Assignee
CHU CHEN-FU
TW·17 granted patents·4 pending applications·106 citations·filing 2006–2022
Top patents by PatentIndex Score
21 records- 0192US10170671B2Methods of filling a flowable material in a gap of an assembly moduleCHU CHEN FU·Filed 2017·Granted Jan 1, 2019·5 cites·12 claims
- 0292US8685764B2Method to make low resistance contactCHU CHEN-FU·Filed 2007·Granted Apr 1, 2014·24 cites·12 claims
- 0392US8507302B1Wall structures for a semiconductor waferCHU CHEN-FU·Filed 2006·Granted Aug 13, 2013·11 cites·34 claims
- 0486US8124454B1Die separationCHU CHEN-FU·Filed 2006·Granted Feb 28, 2012·6 cites·20 claims
- 0578US2023101190A1Semiconductor continuous array layerCHU CHEN FU·Filed 2022·Application pending·0 cites
- 0675US8283652B2Vertical light emitting diode (VLED) die having electrode frame and method of fabricationCHU CHEN-FU·Filed 2010·Granted Oct 9, 2012·2 cites·23 claims
- 0771US2021273146A1Semiconductor continuous array layerCHU CHEN FU·Filed 2021·Application pending·0 cites
- 0870US8802469B2Method of fabricating semiconductor die using handling layerCHU CHEN-FU·Filed 2011·Granted Aug 12, 2014·1 cites·37 claims
- 0965US11005018B2Semiconductor continuous array layerCHU CHEN FU·Filed 2018·Granted May 11, 2021·0 cites·14 claims
- 1059USD684940SLED chipCHU CHEN-FU·Filed 2012·Granted Jun 25, 2013·10 cites·1 claims
- 1157USD684549SLED chipCHU CHEN-FU·Filed 2012·Granted Jun 18, 2013·9 cites·1 claims
- 1256US8466479B2Light emitting diodes (LEDs) with improved light extraction by rougheningCHU CHEN-FU·Filed 2011·Granted Jun 18, 2013·0 cites·20 claims
- 1350USD689834SLED chipCHU CHEN-FU·Filed 2012·Granted Sep 17, 2013·7 cites·1 claims
- 1449USD693779SLED chipCHU CHEN-FU·Filed 2012·Granted Nov 19, 2013·6 cites·1 claims
- 1549USD684548SLED chipCHU CHEN-FU·Filed 2012·Granted Jun 18, 2013·6 cites·1 claims
- 1648USD690670SLED chipCHU CHEN-FU·Filed 2012·Granted Oct 1, 2013·6 cites·1 claims
- 1748US2011042803A1Method For Fabricating A Through Interconnect On A Semiconductor SubstrateCHU CHEN-FU·Filed 2009·Application pending·0 cites
- 1846USD685334SLED chipCHU CHEN-FU·Filed 2012·Granted Jul 2, 2013·5 cites·1 claims
- 1943USD687395SLED chipCHU CHEN-FU·Filed 2012·Granted Aug 6, 2013·4 cites·1 claims
- 2043USD684941SLED chipCHU CHEN-FU·Filed 2012·Granted Jun 25, 2013·4 cites·1 claims
- 2142US2014048766A1Method for fabricating light emitting diode (led) dice using bond pad dam and wavelength conversion layersCHU CHEN-FU·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →