Inventor · disambiguated record
Mamoru Sawahata
Also filed as: SAWAHATA MAMORU
11 granted patents·1 pending application·677 citations·filing 1981–2003
93Inventor score
Top patents by PatentIndex Score
12 records- 0194US4825284ASemiconductor resin package structureHITACHI LTD·Filed 1986·Granted Apr 25, 1989·179 cites·20 claims
- 0289US6434008B1Semiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 13, 2002·84 cites·11 claims
- 0389US5956231ASemiconductor device having power semiconductor elementsHITACHI LTD·Filed 1995·Granted Sep 21, 1999·85 cites·20 claims
- 0487US4970575ASemiconductor deviceHITACHI LTD·Filed 1990·Granted Nov 13, 1990·98 cites·11 claims
- 0583US5423931AMethod and apparatus for removing an electronic component from a boardHITACHI LTD·Filed 1993·Granted Jun 13, 1995·78 cites·13 claims
- 0678US4543573ADisplay panelHITACHI LTD·Filed 1982·Granted Sep 24, 1985·37 cites·11 claims
- 0773US5422516AElectronic parts loaded module including thermal stress absorbing projecting electrodesHITACHI LTD·Filed 1992·Granted Jun 6, 1995·51 cites·9 claims
- 0869US7141741B2Circuit boardHITACHI HARAMACHI ELECTRONICS·Filed 2003·Granted Nov 28, 2006·12 cites·1 claims
- 0968US6495924B2Semiconductor device, including an arrangement to provide a uniform press contact and converter using sameHITACHI LTD·Filed 1999·Granted Dec 17, 2002·34 cites·9 claims
- 1058US6686658B2Semiconductor device, including an arrangement to provide a uniform press contact and converter using sameHITACHI LTD·Filed 2002·Granted Feb 3, 2004·8 cites·5 claims
- 1144US4516149ASemiconductor device having ribbon electrode structure and method for fabricating the sameHITACHI LTD·Filed 1981·Granted May 7, 1985·11 cites·1 claims
- 1239US2003016502A1Semiconductor deviceFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →