US2015284864A1PendingUtilityA1
High temperature resistant silver coated substrates
Est. expiryJul 26, 2031(~5 yrs left)· nominal 20-yr term from priority
B32B 15/018C25D 3/32C25D 3/30C25D 3/12C25D 5/12C25D 3/46C25D 5/627C25D 7/06B32B 15/01Y10T428/12715C23C 18/48C25D 3/60C23C 18/1644C23C 18/1671C23C 18/1653C23C 18/52C23C 28/023C23C 18/1651C23C 18/36C23C 18/34C22C 5/06C25D 3/562C22C 9/04
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Claims
Abstract
A thin film of tin is plated directly on nickel coating a metal substrate followed by plating silver directly on the thin film of tin. The silver has good adhesion to the substrate even at high temperatures.
Claims
exact text as granted — not AI-modified1 - 5 . (canceled)
7 . A method comprising:
a) providing a containing substrate comprising copper or copper alloy; b) depositing a nickel layer adjacent the copper or copper alloy of the substrate; c) depositing a tin layer adjacent the nickel layer; and d) depositing a silver layer adjacent the tin layer, the silver layer is at least twice the thickness of the tin layer.
8 . The method of claim 7 , wherein the silver is deposited from a cyanide containing bath.Join the waitlist — get patent alerts
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