Inventor · disambiguated record
Roman Gouk
Also filed as: GOUK ROMAN
49 granted patents·25 pending applications·167 citations·filing 2002–2025
97Inventor score
Files withAPPLIED MATERIALS INC56GOUK ROMAN6LESCHKIES KURTIS3HILKENE MARTIN A2BENCHER CHRISTOPHER D1
Top patents by PatentIndex Score
74 records- 0198US10229827B2Method of redistribution layer formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2017·Granted Mar 12, 2019·33 cites·13 claims
- 0298US10211072B2Method of reconstituted substrate formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2017·Granted Feb 19, 2019·37 cites·17 claims
- 0393US10937726B1Package structure with embedded coreAPPLIED MATERIALS INC·Filed 2020·Granted Mar 2, 2021·3 cites·20 claims
- 0491US11232951B1Method and apparatus for laser drilling blind viasAPPLIED MATERIALS INC·Filed 2020·Granted Jan 25, 2022·2 cites·22 claims
- 0591US10347511B2Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device STRAPPLIED MATERIALS INC·Filed 2017·Granted Jul 9, 2019·5 cites·15 claims
- 0687US8778816B2In situ vapor phase surface activation of SiO2SATO TATSUYA E·Filed 2011·Granted Jul 15, 2014·9 cites·19 claims
- 0785US10727083B1Method for via formation in flowable epoxy materials by micro-imprintAPPLIED MATERIALS INC·Filed 2019·Granted Jul 28, 2020·4 cites·20 claims
- 0885US8354035B2Method for removing implanted photo resist from hard disk drive substratesAPPLIED MATERIALS INC·Filed 2010·Granted Jan 15, 2013·4 cites·19 claims
- 0982US2025281998A1Method and apparatus for laser drilling blind viasAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1080US8586952B2Temperature control of a substrate during a plasma ion implantation process for patterned disc media applicationsHILKENE MARTIN A·Filed 2010·Granted Nov 19, 2013·5 cites·17 claims
- 1179US10304703B2Small thermal mass pressurized chamberAPPLIED MATERIALS INC·Filed 2016·Granted May 28, 2019·2 cites·11 claims
- 1279US10032624B2Substrate support and baffle apparatusAPPLIED MATERIALS INC·Filed 2016·Granted Jul 24, 2018·2 cites·18 claims
- 1379US9343664B2Pattern fortification for HDD bit patterned media pattern transferAPPLIED MATERIALS INC·Filed 2015·Granted May 17, 2016·2 cites·20 claims
- 1479US8986557B2HDD patterning using flowable CVD filmAPPLIED MATERIALS INC·Filed 2014·Granted Mar 24, 2015·4 cites·16 claims
- 1578US11281094B2Method for via formation by micro-imprintingAPPLIED MATERIALS INC·Filed 2018·Granted Mar 22, 2022·2 cites·17 claims
- 1678US9935004B2Process and chemistry of plating of through silicon viasAPPLIED MATERIALS INC·Filed 2016·Granted Apr 3, 2018·2 cites·20 claims
- 1777US8530356B2Method of BARC removal in semiconductor device manufacturingGOUK ROMAN·Filed 2011·Granted Sep 10, 2013·4 cites·16 claims
- 1877US7190103B2Matching circuit for megasonic transducer deviceAPPLIED MATERIALS INC·Filed 2005·Granted Mar 13, 2007·4 cites·8 claims
- 1975US8852962B2Apparatus and methods for silicon oxide CVD resist planarizationAPPLIED MATERIALS INC·Filed 2012·Granted Oct 7, 2014·3 cites·20 claims
- 2074US10573510B2Substrate support and baffle apparatusAPPLIED MATERIALS INC·Filed 2018·Granted Feb 25, 2020·1 cites·20 claims
- 2174US7718009B2Cleaning submicron structures on a semiconductor wafer surfaceAPPLIED MATERIALS INC·Filed 2004·Granted May 18, 2010·18 cites·19 claims
- 2274US7586235B2Matching circuit for megasonic transducer deviceAPPLIED MATERIALS INC·Filed 2007·Granted Sep 8, 2009·3 cites·8 claims
- 2373US12374611B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2021·Granted Jul 29, 2025·0 cites·24 claims
- 2473US11927885B2Fluoropolymer stamp fabrication methodAPPLIED MATERIALS INC·Filed 2022·Granted Mar 12, 2024·0 cites·14 claims
- 2573US11881447B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2021·Granted Jan 23, 2024·0 cites·18 claims
- 2673US10879116B2Method for copper plating through silicon vias using wet wafer back contactAPPLIED MATERIALS INC·Filed 2014·Granted Dec 29, 2020·2 cites·14 claims
- 2772US12358073B2Method and apparatus for laser drilling blind viasAPPLIED MATERIALS INC·Filed 2021·Granted Jul 15, 2025·0 cites·17 claims
- 2871US12087679B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2020·Granted Sep 10, 2024·0 cites·9 claims
- 2971US11798903B2Methods of forming microvias with reduced diameterAPPLIED MATERIALS INC·Filed 2022·Granted Oct 24, 2023·0 cites·19 claims
- 3071US8673162B2Methods for substrate surface planarization during magnetic patterning by plasma immersion ion implantationGOUK ROMAN·Filed 2010·Granted Mar 18, 2014·3 cites·10 claims
- 3169US8658242B2Resist fortification for magnetic media patterningBENCHER CHRISTOPHER D·Filed 2011·Granted Feb 25, 2014·2 cites·16 claims
- 3267US10777405B2Drying process for high aspect ratio featuresAPPLIED MATERIALS INC·Filed 2016·Granted Sep 15, 2020·1 cites·17 claims
- 3367US10354892B2Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device structuresAPPLIED MATERIALS INC·Filed 2013·Granted Jul 16, 2019·1 cites·15 claims
- 3467US6954021B2Matching circuit for megasonic transducer deviceAPPLIED MATERIALS INC·Filed 2002·Granted Oct 11, 2005·8 cites·13 claims
- 3566US10233538B2Demagnetization of magnetic media by C doping for HDD patterned media applicationAPPLIED MATERIALS INC·Filed 2016·Granted Mar 19, 2019·0 cites·20 claims
- 3665US11315890B2Methods of forming microvias with reduced diameterAPPLIED MATERIALS INC·Filed 2020·Granted Apr 26, 2022·0 cites·19 claims
- 3764US11862546B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2019·Granted Jan 2, 2024·0 cites·19 claims
- 3864US11011392B2Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device structuresAPPLIED MATERIALS INC·Filed 2019·Granted May 18, 2021·0 cites·17 claims
- 3964US9376746B2Demagnetization of magnetic media by C doping for HDD patterned media applicationHILKENE MARTIN A·Filed 2012·Granted Jun 28, 2016·0 cites·9 claims
- 4064US2022171281A1Method for via formation by micro-imprintingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 4161US11454884B2Fluoropolymer stamp fabrication methodAPPLIED MATERIALS INC·Filed 2020·Granted Sep 27, 2022·0 cites·20 claims
- 4260US8318589B2Method for forming transparent conductive oxideKOMIN VALERY V·Filed 2010·Granted Nov 27, 2012·1 cites·20 claims
- 4359US9646642B2Resist fortification for magnetic media patterningAPPLIED MATERIALS INC·Filed 2014·Granted May 9, 2017·0 cites·9 claims
- 4459US2019181019A1Method of reconstituted substrate formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 4558US11424137B2Drying process for high aspect ratio featuresAPPLIED MATERIALS INC·Filed 2019·Granted Aug 23, 2022·0 cites·20 claims
- 4657US2015295099A1High work-function buffer layers for silicon-based photovoltaic devicesLESCHKIES KURTIS·Filed 2013·Application pending·0 cites
- 4756US11133174B2Reduced volume processing chamberAPPLIED MATERIALS INC·Filed 2019·Granted Sep 28, 2021·0 cites·18 claims
- 4855US9660185B2Pattern fortification for HDD bit patterned media pattern transferAPPLIED MATERIALS INC·Filed 2016·Granted May 23, 2017·0 cites·20 claims
- 4955US2011011828A1Organically modified etch chemistry for zno tco texturingAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 5053US9490125B2Methods for forming a molecular dopant monolayer on a substrateAPPLIED MATERIALS INC·Filed 2014·Granted Nov 8, 2016·0 cites·18 claims
Showing the top 50 of 74 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →