Inventor · disambiguated record
Jiunn-Yi Chu
Also filed as: CHU JIUNN-YI
17 granted patents·4 pending applications·164 citations·filing 2006–2014
94Inventor score
Files withSEMILEDS OPTOELECTRONICS CO6SEMILEDS OPTOELECTRONICS CO LT4CHU JIUNN-YI3FAN FENG-HSU3CHU CHEN-FU2
Top patents by PatentIndex Score
21 records- 0197US8871547B2Method for fabricating vertical light emitting diode (VLED) structure using a laser pulse to remove a carrier substrateSEMILEDS OPTOELECTRONICS CO·Filed 2014·Granted Oct 28, 2014·23 cites·17 claims
- 0297US7723718B1Epitaxial structure for metal devicesSEMILEDS OPTOELECTRONICS CO LT·Filed 2006·Granted May 25, 2010·29 cites·33 claims
- 0396US7687322B1Method for removing semiconductor street materialSEMILEDS OPTOELECTRONICS CO LT·Filed 2006·Granted Mar 30, 2010·22 cites·25 claims
- 0493US7759670B2Vertical LED with current guiding structureSEMILEDS OPTOELECTRONICS CO LT·Filed 2008·Granted Jul 20, 2010·24 cites·16 claims
- 0592US8685764B2Method to make low resistance contactCHU CHEN-FU·Filed 2007·Granted Apr 1, 2014·24 cites·12 claims
- 0690US8003994B2Vertical LED with current guiding structureSEMILEDS OPTOELECTRONICS CO·Filed 2010·Granted Aug 23, 2011·10 cites·27 claims
- 0789US8143112B1Method for removing semiconductor street materialDOAN TRUNG TRI·Filed 2010·Granted Mar 27, 2012·6 cites·25 claims
- 0886US8124454B1Die separationCHU CHEN-FU·Filed 2006·Granted Feb 28, 2012·6 cites·20 claims
- 0979US8686461B2Light emitting diode (LED) die having stepped substrates and method of fabricationCHU JIUNN-YI·Filed 2011·Granted Apr 1, 2014·5 cites·12 claims
- 1079US7829440B2Method of separating semiconductor diesSEMILEDS OPTOELECTRONICS CO LT·Filed 2007·Granted Nov 9, 2010·6 cites·46 claims
- 1174US8546818B2Vertical LED with current-guiding structureLIU WEN-HUANG·Filed 2012·Granted Oct 1, 2013·3 cites·9 claims
- 1270US9343620B2Method for fabricating a light emitting diode (LED) die having protective substrateSEMILEDS OPTOELECTRONICS CO·Filed 2014·Granted May 17, 2016·2 cites·14 claims
- 1367US8614449B1Protection for the epitaxial structure of metal devicesFAN FENG-HSU·Filed 2006·Granted Dec 24, 2013·2 cites·29 claims
- 1463US8703515B2Method for guiding current in a light emitting diode (LED) deviceSEMILEDS OPTOELECTRONICS CO·Filed 2013·Granted Apr 22, 2014·1 cites·8 claims
- 1562US8148733B2Vertical LED with current guiding structureLIU WEN-HUANG·Filed 2011·Granted Apr 3, 2012·1 cites·21 claims
- 1661US2014051197A1Method for fabricating a vertical light emitting diode (vled) die having epitaxial structure with protective layerSEMILEDS OPTOELECTRONICS CO·Filed 2013·Application pending·0 cites
- 1750US7892891B2Die separationSEMILEDS OPTOELECTRONICS CO·Filed 2006·Granted Feb 22, 2011·0 cites·21 claims
- 1845US2008087875A1Protection for the epitaxial structure of metal devicesFAN FENG-HSU·Filed 2006·Application pending·0 cites
- 1937US8759128B2Light emitting diode (LED) die having recessed electrode and light extraction structures and method of fabricationCHU JIUNN-YI·Filed 2012·Granted Jun 24, 2014·0 cites·4 claims
- 2036US2014151630A1Protection for the epitaxial structure of metal devicesFAN FENG-HSU·Filed 2012·Application pending·0 cites
- 2135US2012168714A1Vertical light emitting diode (vled) die and method of fabricationCHU JIUNN-YI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →