Assignee
SHI XUNQING
SG·2 granted patents·1 pending application·29 citations·filing 2008–2010
Top patents by PatentIndex Score
3 records- 0188US8674482B2Semiconductor chip with through-silicon-via and sidewall padSHI XUNQING·Filed 2008·Granted Mar 18, 2014·22 cites·16 claims
- 0274US8138577B2Pulse-laser bonding method for through-silicon-via based stacking of electronic componentsSHI XUNQING·Filed 2008·Granted Mar 20, 2012·7 cites·26 claims
- 0333US2011221018A1Electronic Device Package and Methods of Manufacturing an Electronic Device PackageSHI XUNQING·Filed 2010·Application pending·0 cites
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