Inventor · disambiguated record
Chang Hwa Chung
Also filed as: CHUNG CHANG HWA · CHUNG CHANG HWA TOM
17 granted patents·5 pending applications·338 citations·filing 1987–2010
95Inventor score
Files withHK APPLIED SCIENCE & TECH RES11MICROELECTRONICS & COMPUTER4LEUNG LAP-WAI LYDIA2SHI XUNQING2HONG KONG APPLIED SCIENCE TECH1
Top patents by PatentIndex Score
22 records- 0193US7683459B2Bonding method for through-silicon-via based 3D wafer stackingHK APPLIED SCIENCE & TECH RES·Filed 2008·Granted Mar 23, 2010·78 cites·15 claims
- 0292US8011237B2Piezoelectric module for energy harvesting, such as in a tire pressure monitoring systemHK APPLIED SCIENCE & TECH RES·Filed 2008·Granted Sep 6, 2011·27 cites·30 claims
- 0391US8194411B2Electronic package with stacked modules with channels passing through metal layers of the modulesLEUNG CHI KUEN VINCENT·Filed 2009·Granted Jun 5, 2012·43 cites·11 claims
- 0488US8674482B2Semiconductor chip with through-silicon-via and sidewall padSHI XUNQING·Filed 2008·Granted Mar 18, 2014·22 cites·16 claims
- 0587US7514774B2Stacked multi-chip package with EMI shieldingHONG KONG APPLIED SCIENCE TECH·Filed 2006·Granted Apr 7, 2009·27 cites·12 claims
- 0686US8030208B2Bonding method for through-silicon-via based 3D wafer stackingHK APPLIED SCIENCE & TECH RES·Filed 2008·Granted Oct 4, 2011·16 cites·11 claims
- 0778US4860088AElectrical interconnect tapeMICROELECTRONICS & COMPUTER·Filed 1987·Granted Aug 22, 1989·37 cites·8 claims
- 0876US7879438B2Substrate warpage-reducing structureHK APPLIED SCIENCE & TECH RES·Filed 2009·Granted Feb 1, 2011·5 cites·8 claims
- 0974US8138577B2Pulse-laser bonding method for through-silicon-via based stacking of electronic componentsSHI XUNQING·Filed 2008·Granted Mar 20, 2012·7 cites·26 claims
- 1074US7860634B2Method and apparatus for identification of wheels of a vehicle and a vehicle comprising sameHK APPLIED SCIENCE & TECH RES·Filed 2007·Granted Dec 28, 2010·4 cites·25 claims
- 1167US7832278B2Multi-chip packageHK APPLIED SCIENCE & TECH RES·Filed 2008·Granted Nov 16, 2010·4 cites·29 claims
- 1266US5041003AElectrical connector systemMICROELECTRONICS & COMPUTER·Filed 1990·Granted Aug 20, 1991·28 cites·23 claims
- 1365US8241966B2Methods of making an electronic component package and semiconductor chip packagesSHAM MAN-LUNG·Filed 2009·Granted Aug 14, 2012·3 cites·6 claims
- 1461US7902727B1Apparatus and method for generating electricity using piezoelectric materialHK APPLIED SCIENCE & TECH RES·Filed 2009·Granted Mar 8, 2011·3 cites·21 claims
- 1557US8031484B2IC packages with internal heat dissipation structuresHK APPLIED SCIENCE & TECH RES·Filed 2006·Granted Oct 4, 2011·1 cites·22 claims
- 1656US5036379AElectrical interconnect tapeMICROELECTRONICS & COMPUTER·Filed 1989·Granted Jul 30, 1991·16 cites·20 claims
- 1750US5049087AElectrical connector using flexible circuit tapeMICROELECTRONICS & COMPUTER·Filed 1990·Granted Sep 17, 1991·17 cites·12 claims
- 1846US2008067650A1Electronic component package with EMI shieldingHK APPLIED SCIENCE & TECH RES·Filed 2006·Application pending·0 cites
- 1945US2010249617A1Apparatus for determining blood pressureHK APPLIED SCIENCE & TECH RES·Filed 2009·Application pending·0 cites
- 2042US2009189269A1Electronic Circuit PackageLEUNG LAP-WAI LYDIA·Filed 2008·Application pending·0 cites
- 2142US2009115051A1Electronic Circuit PackageLEUNG LAP-WAI LYDIA·Filed 2007·Application pending·0 cites
- 2241US2011245627A1Electronic health record storage device, system, and methodHK APPLIED SCIENCE & TECH RES·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →