Inventor · disambiguated record
Kenneth F. Mcavey, Jr.
Also filed as: MCAVEY JR KENNETH F · MCAVEY KENNETH F
8 granted patents·2 pending applications·63 citations·filing 2000–2013
83Inventor score
Top patents by PatentIndex Score
10 records- 0191US6776171B2Cleaning of semiconductor wafers by contaminate encapsulationIBM·Filed 2001·Granted Aug 17, 2004·43 cites·7 claims
- 0272US7176119B2Method of fabricating copper damascene and dual damascene interconnect wiringIBM·Filed 2004·Granted Feb 13, 2007·13 cites·25 claims
- 0368US8536035B2Silicon-on-insulator substrate and method of formingBOTULA ALAN B·Filed 2012·Granted Sep 17, 2013·2 cites·19 claims
- 0464US9716010B2Handle waferIBM·Filed 2013·Granted Jul 25, 2017·1 cites·12 claims
- 0562US8912091B2Backside metal ground plane with improved metal adhesion and design structuresIBM·Filed 2013·Granted Dec 16, 2014·1 cites·23 claims
- 0651US10163673B2Dual adhesive bonding with perforated waferGLOBALFOUNDRIES INC·Filed 2013·Granted Dec 25, 2018·0 cites·17 claims
- 0745US7531059B2Cleaning of semiconductor wafers by contaminate encapsulationIBM·Filed 2004·Granted May 12, 2009·0 cites·5 claims
- 0845US6939408B1Method for surface preparation of workpieces utilizing fluid separation techniquesIBM·Filed 2000·Granted Sep 6, 2005·3 cites·4 claims
- 0942US2014225231A1Modulating bow of thin wafersIBM·Filed 2013·Application pending·0 cites
- 1041US2014138844A1Patterned backside metal ground plane for improved metal adhesionIBM·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →