Inventor · disambiguated record
Junko Izumitani
Also filed as: IZUMITANI JUNKO
21 granted patents·7 pending applications·268 citations·filing 1997–2021
94Inventor score
Files withMURATA MANUFACTURING CO10MITSUBISHI ELECTRIC CORP9RENESAS TECH CORP7RENESAS ELECTRONICS CORP1
Top patents by PatentIndex Score
28 records- 0193US6727590B2Semiconductor device with internal bonding padRENESAS TECH CORP·Filed 2002·Granted Apr 27, 2004·100 cites·8 claims
- 0293US6476491B2Semiconductor device having a multilayer wiring structure and pad electrodes protected from corrosion and method for fabricating the sameMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Nov 5, 2002·75 cites·13 claims
- 0392US11217395B2CapacitorMURATA MANUFACTURING CO·Filed 2019·Granted Jan 4, 2022·4 cites·10 claims
- 0481US11011548B2Electronic device and method of manufacturing the sameMURATA MANUFACTURING CO·Filed 2019·Granted May 18, 2021·3 cites·10 claims
- 0575US11101072B2Capacitor with limited substrate capacitanceMURATA MANUFACTURING CO·Filed 2018·Granted Aug 24, 2021·2 cites·14 claims
- 0675US6016562AInspection data analyzing apparatus for in-line inspection with enhanced display of inspection resultsMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Jan 18, 2000·49 cites·17 claims
- 0768US8008730B2Semiconductor device, and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2009·Granted Aug 30, 2011·4 cites·11 claims
- 0866US7423301B2Semiconductor device including fuse elements and bonding padRENESAS TECH CORP·Filed 2007·Granted Sep 9, 2008·2 cites·3 claims
- 0964US11587738B2CapacitorMURATA MANUFACTURING CO·Filed 2021·Granted Feb 21, 2023·0 cites·10 claims
- 1060US6500675B2Manufacturing method of semiconductor device having capacitive elementMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Dec 31, 2002·10 cites·5 claims
- 1155US11521800B2CapacitorMURATA MANUFACTURING CO·Filed 2019·Granted Dec 6, 2022·0 cites·15 claims
- 1254US7217965B2Semiconductor device including fuse elements and bonding padRENESAS TECH CORP·Filed 2003·Granted May 15, 2007·4 cites·7 claims
- 1354US2009001508A1Semiconductor device including fuse elements and bonding padRENESAS TECH CORP·Filed 2008·Application pending·0 cites
- 1452US11476055B2Thin film capacitor and method of manufacturing the sameMURATA MANUFACTURING CO·Filed 2019·Granted Oct 18, 2022·0 cites·17 claims
- 1552US7335537B2Method of manufacturing semiconductor device including bonding pad and fuse elementsRENESAS TECH CORP·Filed 2007·Granted Feb 26, 2008·0 cites·3 claims
- 1648US11232911B2CapacitorMURATA MANUFACTURING CO·Filed 2019·Granted Jan 25, 2022·0 cites·20 claims
- 1747US6890857B2Semiconductor device having a multilayer wiring structure and pad electrodes protected from corrosion, and method for fabricating the sameRENESAS TECH CORP·Filed 2002·Granted May 10, 2005·2 cites·2 claims
- 1845US6645863B2Method of manufacturing semiconductor device and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Nov 11, 2003·1 cites·15 claims
- 1944US2019074348A1CapacitorMURATA MANUFACTURING CO·Filed 2018·Application pending·0 cites
- 2043US11474063B2Semiconductor device having a porous metal oxide film and a semiconductor substrate with a connection electrically connected to the porous metal oxide filmMURATA MANUFACTURING CO·Filed 2020·Granted Oct 18, 2022·0 cites·8 claims
- 2141US6333259B1Semiconductor device and apparatus and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Dec 25, 2001·8 cites·5 claims
- 2239US10177289B2Mounting substrateMURATA MANUFACTURING CO·Filed 2017·Granted Jan 8, 2019·0 cites·12 claims
- 2338US2004157464A1Manufacturing method of electronic device having wiring connection structureRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 2435US2003109100A1Semiconductor device having capacitive element and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 2535US2003100177A1Method of manufacturing semiconductor deviceFiled 2002·Application pending·0 cites
- 2634US6476496B1Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Nov 5, 2002·4 cites·7 claims
- 2733US2002081836A1Contact structure, semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2001·Application pending·0 cites
- 2832US2004017279A1Wiring structureMITSUBISHI ELECTRIC CORP·Filed 2003·Application pending·0 cites
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