 claims
- 0777US9228092B2Electrochemically deposited indium compositesROHM AND HAAS ELECTRONICS MATERIALS LLC·Filed 2013·Granted Jan 5, 2016·4 cites·8 claims
- 0875US6383269B1Electroless gold plating solution and processSHIPLEY CO LLC·Filed 2000·Granted May 7, 2002·14 cites·18 claims
- 0973US8460533B2Indium compositionsSZOCS EDIT·Filed 2007·Granted Jun 11, 2013·7 cites·7 claims
- 1073US6776828B2Plating compositionSHIPLEY CO LLC·Filed 2002·Granted Aug 17, 2004·15 cites·20 claims
- 1173US4994155AHigh speed tin, lead or tin/lead alloy electroplatingLEARONAL INC·Filed 1989·Granted Feb 19, 1991·21 cites·18 claims
- 1272US9303207B2Texturing of monocrystalline semiconductor substrates to reduce incident light reflectanceROHM & HAAS ELECT MAT·Filed 2014·Granted Apr 5, 2016·0 cites·2 claims
- 1372US4880507ATin, lead or tin/lead alloy electrolytes for high speed electroplatingLEARONAL INC·Filed 1988·Granted Nov 14, 1989·19 cites·31 claims
- 1465US8585885B2Electrochemically deposited indium compositesBRESE NATHANIEL E·Filed 2008·Granted Nov 19, 2013·4 cites·9 claims
- 1565US6210556B1Electrolyte and tin-silver electroplating processLEARONAL INC·Filed 1999·Granted Apr 3, 2001·32 cites·14 claims
- 1661US8765001B2Texturing of monocrystalline semiconductor substrates to reduce incident light reflectanceTOBEN MICHAEL P·Filed 2012·Granted Jul 1, 2014·0 cites·4 claims
- 1761US4545868APalladium platingLEARONAL INC·Filed 1984·Granted Oct 8, 1985·10 cites·15 claims
- 1859US2006065538A1Alloy composition and plating methodSHIPLEY CO LLC·Filed 2005·Application pending·0 cites
- 1958US7357853B2Electroplating composite substratesROHM & HAAS ELECT MAT·Filed 2004·Granted Apr 15, 2008·7 cites·16 claims
- 2057US2013228465A1Composites of carbon black and metalELECTRONIC MATERIALS LLC ROHM AND HAAS·Filed 2013·Application pending·0 cites
- 2156US2015292105A1Composites of carbon black and metalROHM & HAAS ELECT MAT·Filed 2015·Application pending·0 cites
- 2256US2015284864A1High temperature resistant silver coated substratesROHM & HAAS ELECT MAT·Filed 2015·Application pending·0 cites
- 2352US7695605B2Tin plating methodROHM & HAAS ELECT MAT·Filed 2004·Granted Apr 13, 2010·5 cites·7 claims
- 2449US9206519B2Indium compositionsROHM & HAAS ELECT MAT·Filed 2013·Granted Dec 8, 2015·0 cites·9 claims
- 2549US2006065537A1Electrolytic copper plating solutionsBARSTAD LEON R·Filed 2005·Application pending·0 cites
- 2647US4622110APalladium platingLEARONAL INC·Filed 1985·Granted Nov 11, 1986·6 cites·2 claims
- 2746US9145616B2Method of preventing silver tarnishingRohm and Haas Electroni Materials LLC·Filed 2013·Granted Sep 29, 2015·0 cites·8 claims
- 2842US2002187364A1Tin platingSHIPLEY CO LLC·Filed 2002·Application pending·0 cites
- 2941US4741818AAlkaline baths and methods for electrodeposition of palladium and palladium alloysLEARONAL INC·Filed 1987·Granted May 3, 1988·4 cites·46 claims
- 3041US2005133572A1Methods of forming solder areas on electronic components and electronic components having solder areasROHM & HAAS ELECT MAT·Filed 2004·Application pending·0 cites
- 3140US2006183328A1Electrolytic copper plating solutionsBARSTAD LEON R·Filed 2005·Application pending·0 cites
- 3240US2003010646A1Electrolytic copper plating solutionsFiled 2002·Application pending·0 cites
- 3339US2005139644A1Electronic devices and methods of forming electronic devicesROHM & HAAS ELECT MAT·Filed 2004·Application pending·0 cites
- 3439US2002166774A1Alloy composition and plating methodSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 3536US2003132416A1Stripping solutionSHIPLEY CO LLC·Filed 2002·Application pending·0 cites
- 3632US9365943B2Method of electroplating uniform copper layersNAJJAR ELIE H·Filed 2011·Granted Jun 14, 2016·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →