Inventor · disambiguated record
Yasushi Mizusawa
Also filed as: MIZUSAWA YASUSHI
30 granted patents·18 pending applications·187 citations·filing 1999–2022
96Inventor score
Top patents by PatentIndex Score
48 records- 0198US7959985B2Method of integrating PEALD Ta-containing films into Cu metallizationTOKYO ELECTRON LTD·Filed 2006·Granted Jun 14, 2011·61 cites·34 claims
- 0296US9896761B2Trap assembly in film forming apparatusTOKYO ELECTRON LTD·Filed 2014·Granted Feb 20, 2018·15 cites·18 claims
- 0392US8268078B2Method and apparatus for reducing particle contamination in a deposition systemSUZUKI KENJI·Filed 2006·Granted Sep 18, 2012·14 cites·18 claims
- 0487US8399353B2Methods of forming copper wiring and copper film, and film forming systemISHIZAKA TADAHIRO·Filed 2011·Granted Mar 19, 2013·9 cites·13 claims
- 0583US10643908B2Manufacturing method and evaluation method of silicon epitaxial waferSHINETSU HANDOTAI KK·Filed 2016·Granted May 5, 2020·3 cites·1 claims
- 0683US8440563B2Film forming method and processing systemMATSUMOTO KENJI·Filed 2011·Granted May 14, 2013·6 cites·20 claims
- 0780US8029873B2Film deposition method and film deposition apparatus of metal filmTOKYO ELECTRON LTD·Filed 2006·Granted Oct 4, 2011·7 cites·9 claims
- 0879US8026176B2Film forming method, plasma film forming apparatus and storage mediumTOKYO ELECTRON LTD·Filed 2007·Granted Sep 27, 2011·6 cites·12 claims
- 0978US7790626B2Plasma sputtering film deposition method and equipmentTOKYO ELECTRON LTD·Filed 2005·Granted Sep 7, 2010·8 cites·10 claims
- 1076US7935393B2Method and system for improving sidewall coverage in a deposition systemTOKYO ELECTRON LTD·Filed 2007·Granted May 3, 2011·3 cites·20 claims
- 1175US8372739B2Diffusion barrier for integrated circuits formed from a layer of reactive metal and method of fabricationTOKYO ELECTRON LTD·Filed 2007·Granted Feb 12, 2013·8 cites·27 claims
- 1274US7799681B2Method for forming a ruthenium metal cap layerTOKYO ELECTRON LTD·Filed 2008·Granted Sep 21, 2010·4 cites·24 claims
- 1373US8859422B2Method of forming copper wiring and method and system for forming copper filmISHIZAKA TADAHIRO·Filed 2012·Granted Oct 14, 2014·3 cites·26 claims
- 1471US9576850B2Method for manufacturing semiconductor deviceTOKYO ELECTRON LTD·Filed 2013·Granted Feb 21, 2017·2 cites·7 claims
- 1571US8992686B2Mounting table structure, film forming apparatus and raw material recovery methodGOMI ATSUSHI·Filed 2011·Granted Mar 31, 2015·3 cites·41 claims
- 1667US9976217B2Film forming method using reversible decomposition reactionTOKYO ELECTRON LTD·Filed 2014·Granted May 22, 2018·1 cites·4 claims
- 1764US8277889B2Film formation method and film formation apparatusGOMI ATSUSHI·Filed 2008·Granted Oct 2, 2012·2 cites·4 claims
- 1861US8043871B2Method for forming oxide film on silicon waferSHINETSU HANDOTAI KK·Filed 2009·Granted Oct 25, 2011·1 cites·19 claims
- 1961US2012315404A1Apparatus for thermal and plasma enhanced vapor deposition and method of operatingLI YICHENG·Filed 2012·Application pending·0 cites
- 2060US11205599B2Evaluation method of silicon epitaxial waferSHINETSU HANDOTAI KK·Filed 2020·Granted Dec 21, 2021·0 cites·1 claims
- 2158US6451682B1Method of forming interconnect filmULVAC INC·Filed 1999·Granted Sep 17, 2002·26 cites·11 claims
- 2257US2007116872A1Apparatus for thermal and plasma enhanced vapor deposition and method of operatingTOKYO ELECTRON LTD·Filed 2005·Application pending·0 cites
- 2355US8034406B2Integrated substrate processing in a vacuum processing toolTOKYO ELECTRON LTD·Filed 2006·Granted Oct 11, 2011·0 cites·17 claims
- 2455US2011263123A1Placing table structureTOKYO ELECTRON LTD·Filed 2009·Application pending·0 cites
- 2554US11175231B2Method for evaluating carbon concentrationSHINETSU HANDOTAI KK·Filed 2019·Granted Nov 16, 2021·0 cites·8 claims
- 2654US9062374B2Method for film formation, apparatus for film formation, and computer-readable recording mediumHARA MASAMICHI·Filed 2009·Granted Jun 23, 2015·0 cites·12 claims
- 2754US2024395563A1Epitaxial wafer and production method thereforSHINETSU HANDOTAI KK·Filed 2022·Application pending·0 cites
- 2853US2013081938A1Magnetron sputtering apparatus and methodMIZUNO SHIGERU·Filed 2012·Application pending·0 cites
- 2952US2014287163A1Method of forming copper wiring and method and system for forming copper filmTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 3051US2007234955A1Method and apparatus for reducing carbon monoxide poisoning at the peripheral edge of a substrate in a thin film deposition systemTOKYO ELECTRON LTD·Filed 2006·Application pending·0 cites
- 3151US2007218200A1Method and apparatus for reducing particle formation in a vapor distribution systemSUZUKI KENJI·Filed 2006·Application pending·0 cites
- 3249US8273409B2Method for film formation, apparatus for film formation, and computer-readable recording mediumHARA MASAMICHI·Filed 2011·Granted Sep 25, 2012·0 cites·5 claims
- 3347US9064690B2Method for forming Cu wiringTOKYO ELECTRON LTD·Filed 2013·Granted Jun 23, 2015·0 cites·7 claims
- 3447US2014346037A1Sputter deviceTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 3546US8999841B2Semiconductor device manufacturing methodISHIZAKA TADAHIRO·Filed 2012·Granted Apr 7, 2015·0 cites·3 claims
- 3646US8408025B2Raw material recovery method and trapping mechanism for recovering raw materialGOMI ATSUSHI·Filed 2009·Granted Apr 2, 2013·0 cites·15 claims
- 3744US10734220B2Method for manufacturing silicon epitaxial wafer and method for manufacturing semiconductor deviceSHINETSU HANDOTAI KK·Filed 2017·Granted Aug 4, 2020·0 cites·16 claims
- 3843US2014030886A1Method for forming copper wiringTOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
- 3942US8962352B2Method for calculating warpage of bonded SOI wafer and method for manufacturing bonded SOI waferYOKOKAWA ISAO·Filed 2012·Granted Feb 24, 2015·0 cites·8 claims
- 4042US2008200002A1Plasma Sputtering Film Deposition Method and EquipmentTOKYO ELECTRON LTD·Filed 2005·Application pending·0 cites
- 4142US2009087583A1Film Deposition Method, Film Deposition Apparatus, and Storage MediumSAKUMA TAKASHI·Filed 2007·Application pending·0 cites
- 4242US2009183984A1Seed Film Forming Method, Plasma-Assisted Film Forming System and Storage MediumSAKUMA TAKASHI·Filed 2007·Application pending·0 cites
- 4342US2007116873A1Apparatus for thermal and plasma enhanced vapor deposition and method of operatingTOKYO ELECTRON LTD·Filed 2005·Application pending·0 cites
- 4440US2013237053A1Film forming method and film forming apparatusISHIZAKA TADAHIRO·Filed 2011·Application pending·0 cites
- 4538US2012014768A1Vacuum processing apparatusMIYASHITA TETSUYA·Filed 2011·Application pending·0 cites
- 4636US2012064717A1Method for forming cvd-ru film and method for manufacturing semiconductor devicesKATO TAKARA·Filed 2011·Application pending·0 cites
- 4735US6299739B1Method of forming metal wiring filmKOBE STEEL LTD·Filed 1999·Granted Oct 9, 2001·5 cites·6 claims
- 4834US2012222782A1METHOD FOR FORMING Cu WIRINGGOMI ATSUSHI·Filed 2010·Application pending·0 cites
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