Inventor · disambiguated record
Yoshihiko Koike
Also filed as: KOIKE YOSHIHIKO
26 granted patents·2 pending applications·685 citations·filing 1992–2012
97Inventor score
Top patents by PatentIndex Score
28 records- 0189US6434008B1Semiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 13, 2002·84 cites·11 claims
- 0289US5956231ASemiconductor device having power semiconductor elementsHITACHI LTD·Filed 1995·Granted Sep 21, 1999·85 cites·20 claims
- 0386US9000601B2Power semiconductor moduleAZUMA KATSUNORI·Filed 2012·Granted Apr 7, 2015·10 cites·4 claims
- 0486US5459655ANeutral-point clamped inverter device using semiconductor modulesHITACHI LTD·Filed 1992·Granted Oct 17, 1995·80 cites·5 claims
- 0585US5731970APower conversion device and semiconductor module suitable for use in the deviceHITACHI LTD·Filed 1995·Granted Mar 24, 1998·71 cites·9 claims
- 0683US5621243ASemiconductor device having thermal stress resistance structureHITACHI LTD·Filed 1994·Granted Apr 15, 1997·80 cites·32 claims
- 0779US5801936ASemiconductor module for a power conversion deviceHITACHI LTD·Filed 1995·Granted Sep 1, 1998·51 cites·19 claims
- 0878US5929519ASemiconductor module including switching device chips and diode chipsHITCHI LTD·Filed 1997·Granted Jul 27, 1999·49 cites·11 claims
- 0977US6630734B2Composite material, and manufacturing method and uses of sameHITACHI LTD·Filed 2002·Granted Oct 7, 2003·17 cites·16 claims
- 1072US6909185B1Composite material including copper and cuprous oxide and application thereofHITACHI LTD·Filed 1998·Granted Jun 21, 2005·22 cites·7 claims
- 1171US6441317B1Semiconductor module and inverter deviceHITACHI LTD·Filed 2000·Granted Aug 27, 2002·21 cites·12 claims
- 1269US7141741B2Circuit boardHITACHI HARAMACHI ELECTRONICS·Filed 2003·Granted Nov 28, 2006·12 cites·1 claims
- 1368US6833617B2Composite material including copper and cuprous oxide and application thereofHITACHI LTD·Filed 2003·Granted Dec 21, 2004·15 cites·12 claims
- 1464US6611056B2Composite material, and manufacturing method and uses of sameHITACHI LTD·Filed 2002·Granted Aug 26, 2003·8 cites·7 claims
- 1562US5446318ASemiconductor module with a plurality of power devices mounted on a support base with an improved heat sink/insulation plate arrangementHITACHI LTD·Filed 1993·Granted Aug 29, 1995·29 cites·26 claims
- 1660US6621328B2Semiconductor deviceFUJITSU LTD·Filed 2002·Granted Sep 16, 2003·7 cites·22 claims
- 1759US5585672ASemiconductor module with an improved heat sink/insulation plate arrangementHITACHI LTD·Filed 1995·Granted Dec 17, 1996·23 cites·10 claims
- 1857US8283763B2Power semiconductor module and fabrication method thereofOYAMA KAZUHIRO·Filed 2007·Granted Oct 9, 2012·1 cites·19 claims
- 1956US7454649B2Marginless status determination circuitFUJITSU LTD·Filed 2005·Granted Nov 18, 2008·2 cites·11 claims
- 2055US7091518B2Semiconductor deviceFUJITSU LTD·Filed 2005·Granted Aug 15, 2006·0 cites·26 claims
- 2155US6646344B1Composite material, and manufacturing method and uses of sameHITACHI LTD·Filed 2000·Granted Nov 11, 2003·4 cites·4 claims
- 2253US7135939B2Semiconductor device including an external oscillation circuitFUJITSU LTD·Filed 2004·Granted Nov 14, 2006·3 cites·14 claims
- 2349US7424383B2Abnormality detection device for detecting an abnormality in a communication busFUJITSU LTD·Filed 2001·Granted Sep 9, 2008·3 cites·9 claims
- 2447US7174435B2Memory control circuit, memory device, and microcomputerFUJITSU LTD·Filed 2003·Granted Feb 6, 2007·1 cites·13 claims
- 2544US8304889B2Power semiconductor module and fabrication method thereofOYAMA KAZUHIRO·Filed 2010·Granted Nov 6, 2012·0 cites·13 claims
- 2641US2004031545A1Composite material, and manufacturing method and uses of sameFiled 2003·Application pending·0 cites
- 2739US2003016502A1Semiconductor deviceFiled 2002·Application pending·0 cites
- 2835US6321280B1System LSI having communication functionFUJITSU LTD·Filed 1999·Granted Nov 20, 2001·7 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →